Specification SIPLACE X-Series规格说明书1.pdf - 第13页

13 Placement Heads Standard Functions / Options 20-nozzle Collect & Place head 12-nozzle Collect & Place head S t andard- functions High-resolution head came ra, vacuum sensor , force measure- ment, component sen…

Placement Heads

Overview

Head Modularity

The SIPLACE X series is

characterized by maximum

flexibility in the production

process. This flexibility is

partly due to the head modu-

larity of the placement

machines as it allows differ-

ent placement head variants

to be configured to suit the

production requirements.

Collect&Place principle

The SIPLACE 20, 12 and 6-

nozzle Collect&Place heads

work on the Collect&Place

principle. This means that,

within each cycle, 20, 12 or 6

components are picked up

and “collected” by the place-

ment head, are optically cen-

tered on the way to the board

and are rotated into the

required placement angle.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Collect&Place principle

Pick&Place principle

The high-precision SIPLACE

TwinHead, which consists of

two Pick&Place placement

modules of the same design

coupled together, works on

the Pick&Place principle.

Two components are picked

up by the placement head,

optically centered on the way

to the placement position

and rotated into the neces-

sary placement angle. This

principle has proved particu-

larly suitable for fast and

accurate placement of spe-

cial components in the fine

pitch and super-fine pitch

range, and for complex and

heavy components that

require grippers, for

example.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor: It

checks for the presence of

a component at the nozzle

before and after the pick-

up and placement pro-

cess.

• Digital camera on the

placement head: Checks

the position of each com-

ponent at the nozzle. Any

deviations from the

required pick-up position

are corrected before

placement takes place.

• Force sensor: Monitors

the specified component

set-down forces. With the

sensor stop method, dif-

ferences in height during

pick-up and any uneven-

ness of the PCB surface

are compensated during

placement.

• Vacuum sensor: Checks

whether the component

was picked up or set down

correctly.

Placement Heads

Standard Functions / Options

20-nozzle Collect&Place head 12-nozzle Collect&Place head

Standard-

functions

High-resolution head camera,

vacuum sensor, force measure-

ment, component sensor, inte-

grated turning station for each

segment, PCB warpage check,

individual recording for each

component

Standard-

functions

Head camera, vacuum sensor,

force measurement, PCB war-

page, check, individual record-

ing for each component

Options Nozzle changer, special nozzles Options High-resolution camera, com-

ponent sensor, short nozzle

short sleeve

, nozzle changers,

special nozzles

a) With SIPLACE HF component changeover table only.

6-nozzle Collect&Place head TwinHead

Standard

functions

High-resolution head camera,

vacuum sensor, force measure-

ment, PCB warpage, check, indi-

vidual recording for each

component

Standard

functions

Stationary fine-pitch camera,

vacuum sensor, force sensor,

nozzle changer, PCB warpage

check, individual recording for

each component

Options Short nozzle

, short sleeve

nozzle changers, special nozzles

Options Stationary flip-chip camera,

special nozzles, grippers, copla-

narity module

Placement Heads

Collect&Place Heads

20-nozzle

Collect&Place head

CO camera type 23

12-nozzle

Collect&Place head

CO camera type 28

12-nozzle

Collect&Place head

CO camera type 29

6-nozzle

Collect&Place head

CO camera type 29

Component range

a) Please note that the range of components that can be placed is also affected by the pad geometry, customer-specific

standards, component packaging tolerances and component tolerances.

01005 to 2220, Melf,

SOT, SOD

0402 to PLCC44,

BGA, µBGA, flip-

chip, TSOP, QFP,

SO to SO32, DRAM

0201

to flip-chip,

bare die, PLCC44,

BGA, µBGA, TSOP,

QFP, SO to SO32,

DRAM

b) With 0201 package.

0201 to 27 x 27 mm²

Component spec.

max. height

min. lead pitch

min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

4 mm

0.25 mm

0.1 mm

0.4 mm

0.2 mm

0.4 x 0.2 mm²

6 x 6 mm²

1 g

6 mm

0.5 mm

0.2 mm

0.35 mm

0.2 mm

1.0 x 0.5 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.3 mm

0.15 mm

0.25 mm

0.14 mm

0.6 x 0.3 mm²

18.7 x 18.7 mm²

2 g

8.5 mm

0.3 mm

0.15 mm

0.25 mm

0.35 mm

0.14 mm

0.2 mm

0.6 x 0.3 mm²

27 x 27 mm²

5 g

c) For components < 18 x 18 mm².

d) For components  18 x 18 mm².

Programmable set-down

force

1.5 N - 4.5 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N

Nozzle types 10xx, 11xx, 12xx 9xx 9xx 8xx, 9xx

X/Y accuracy

e) The accuracy value was measured using the vendor-neutral IPC standard.

± 41 µm/3

± 55 µm/4

± 45 µm/3

± 60 µm/4

± 41 µm/3

± 55 µm/4

± 45 µm/3

± 60 µm/4

Angular accuracy ± 0.5° / 3

± 0.7° / 4

± 0.5° / 3

± 0.7° / 4

± 0.5° / 3

± 0.7° / 4

± 0.2° / 3

± 0.3° / 4

Component range 95% 98% 98.5% 99.5%

Component camera type 23 28 29 29

Illumination levels 5 5 5 5

Possible lighting level

settings

256