Specification SIPLACE X-Series规格说明书1.pdf - 第38页

38 Vision Sensor Technology PCB Position Recognition Bad Board Recognition Ink Spot Criteria Methods • Synthetic fiducial recognition method • Mean grayscale value • Histogram method • Template matching Shapes and sizes …

Vision Sensor Technology

PCB Position Recognition

Description

Different fiducial shapes

prove to be optimal depend-

ing on the condition of the

surface.

Particularly advisable for

bare copper surfaces with lit-

tle oxidation is the single

cross. Maximum accuracy is

achieved due to the high

information content.

Rectangle, square and circle

are less “informative” but

save space and can even be

used when oxidation is at an

advanced stage. Advisable

for tinned structures are cir-

cle or square because in this

case the ratio of the fiducial

dimensions to the presolder

thickness is particularly

favorable.

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X-/Y-position, rotation angle, mean PCB distortion

in addition: shear, distortion in X- and Y-direction separately

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, rhombus,

circular, square, and rectangular contours, double cross, any

pattern

Fiducial surface:

copper

tin

Without oxidation and solder resist

Fiducial warp  1/10 of structure width, both with good con-

trast to environment

Dimensions of synthetic fiducials

min. X/Y size for circle and rectangle: 0.25 mm

min. X/Y size for annulus and rectangle: 0.3 mm

min. X/Y size for cross: 0.3 mm

min. X/Y size for double-cross: 0.5 mm

min. X/Y size for lozenge: 0.35 mm

min. frame width for annulus and rectangle: 0.1 mm

min. bar width / bar distance for cross, double-cross: 0.1 mm

max. X/Y size for fiducial shapes: 3 mm

max. bar width for cross / double-cross: 1.5 mm

min. tolerances, general: 2% of nominal dimension

max. tolerances, general: 20% of nominal dimension

Dimensions of patterns

min. size

max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there is

no similar fiducial structure in the search area

Vision Sensor Technology

PCB Position Recognition

Bad Board Recognition

Ink Spot Criteria

Methods • Synthetic fiducial recognition method

• Mean grayscale value

• Histogram method

• Template matching

Shapes and sizes of fiducials/structures for

synthetic fiducials

other methods

For dimensions of synthetic fiducials,

see page 37

min. 0.3 mm

max. 5 mm

Masking material good coverage

Recognition time depends on the method: 20 ms - 200ms

Description

In the cluster technology

each subpanel is assigned

an ink spot. If this is present

during the measurement via

the PCB vision module, the

corresponding subpanel is

populated.

With this function it is possi-

ble to eliminate costs due to

unnecessary population of

faulty subpanels.

Technical data for PCB position detection

PCB fiducials

Local fiducials

Library memory for recognition

of bad panels

up to 3 (subpanels and multiple panels)

up to 6 for the Long board option (Optional PCB fiducials

are output by the optimization.)

up to 2 per PCB (may be of different type)

up to 255 fiducial types per subpanel

Image analysis Edge detection method (Singular feature) based on gray-

scale values

Lighting method Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 x 5.78 mm

Vision Sensor Technology

3D Coplanarity Laser Module

Technical data

Components QFP, SO, BGA, gull-wing,

plug

Accuracy

a) Per ball / lead.

± 15 µm (3

± 20 µm (4

Max. component size 50 x 50 mm²

Max. connector size 120 x 20 mm²

min. ball diameter / distance 400 µm / 800 µm

Min. number of balls 6

Min. lead width / pitch 300 µm

/ 500 µm

b) Please contact your local product manager in the case of

smaller lead widths.

Min. lead number 5

Max.

CO height

17 mm

Positioning option Location 3 on SIPLACE

X2 and X3, alternative to

the 2D coplanarity laser

module

Placement head type TwinHead

Description

Coplanarity of connections

on a component means that

all connections lie on a level,

the so-called placement

plane. This level is created

from the height information

from the coplanarity mea-

surement. This ensures that

the same soldering condi-

tions apply for all connec-

tions.

Place-

ment

Deviation from

coplanarity

Measuring principle

Measurement of the heights

of the connections occurs

contact-free according to the

principle of laser-triangula-

tion. For the 3D method, a

laser beam line scans the

component. The reflected

light from the laser is repro-

duced on a camera. In this

way the height information

for the connections is

obtained from the reflected

light from the laser.

Restrictions

• Lead or ball recognition

can get worse if the sur-

face is oxidized or glossy.

• The following components

cannot be measured: a

PLCC, SOJ, socket, chip,

bare die, Moulded, Melf,

ECV, DPack, CCGA,

screening plate, compo-

nents with internal con-

nections.

3D coplanarity module

Component inspection possible Component inspection not

possible

Only 5 pins

Lead/ball size within

specification

Also gull-wing

connections

With internal con-

nections, no gull-

wing form

The same applies to screening

plates, plugs with connections

on the underside, bare die etc.