Specification SIPLACE X-Series规格说明书1.pdf - 第5页

5 Overview of the Technical Data Maximum Values Placement ra te a IPC value Benchmark value Theoretical value a) See page 10 for a definition of the output values. 81,000 comp./h 90,000 comp./h 124,500 comp./h Component …

SIPLACE X-Series

Content

Vision Sensor Technology 37

PCB Position Recognition 37

Bad Board Recognition 38

3D Coplanarity Laser Module 39

2D Coplanarity Laser Module 40

01005 Placement 41

SIPLACE Software 42

SIPLACE Services 44

Training Courses for the SIPLACE X-Series 45

Maximum Quality in Production 46

Technical Data 47

SMEMA Interface 47

Connector Assignment 47

Signal Sequence 48

Siemens Signal Interface 49

Connector Assignment 49

Signal Sequence 50

Electrical Ratings and Compressed Air Supply 51

Electrical Connection, Interfaces and Compressed Air Connection 52

Dimensions and Set-up Conditions 53

Dimensions of the Placement System 54

Placement System’s Center of Gravity 54

Maneuvering Radii for the Component Changeover Tables 55

Maneuvering Radius for the MTC 56

Maneuvering Radii for the WPC 57

Spacing Distances for the Single Conveyor 58

Spacing Distances for the Flexible Dual Conveyor 59

Spacing Distances for the Flexible Dual Conveyor withProductivityLane 60

Spacing Distances for the Placement Machine with MTC 61

Spacing Distances for the Placement Machine with WPC 62

Transport and Delivery Configuration 63

Standard List 64

List of Options 65

List of Languages 67

SIPLACE X-Series Configuration Help 68

SR.605.xx 68

Awards 69

Spezifikation.book Seite 4 Freitag, 12. August 2011 9:42 09

Overview of the Technical Data

Maximum Values

Placement rate

IPC value

Benchmark value

Theoretical value

a) See page 10 for a definition of the output values.

81,000 comp./h

90,000 comp./h

124,500 comp./h

Component range 01005 - 200 x 125 mm²

Placement accuracy

angular accuracy

b) The accuracy value was measured using the vendor-neutral IPC standard.

± 22 µm, ± 0.05° / (3),

± 30 µm, ± 0.07° / (4)

Feeder module types Tape feeder modules, waffle-pack trays, stick

magazine feeders, bulk cases, dip modules,

application-specific OEM feeder modules

Feeding capacity, (SIPLACE X

component changeover table)

160 8 mm X feeder modules

Feeding capacity, (SIPLACE HF

component changeover table)

180 tracks with 3 x 8 mm S

PCB format max. 610 x 535 mm²

PCB thickness 0.3 - 4.5 mm (others available on request)

PCB weight max. 3 kg

Camera 6 illumination levels

SIPLACE X4

SIPLACE X-Series machine colors

Machine protection: Light Basic Gray

(SIPLACE color code B002)

Pantone solid coated:

Warm Gray 3C

Hoods: Slate Gray, RAL 7015

(SIPLACE color code C002)

Hoods: Light Basic Gray

(SIPLACE color code B002)

Pantone solid coated:

Warm Gray 3C

Machine Description

Intelligent placement solu-

tions for the most rigorous

demands

If you need maximum flexibil-

ity, output or quality in the

placement process, the

SIPLACE X-series has the

technology you need to meet

any challenge associated

with SMT production. It offers

all the innovations and fea-

tures to ensure efficient elec-

tronics production today and

in the future, and provides

previously unavailable ways

to increase both efficiency

and productivity.

Maximum modularity for

every need

The platform of the SIPLACE

X-series has a modular

structure, and can be per-

fectly adapted to meet all the

requirements of electronics

production. Three different

variants of the placement

machine are available:

•SIPLACE X4

•SIPLACE X3

•SIPLACE X2

There is a placement head

on each gantry. True to the

principle of head modularity,

the placement machines can

be reconfigured to suit

changing requirements, and

offer maximum flexibility dur-

ing placement. In addition to

the tried and trusted 6 and

12-nozzle Collect&Place

heads, and the flexible

TwinHead for placing com-

plex models, the SIPLACE

X-series is also available

with the high precision and

extremely fast SIPLACE 20-

nozzle Collect&Place

head. During placement, the

placement heads fetch the

components from the at-rest

component supply, and set

them down on the PCB,

which is also stationary. This

proven SIPLACE principle

guarantees reliable pick-up

of even the smallest compo-

nents, prevents the compo-

nents slipping on the PCB

and minimizes traversing

paths.

The user also has access to

different variants of the PCB

conveyor: the SIPLACE

single conveyor and flexi-

ble SIPLACE dual con-

veyor. The latter offers all

the benefits of the conven-

tional dual conveyor, such as

reducing non-productive

downtimes, combined with

the option of using the single

conveyor.

Other innovative features of

the SIPLACE X-series at a

glance:

Productivity Lane

The SIPLACE X-series can

be equipped with a produc-

tivity lane. PCBs in the pro-

ductivity lane are simply

transported through the

placement area so that they

can be populated on a

machine further downstream

on the line. This results in a

real increase in output.

01005 placement without

compromise

The SIPLACE X-series is

designed to place 01005

components as standard.

Both the 20-nozzle Collect&

Place head with its high-res-

olution camera and the

SIPLACE X feeder modules

work easily with the smallest

components used at present.

There are also specially-

developed nozzles for 01005

components that can be

used. With these prepara-

tions, the tiny components

can be processed without

any loss of quality and

speed. The components can

be placed with minimal spac-

ings and independently of

large components that are

beside the 01005 compo-

nent. This equates to true

01005 capability.

Incredibly fast new prod-

uct introduction (NPI) with

external set-up preparation

and SIPLACE vision teach-

ing

The SIPLACE X-series

demonstrates its strengths in

terms of the flexible produc-

tion environment, as well on

the high-performance side.

For example, NPI can be

implemented as fast as pos-

sible with the SIPLACE

Virtual Product Build.

This NPI solution allows you

to program offline, set up and

check offline and to make

adjustments offline with the

SIPLACE Pro software.

This increases machine utili-

zation and reduces waste.