Specification SIPLACE X-Series规格说明书1.pdf - 第40页

40 Vision Sensor Technology 2D Coplanarity Laser Module See page 39 for a de scription of the copla narity proper ties. Measuring principle Measurement of the heights of the conn ections occu rs contact-free accordin g t…

Vision Sensor Technology

3D Coplanarity Laser Module

Technical data

Components QFP, SO, BGA, gull-wing,

plug

Accuracy

a) Per ball / lead.

± 15 µm (3

± 20 µm (4

Max. component size 50 x 50 mm²

Max. connector size 120 x 20 mm²

min. ball diameter / distance 400 µm / 800 µm

Min. number of balls 6

Min. lead width / pitch 300 µm

/ 500 µm

b) Please contact your local product manager in the case of

smaller lead widths.

Min. lead number 5

Max.

CO height

17 mm

Positioning option Location 3 on SIPLACE

X2 and X3, alternative to

the 2D coplanarity laser

module

Placement head type TwinHead

Description

Coplanarity of connections

on a component means that

all connections lie on a level,

the so-called placement

plane. This level is created

from the height information

from the coplanarity mea-

surement. This ensures that

the same soldering condi-

tions apply for all connec-

tions.

Place-

ment

Deviation from

coplanarity

Measuring principle

Measurement of the heights

of the connections occurs

contact-free according to the

principle of laser-triangula-

tion. For the 3D method, a

laser beam line scans the

component. The reflected

light from the laser is repro-

duced on a camera. In this

way the height information

for the connections is

obtained from the reflected

light from the laser.

Restrictions

• Lead or ball recognition

can get worse if the sur-

face is oxidized or glossy.

• The following components

cannot be measured: a

PLCC, SOJ, socket, chip,

bare die, Moulded, Melf,

ECV, DPack, CCGA,

screening plate, compo-

nents with internal con-

nections.

3D coplanarity module

Component inspection possible Component inspection not

possible

Only 5 pins

Lead/ball size within

specification

Also gull-wing

connections

With internal con-

nections, no gull-

wing form

The same applies to screening

plates, plugs with connections

on the underside, bare die etc.

Vision Sensor Technology

2D Coplanarity Laser Module

See page 39 for a description

of the coplanarity properties.

Measuring principle

Measurement of the heights

of the connections occurs

contact-free according to the

principle of laser-triangula-

tion. For the 2D method, a

point laser beam scans the

component. The reflected

light from the laser is pro-

jected onto a sensor. In this

way the height information

for the connections is

obtained from the reflected

light from the laser.

Restrictions

• The component must

have a minimum of two

and a maximum of four

rows of gull-wing leads.

• The row of leads should

be located orthogonally to

each other.

• The leads should be

trained orthogonally to the

row of leads.

• The ends of the leads lie

on a straight line.

• Measurement of compo-

nents with just one row of

leads is not possible.

Technical data

Components Gullwing

Accuracy ± 18.5 µm (3 (reference CO)

± 24.7 µm (4

± 30.5 µm (3 (CO up to 32 mm)

± 40.7 µm (4

± 31.3 µm (3 (CO up to 55 mm)

± 41.7 µm (4

Max. component size 55 x 55 mm²

Min. lead pitch 300 µm

Max. component height 25 mm

Positioning option Location 3 on SIPLACE X2 and

X3, alternative to the 3D copla-

narity laser module

Placement head type TwinHead

01005 Placement

The SIPLACE X-series is

designed to place 01005

components (0.4 mm x 0.2

mm) as standard. It needs to

be running the station soft-

ware version 603.01 and

SIPLACE Pro 4.1. This will

also improve the detection

capability at the associated

nozzles.

The SIPLACE component

library already contains the

contours and dimensions of

the 01005 components.

There are also specially-

developed type 1005 compo-

nent nozzles for the

SIPLACE X-series. The

shape and size of these noz-

zles is adapted for the 01005

components and - like all

other SIPLACE nozzles -

they have an extremely

wear-resistant ceramic tip

and a flexible nozzle seat.

This guarantees maximum

precision and process reli-

ability.

Optimized pick-up is guaran-

teed by the ideal feeding

conditions in the SIPLACE X

feeder module. The smaller

the elements to be picked up,

the more accurate the pick-

up must be. Even the tiniest

inaccuracy may result in

components not being

sucked up or being sucked

up incorrectly. The SIPLACE

X feeder modules are ideally

designed for this. New

motors and fewer precision

mechanical parts also help.

The tiny components can be

processed without any loss

of performance, and can be

placed with minimal spacings

and regardless of any large

components beside the

01005 component. This

equates to true 01005 capa-

bility. As a rule with 01005

placement, a finely tuned

overall 01005 process is the

basic requirement if you want

to achieve excellent results.

All the process parameters

must be optimized. The

SIPLACE team will be

pleased to advise you on

how to do this.

01005 measurement

results and ambient condi-

tions

Dpm values and pick-up

rates for 01005 placement

are highly dependent on the

measuring conditions, so it is

important to specify them

without the corresponding

ambient conditions.

The following table lists some typically values for 01005 place-

ment that can be achieved with a SIPLACE X-series if the listed

marginal conditions are fulfilled:

Machine type SIPLACE X4, X3, X2

Placement head 20-nozzle Collect&Place head

Nozzle type 1005

Feeder module type 8mm SIPLACE X tape feeder

module

Station software 603.01 or later

SIPLACE Pro 4.1 or later

Pickup rate 99.9%

Dpm rate 50

Pad width 200 µm

Distance 100 µm

Components (L x W x H) 400 x 200 x 200 µm³ (±20 µm)

Solder paste type 5

Stencil thickness 60 µm