Specification SIPLACE X-Series规格说明书1.pdf - 第14页
14 Placement Heads Collect & Place Heads 20-nozzle Collect & Place head CO camera type 23 12-nozzle Collect & Place head CO camera type 28 12-nozzle Collect & Place head CO camera type 29 6-nozzle Collect…
13
Placement Heads
Standard Functions / Options
20-nozzle Collect&Place head 12-nozzle Collect&Place head
Standard-
functions
High-resolution head camera,
vacuum sensor, force measure-
ment, component sensor, inte-
grated turning station for each
segment, PCB warpage check,
individual recording for each
component
Standard-
functions
Head camera, vacuum sensor,
force measurement, PCB war-
page, check, individual record-
ing for each component
Options Nozzle changer, special nozzles Options High-resolution camera, com-
ponent sensor, short nozzle
a
,
short sleeve
a
, nozzle changers,
special nozzles
a) With SIPLACE HF component changeover table only.
6-nozzle Collect&Place head TwinHead
Standard
functions
High-resolution head camera,
vacuum sensor, force measure-
ment, PCB warpage, check, indi-
vidual recording for each
component
Standard
functions
Stationary fine-pitch camera,
vacuum sensor, force sensor,
nozzle changer, PCB warpage
check, individual recording for
each component
Options Short nozzle
a
, short sleeve
a
,
nozzle changers, special nozzles
Options Stationary flip-chip camera,
special nozzles, grippers, copla-
narity module
14
Placement Heads
Collect&Place Heads
20-nozzle
Collect&Place head
CO camera type 23
12-nozzle
Collect&Place head
CO camera type 28
12-nozzle
Collect&Place head
CO camera type 29
6-nozzle
Collect&Place head
CO camera type 29
Component range
a
a) Please note that the range of components that can be placed is also affected by the pad geometry, customer-specific
standards, component packaging tolerances and component tolerances.
01005 to 2220, Melf,
SOT, SOD
0402 to PLCC44,
BGA, µBGA, flip-
chip, TSOP, QFP,
SO to SO32, DRAM
0201
b
to flip-chip,
bare die, PLCC44,
BGA, µBGA, TSOP,
QFP, SO to SO32,
DRAM
b) With 0201 package.
0201 to 27 x 27 mm²
Component spec.
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
4 mm
0.25 mm
0.1 mm
0.4 mm
0.2 mm
0.4 x 0.2 mm²
6 x 6 mm²
1 g
6 mm
0.5 mm
0.2 mm
0.35 mm
0.2 mm
1.0 x 0.5 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.3 mm
0.15 mm
0.25 mm
0.14 mm
0.6 x 0.3 mm²
18.7 x 18.7 mm²
2 g
8.5 mm
0.3 mm
0.15 mm
0.25 mm
c
0.35 mm
d
0.14 mm
c
0.2 mm
d
0.6 x 0.3 mm²
27 x 27 mm²
5 g
c) For components < 18 x 18 mm².
d) For components 18 x 18 mm².
Programmable set-down
force
1.5 N - 4.5 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N
Nozzle types 10xx, 11xx, 12xx 9xx 9xx 8xx, 9xx
X/Y accuracy
e
e) The accuracy value was measured using the vendor-neutral IPC standard.
± 41 µm/3
± 55 µm/4
± 45 µm/3
± 60 µm/4
± 41 µm/3
± 55 µm/4
± 45 µm/3
± 60 µm/4
Angular accuracy ± 0.5° / 3
± 0.7° / 4
± 0.5° / 3
± 0.7° / 4
± 0.5° / 3
± 0.7° / 4
± 0.2° / 3
± 0.3° / 4
Component range 95% 98% 98.5% 99.5%
Component camera type 23 28 29 29
Illumination levels 5 5 5 5
Possible lighting level
settings
256
5
256
5
256
5
256
5
15
Placement Heads
TwinHead
TwinHead
Fine-pitch camera
a
(component camera type 33)
a) A maximum of two stationary cameras can be configured in one placement area.
TwinHead
Flip-chip camera (option)
a
(component camera type 25)
Component range
b
b) Please note that the range of components that can be placed is also affected by the pad geometry, customer-
specific standards, component packaging tolerances and component tolerances.
0402 to SO, PLCC, QFP, BGA,
special components, bare dies,
flip-chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components,
bare dies, flip-chips, shields
Component specs
c
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
d
c) If the C&P head and the TwinHead are combined in one placement area, the maximum component height is
restricted.
d) If standard nozzles are used.
25 mm (larger heights on request)
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 x 0.5 mm²
55 x 45 mm²
(single measurement)
For use with two nozzles
50 x 50 mm² or
69 x 10 mm²
For use with one nozzle:
85 x 85 mm² or
125 x 10 mm²
max. 200 x 125 mm² (with restric-
tions)
100 g
25 mm (larger heights on request)
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 x 0.3 mm²
16 x 16 mm²
(single measurement)
100 g
Programmable set-down force 1.0 N - 15 N
2.0 N - 30 N
e
e) SIPLACE High-Force Head.
1.0 N - 15 N
2.0 N - 30 N
e
Nozzle types
f
f) Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available
online.
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
Nozzle spacing for P&P heads 70.8 mm 70.8 mm
X/Y accuracy
g
g) The accuracy value was measured using the vendor-neutral IPC standard.
± 26 µm/3± 35 µm/4 ± 22 µm/3± 30 µm/4
Angular accuracy ± 0.05° / 3± 0.07°/ 4 ± 0.05° / 3± 0.07° / 4
Illumination levels 6 6
Possible lighting level settings
256
6
256
6