Specification SIPLACE X-Series规格说明书1.pdf - 第35页
35 Digital Vision System The digital vision system guarantees extremely fast and reliable component re c- ognition, while being ver y simple to use. The system identifies each individual component from its shape and colo…
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Component Feeding
Waffle-Pack Changer (WPC)
Technical Data
Electrical ratings
Dimensions (LxW) 1560 x 360 mm²
Height
830 mm ± 15 mm PCB transport height
900 mm ± 15 mm PCB transport height
930 mm ± 15 mm PCB transport height
950 mm ± 15 mm PCB transport height
1360 mm ± 15 mm
1430 mm ± 15 mm
1460 mm ± 15 mm
1480 mm ± 15 mm
Weight approx. 240 kg
Load per unit area 4.19 kN/m²
Dimensions of the waffle-pack tray carrier (L x W x H) 360 x 260 x 6 mm³
Weight of the waffle-pack tray carrier 0.8 kg
Dimensions of the waffle-pack tray including components 341 x 235 x 15 mm³
max. 341 x 235 x 23 mm³
Weight of the waffle-pack tray carrier including the waffle-pack tray and
components max. 1.2 kg
Storage capacity max. 28 waffle-pack tray
carriers
Total weight of the 28 waffle-pack tray carriers 27.6 kg
Weight of the magazine storage unit, waffle-pack tray carriers, waffle-
pack trays and components max. 50 kg
Changeover time for waffle-pack tray carrier
over 1 level
over 10 levels
over 27 levels
1.9 s
2.3 s
2.9 s
Supply voltage 3 x 208 VAC ± 5%; 50/60 Hz (U.S.A.)
3 x 230 VAC ± 5%; 50/60 Hz
3 x 380 VAC ± 5%; 50/60 Hz
3 x 400 VAC ± 5%; 50/60 Hz (European version)
3 x 415 VAC ± 5%; 50/60 Hz
Nominal apparent power 800 VA
Rated current 0.7 A at 3 x 400 VAC
Fuses 3 x 10 or 3 x 16 A
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Digital Vision System
The digital vision system
guarantees extremely fast
and reliable component rec-
ognition, while being very
simple to use. The system
identifies each individual
component from its shape
and color. Even complex
component shapes, such as
flip-chip or CCGA are
detected extremely reliably.
The system is not only used
in the placement head cam-
eras; it can also be found in
the PCB camera. As well as
ensuring that components
are detected accurately, it
also ensures reliable detec-
tion of the ink spots and PCB
fiducials.
The benefits at a glance:
• Extremely fast and reliable
component detection
• Shortest cycle times
• Robust measurement with
reference to the shape
and color
• Straightforward program-
ming
• Offline programming of
package forms
• Rapid introduction of new
products (NPI)
• Open architecture allows
you to quickly adapt to
new requirements
• Optimum placement
results through individual
measurement of each
component
Digital vision cameras
20-nozzle Collect&Place head camera
12-nozzle Collect&Place head camera
6-nozzle Collect&Place head camera
TwinHead standard and high-resolution camera
2 PCB cameras
Examples of digital vision system analysis times
01005 9 ms
PLC44 17 ms
BGA 225 balls 18 ms
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Digital Vision System
Checking the Component Quality
SIPLACE vision algorithms
help with the recognition of
• flipped components,
• upright components,
• poor component quality.
The digital vision system
automatically saves the last
500 images of components
that were identified as “bad”.
SIPLACE users can then
easily demonstrate poor
component quality.
The benefits at a glance:
• Maximum placement qual-
ity
• High first pass yield
• Reduced operating costs
Flipped components Upright components
Poor component quality
Vision Teach menu at the station