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User Manual SIPLAC E HF Series 3 Technical data Software Vers ion SR.505.xx 05/2004 US Edition 3.6 Placem ent heads 107 3.6.3.3 T echnical dat a 3 6-segme nt Collec t&Place head with standa rd componen t cam- era 6-s…
3 Technical data User Manual SIPLACE HF Series
3.6 Placement heads Software Version SR.505.xx 05/2004 US Edition
106
Æ The 6-segment Collect&Place head has three axes - the DR or star axis, the Z axis and the DP
axis.
Æ The star rotates about the star axis with its 6 segments. The segments hold the sleeves. There
is a nozzle seated on every sleeve, which sucks up the components, and transports them from
the pick-up/placement position (1) to the reject position (2), to the optical centering position (4)
or to the turning position (5).
Æ The Z axis performs a vertical movement. Every sleeve that is in the bottom star position (1)
is raised or lowered by this axis, thus picking up the components from the conveyors and set-
ting them down on the PCB. The Z axis is an "intelligent axis". It "notes" the pick-up height of
each conveyor track and the placement height for each component. This can speed up the
placement process. The programmed placement force remains constant.
Æ The DP axis rotates the optically centered component to the desired placement angle. The se-
quences of movements of the rotation and translation axes are controlled by control circuits.
Position and speed sensors send the actual values for the axis movement to the axis control.
The setpoint and actual values are compared and used to determine the force and speed pa-
rameters for the servo amplifier, and thus the axis movement to be performed. The vacuum
values at the nozzle are constantly checked throughout the entire pick-up and placement pro-
cess in order to keep the placement error rate as low as possible.
User Manual SIPLACE HF Series 3 Technical data
Software Version SR.505.xx 05/2004 US Edition 3.6 Placement heads
107
3.6.3.3 Technical data
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6-segment Collect&Place head
with standard component cam-
era
6-segment Collect&Place head
with DCA camera
Range of components 0603 to 32 x 32 mm² 0201 to flip-chip, bare die
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball bump ∅
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.5 mm
0.56 mm
0.32 mm
1.6 x 0.8 mm²
32 x 32 mm²
5 g
8.5 mm
0.4 mm
0.2 mm
0.11 mm
0.6 x 0.3 mm²
13 x 13 mm²
5 g
Programmable set-down
force
2.4 N - 5.0 N 2.4 N - 5.0 N
Nozzle types 8 xx, 9 xx 8 xx, 9 xx
X/Y accuracy ± 60 µm/4 σ ± 55 µm/4 σ
Angular accuracy ± 0.3°/4 σ ± 0.3°/4 σ
3 Technical data User Manual SIPLACE HF Series
3.6 Placement heads Software Version SR.505.xx 05/2004 US Edition
108
3.6.4 SIPLACE TwinHead for high-precision IC placement
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Fig. 3.6 - 9 TwinHead for high-precision IC placement
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(1) Pick&Place module - the TwinHead consists of 2 Pick&Place modules
(2) DP axis
(3) Z axis drive
(4) Incremental distance measuring system for the Z axis