00193922-01.pdf - 第255页

User Manual SIPLAC E HF Series 6 Component han dling Software Version SR.505.xx 05/2004 US Edition 6.2 Technical data for the feeders 255 6.2.17.2 T echnical dat a Item no. 001 17010-xx 6 Assign ed locations 3 6 Componen…

6 Component handling User Manual SIPLACE HF Series

6.2 Technical data for the feeders Software Version SR.505.xx 05/2004 US Edition

254

6.2.16.3 Data entry

Define the waffle-pack trays as described in the SIPLACE Pro operating instructions. 6

6.2.17 Dip module

Fig. 6.2 - 17 Dip module

(1) Dip module

(2) Rotating plate

(3) Squeegee

6.2.17.1 Principle of dip fluxing

The dip module (item 1) is used to wet flip-chip and CSP components with flux or conductive ad-

hesive.The flux holder is a rotating plate (item 2) on which a thin film of flux (e.g. 40 µm) is created

with a squeegee (item 3). This method is particularly suitable for highly viscous (honey-like) fluxes.

The amount of flux required for the process is reduced to a minimum coating thickness since only

the undersides of the bumps have to be wetted.

The dip module is suitable for all placement heads. It is regarded as a standalone type of conveyor

by the set-up optimization. There is no limit to the number of dip modules at the individual loca-

tions.

User Manual SIPLACE HF Series 6 Component handling

Software Version SR.505.xx 05/2004 US Edition 6.2 Technical data for the feeders

255

6.2.17.2 Technical data

Item no. 00117010-xx 6

Assigned locations 3 6

Component size max. 36 x 36 mm²

depending on the placement head type 6

Possible coating thicknesses 25, 35, 45, 55, 65, 75 µm 6

Time required to change the coating thickness Less than 1 min. 6

Gap height tolerance ± 5 mm 6

Plate rotating speed Programmable from 0 - 10 sec.

in 0.1 sec. increments 6

Component dip time Programmable from 0 - 2 sec.

in 0.1 sec. increments 6

Flux Highly viscous flux, conductive adhesive 6

6 Component handling User Manual SIPLACE HF Series

6.3 Component trolley Software Version SR.505.xx 05/2004 US Edition

256

6.3 Component trolley

Up to four component trolleys may be docked to the SIPLACE HF placement machine. The loca-

tions are numbered as shown in the diagram below.

Fig. 6.3 - 1 Locations for the component trolleys

1, 2, 3, 4 Location no. 1, 2, 3, 4

T Direction of PCB transport

The component trolleys are stand-alone modules that can be set up at an external set-up area

with feeders. This means that the production process only has to be interrupted briefly in order to

change the component trolley.