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User Manual SIPLAC E HF Series 6 Component han dling Software Version SR.505.xx 05/2004 US Edition 6.2 Technical data for the feeders 253 PLEA SE NOT E – The man ual tray ca n be s et up at the follow ing loca tions: HF …

6 Component handling User Manual SIPLACE HF Series

6.2 Technical data for the feeders Software Version SR.505.xx 05/2004 US Edition

252

6.2.16 Support for waffle-pack trays (manual tray)

The support for waffle-pack trays allows components to be picked up from individual waffle-pack

trays. The waffle-pack trays are changed manually. 6

Fig. 6.2 - 16 Installation

(1) Centering pins

(2) Magnetic rail

(3) Centering ball

(14), (15) This position must not be filled.

The support for waffle-pack trays is placed on the component feeder table, just like a conveyor.

There are two different versions of the support, the only difference being the width. 6

Support for large waffle tray (260x360mm², fills 9 locations)

part no. 00116430-01 and 6

Support for small waffle tray (136x360mm², fills 5 locations)

part no. 00116432-01 6

User Manual SIPLACE HF Series 6 Component handling

Software Version SR.505.xx 05/2004 US Edition 6.2 Technical data for the feeders

253

PLEASE NOTE

– The manual tray can be set up at the following locations:

HF placement machine: locations 2 and 4

HF/3 placement machine: location 2

Feeder locations 14 and 15

must not be filled

– The manual tray and the nozzle changer cannot be used at the same time at location 4.

– The component trolley cannot be docked in/out while the tray is fitted.

6.2.16.1 Assembly

Æ Insert the front side of the support for waffle-pack trays into the associated centering pin (A in

Fig. 6.2 - 16

Æ Then position the hole on the rear side of the support for the waffle-pack tray onto the center-

ing ball on the component feeder table (B in Fig. 6.2 - 16

Æ Make sure the waffle-pack tray is resting securely on the component feeder table.

Æ Position one side of the waffle-pack tray carrier in the mounting (C in Fig. 6.2 - 16). Then press

the other side into the mounting (D in Fig. 6.2 - 16

Æ Slide the waffle-pack tray up against the stop (E in Fig. 6.2 - 16).

Æ Secure the waffle-pack tray carrier by pressing the thrust pad (F in Fig. 6.2 - 16) downwards.

Æ To remove the waffle-pack tray carrier, press the thrust pad once more.

NOTE

Using the support for small waffle-pack trays (136mm) a waffle-pack tray (JEDEC or CENELEC

waffle-pack tray) can be fitted directly to the support, in other words, without a waffle-pack tray

carrier being used. However, the thrust pad will require changing. 6

WARNING 6

All locations must be equipped with feeders in order to guarantee operational reliability.

If there are not enough feeders available, unassigned locations should be fitted with a hand

guard (dummy feeder). When a waffle-pack tray (manual tray) is set up, the remaining locations

should again be protected with a hand guard.

6.2.16.2 Changing the retainer

Æ Hold the retainer (G in Fig. 6.2 - 16) firmly. Press the thrust pad downwards (F in Fig. 6.2 - 16)

and remove the retainer by pressing it out sideways.

6 Component handling User Manual SIPLACE HF Series

6.2 Technical data for the feeders Software Version SR.505.xx 05/2004 US Edition

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6.2.16.3 Data entry

Define the waffle-pack trays as described in the SIPLACE Pro operating instructions. 6

6.2.17 Dip module

Fig. 6.2 - 17 Dip module

(1) Dip module

(2) Rotating plate

(3) Squeegee

6.2.17.1 Principle of dip fluxing

The dip module (item 1) is used to wet flip-chip and CSP components with flux or conductive ad-

hesive.The flux holder is a rotating plate (item 2) on which a thin film of flux (e.g. 40 µm) is created

with a squeegee (item 3). This method is particularly suitable for highly viscous (honey-like) fluxes.

The amount of flux required for the process is reduced to a minimum coating thickness since only

the undersides of the bumps have to be wetted.

The dip module is suitable for all placement heads. It is regarded as a standalone type of conveyor

by the set-up optimization. There is no limit to the number of dip modules at the individual loca-

tions.