KE-3020_SPE_EN.pdf - 第33页

- 29 - 5.2.12. Offset Place ment After Solder Screen - pr inting ( Factory - Set Option) A component place ment position error may occur after re - flow ing if you place a co mponent on the P W B pad w hen the solder pri…

- 28 -

5.2.11. Coplanarity (Factory-Set Option)

By moving a target component that is to be measured at constant speed in the direction

(Y-direction) perpendicular to the laser line (X-direction), the camera shoots the diffuse

reflection of laser beam emitted to the component and the device creates 3-D image to

measure displacement without touching the component. This device determines if a

component is appropriate or not based on the 3-D image obtained from the component

information sent by the mounter in advance (that is, checks the height of the electrode).

Colinearity check:

The colinearity check inspects “how much a side on which leads are located is bent in the

up/down directions.”

Coplanarity check:

This check can check coplanarity (uniformity of the bottom of a terminal) of a component with

the three-point method (JEDEC standard: JESD22-B108A) or the method of least squares

(JEDEC standard: JESD22-B108A).

Applicable components

- Components to be recognized with a VCS only.

- BGA, FBGA, connector, and lead components (SOP and QFP) whose respective pitch

is the same and whose respective lead width is the same

*1. If you do not enter the correct lead width and electrode size of a component whose

lead width is less than 0.3 mm on the “Component” data screen of the Program Editor,

the system may not be able to detect its terminal correctly.

◆Component height 12.0mm or less (HC spec.：20.0mm、EC spec.：25.0mm）

A product whose laser class is 3b is used in the coplanarity sensor.

- Key switch

The front section of the machine is equipped with a key switch. Only when the key

switch is set to ON, you can use the coplanarity function.

- Cover open

Regardless of the key switch state, any laser is not emitted when the cover opens.

Item

Dimensions

Lead

component

Pitch 0.4 mm or more

Lead width

0.18 mm or more

Lead length 0.3 mm or more

Component size 48 mm×150 mm or less

Ball

component

Pitch 0.8 mm or more

Ball diameter 0.4 mm or more

Component size 48 mm×150 mm or less

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5.2.12. Offset Placement After Solder Screen-printing (Factory-Set Option)

A component placement position error may occur after re-flowing if you place a component

on the PWB pad when the solder printing position is shifted from the pad position because a

PWB expands or shrinks.

This function uses an OCC to recognize a gap between a PWB pad and printed solder that is

generated as a result of expansion and/or contraction of a PWB, and places a component on

the printed solder instead of the pad. This makes use of the self-alignment effect to

improve the component placement accuracy after re-flowing.

① Applicable solder shape

A pair of cream solders, which are symmetrical, screen-printed on a PWB pad for a

square chip

* The shape of screen-printed solder should be symmetrical. The system cannot

accurately detect how much to correct the gap unless the shape is symmetrical.

The applicable shapes should be: circle, oval, square, rectangle and pentagon.

(Recognition of other shapes should be checked.)

② Applicable solder

Eutectic solder (NIHON HANDA: RX363-92MY0 (S)) and lead-free solder (TAMURA

KAKEN: TFL-204F-111S)

(* Solder described in parentheses is already checked for its appropriateness.)

③ Applicable chip size

0402, 0603, 1005, 1608, 2012, 3216

* Note that image of a set of solder whose shorter side is 0.16 mm or more and whose

longer side is 3.2 mm or less has to be obtained.

④ Applicable solder angle

0°, 90°, 180°, 270° (Angle error for a camera: within ± 3°)

⑤ Applicable board material and pad material

− Board material: glass epoxy, paper phenol, flexography, ceramic

− Pad material: gold, copper, hot air leveling

* The solder paste should have a certain level of contrast. If there is a portion whose

brightness is the same as that of solder in the area to be detected due to the condition of the

printed solder, serigraph, a pattern or PWB, and so any image that only solder looks bright

cannot be obtained, the system may not be able to correct the component placement

position by recognizing it. In such a case, you have to set the position of solder paste again

so that it can have the certain level of contrast.

PWB

Solder

Pad

PWB

Solder

Pad

- 30 -

5.2.13. Earth Leakage Circuit Breaker (Option to Be Installed at the Factory)

A standard breaker functions if any excess current flows or if a short-circuit fault occurs.

When you replace it with an earth leakage circuit breaker, this new breaker interrupts

electrical leakage, and then prevents the resulting electrical shock, so you can handle the

machine more safely..

5.2.14. Fluxer (Option to Be Installed at the Factory)

This is a flux supply device that applies flux to ball components such as a BGA, CSP and flip

chip (does not apply any adhesive or solder paste).

You can install this device on the mounter with either of the following two methods.

Installation position

Remarks

Rear bank The number of components to be supplied onto the rear bank is restricted

Mechanical bank

The area for twelve mechanical 8-mm tape feeders is to be occupied.

(A connector bracket option is required separately.)

Electric bank The area for six electric 8-mm tape feeders is to be occupied.

Base frame

Any MTC cannot be installed on the bank at the same time.

Supply of components onto the rear bank is not restricted at all.

*The type of attached on an electric bank does not correspond to the Feeder exchange trolley RF.

Item

Specifications

Remarks

Applicable flux viscosity

8.4 Pa·s to 22.0 Pa·s

Cycle time required for flux

application and component

placement

1,100cph

When the distance each of the X and

Y axes travels is 450 mm or less

Cavity

dimensions

(*See Note 3.)

Depth

Minimum 0.02 mm (± 5 μm)

Maximum 0.2 mm (± 10 %)

Size

Maximum 30 mm×30 mm

(*See Note1 and 2.)

Maximum size of a cavity when only

one cavity is provided

Number

of cavities

1 to 4

Maximum eight on the top and

bottom sides

Power consumption

24 VDC/0.3 A

Life

5 years

(22 hours×300 days)/1 year

Parts needing periodic

replacements

Electromagnetic valve, cylinder

Time for replacement:

2 years after use

Consumables

Fluxer plate, flux container

Time for replacement:

1 year after use

Note 1: The cavity size shall be “the maximum size of a component to be used” + “3-mm

margin around the component.”

Note 2: When two or more cavities are used, all cavities shall fit in the 30 mm×30 mm

area.

Note 3: If you need a cavity whose dimensions are not any of the JUKI standard

dimensions, contact our Sales person.

Standard part

Part number

Dimensions of a cavity

Fluxer plate 120/200

40044090

Size: X = 30 mm, Y = 30 mm

Depth: Front 0.12 mm/Rear 0.20 mm

Fluxer plate 30/50/70/100

40044091

Size: X = 30 mm, Y = 14 mm

Depth: Front A 0.03 mm/Front B 0.05 mm

Rear A 0.10 mm/Rear B 0.07 mm