KE2040Instruction Manual Ver2.01,REV04.2003.6.25.pdf - 第29页
1 − 12 (1) W hen two nozzles pick up components simultaneously, place t hem in turns and center them with laser Small chip component 6,400 components/ hour 0.56 seconds/com ponent) The value above is a rough estimat e ca…
1 − 11
1.1.4 Mechanical specifications
(1) Placement accuracy
The following table lists the placement accuracy data for different types of
components. A poorer accuracy results depending on the components that may
have an edge or plastic mold burrs at the area detected with the laser align
function, and that may have a moving part to be detected with respect to the pick
port.
Table 1.1.4.1
Unit: mm
Component type KE-2040
FMLA heads
(VCS recognition correction)
Component size 50 or less (L/R)
Square chip −
MELF −
SOT −
Aluminum electrolytic capacitor ± 0.15
SOP BOC mark: ± 0.08 in the right angle direction against the lead
±0.12 in the direction parallel to the lead
PLCC, SOJ Component positioning mark: ± 0.08
BOC mark: ± 0.1
QFP, TSOP
(Pitch: 0.8 or more)
Component positioning mark: ± 0.04
BOC mark: ± 0.06
QFP, TSOP
(Pitch: 0.65 or more)
Component positioning mark: ± 0.04
BOC mark: ± 0.06
QFP, TSOP
(Pitch: 0.5 or more)
± 0.04,
Only a component positioning mark is available.
Unidirectional lead
(Pitch: 0.5 or more)
± 0.04 in the right angle direction against the lead
± 0.12 in the direction parallel to the lead
Only a component positioning mark is available.
Components whose image is
divided, then recognized.
Component positioning mark:
± 0.06 in the right angle direction against the lead
± 0.12 in the direction parallel to the lead
BOC mark:
± 0.1 in the right angle direction against the lead
± 0.12 in the direction parallel to the lead
BGA Component positioning mark: ± 0.08
BOC mark: ± 0.12
FBGA ± 0.06,
Only a component positioning mark is available.
Other large-size components −
(2) Placement cycle time
The optimized placement cycle time is shown below. The cycle time required
when a component is placed on a board actually varies depending on the board
size or how many times a nozzle is replaced.
1 − 12
(1) When two nozzles pick up components simultaneously, place them in turns
and center them with laser
Small chip component
6,400 components/hour 0.56 seconds/component)
The value above is a rough estimate calculated on the assumption that two
components are simultaneously picked up and one component are
simultaneously placed on the almost entire area of a 330 mm x 250 mm
board.
(2) Component recognition with the VCS
2,500 components/hour 1.4 seconds/component)
(3) Least input placement angle increment
Programmable placement angle setting unit: 0.05°
(4) Automatic tool changer (ATC)
The ATC can accommodate up to 20 nozzles.
Small nozzle: 17
Large nozzle: 3
(5) Transport rail height
900 mm ± 20 mm
(6) Machine dimensions and mass
W : [KE-2040M] 1300 mm
[KE-2040L] 1300 mm
[KE-2040E] 1300 mm
[KE-2040M] 1400 mm (including PWB transfer unit)
[KE-2040L] 1400 mm (including PWB transfer unit)
[KE-2040E] 1730 mm (including PWB transfer unit)
D : [KE-2040M] 1599mm
[KE-2040L] 1705 mm
[KE-2040E] 1805mm
[KE-2040M] 1784 mm (including keyboard)
[KE-2040L] 1890 mm (including keyboard)
[KE-2040E] 1990 mm (including keyboard)
H : [KE-2040M] 1550 mm
(height of the main unit when the PWB transfer height is 900
mm)
[KE-2040L] 1834 mm
(height of the vision monitor when the PWB transfer height is 900
mm)
[KE-2040E] 2200 mm
(height of the signal tower when the PWB transfer height is 900
mm)
Mass: [KE-2040M] 1410 kg
[KE-2040L] 1510 kg
[KE-2040E] 1530 kg
[
Definition
]
1 − 13
(7) Air requirements
Air pressure : 0.49 ± 0.05 Mpa
Air consumption : 200 L/min.(ANR)
Dry air : Atmospheric dew point -17°C or lower
(8) Noise level
80dB
(9) Country of manufacturing
Manufactured in Japan
(10) Environmental conditions
Operating
Ambient temperature: +10° C to +35° C
Relative humidity: 50% or less (at 35° C)
90% or less (at 20° C)
Transport and storage
Temperature: -25° C to +70° C
Relative humidity: 20% to 95% (No condensation)
(11) Installation category: Installation category II (IEC664-1)
(12) Pollution degree: Pollution degree II (IEC664-1)