00197975-06_UM_TX-Serie_EN.pdf - 第121页
User manual SIPLACE TX-Series 3 Technical data and assemblies From software version 713.0 Edition 01/2020 3.5 Placement head 121 3.5.1.1 Overview 3 3 Fig. 3.5 - 1 SIPLACE SIPLACE SpeedS tar - overview (1) Connection for …
3 Technical data and assemblies User manual SIPLACE TX-Series
3.5 Placement head From software version 713.0 Edition 01/2020
120
3.5 Placement head
3.5.1 SIPLACE SpeedStar C&P20 P /C&P20 M2
3
There are two SIPLACE SpeedStar variants available for the SIPLACE TX-Series:
– SIPLACE SpeedStar C&P20 P for top placement performance
– SIPLACE SpeedStar C&P20 M2 for high-precision placement
CAUTION
Always take hold of the handle to push the placement head
The placement head may only be moved by pushing manually against the handle provid-
ed.
User manual SIPLACE TX-Series 3 Technical data and assemblies
From software version 713.0 Edition 01/2020 3.5 Placement head
121
3.5.1.1 Overview
3
3
Fig. 3.5 - 1 SIPLACE SIPLACE SpeedStar- overview
(1) Connection for the holding circuit of the vacuum pump
(2) "Vacuum sensor holding circuit" board (under the cover)
(3) Star motor
(4) Handle (red for C&P20 M2)
(5) DP drive
(6) Nozzle
(7) Pressure control valve
(8) Z motor (linear motor)
(9) Return cylinder
(5)
(1)
(7)
(2)
(3)
(4)
(6)
(8)
(9)
3 Technical data and assemblies User manual SIPLACE TX-Series
3.5 Placement head From software version 713.0 Edition 01/2020
122
3.5.1.2 Technical data SIPLACE SpeedStar (C&P20 P)
3
SIPLACE SpeedStar (C&P20 P)
With component camera
type 23
With component camera type 41
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-spe-
cific standards, the component packaging tolerances and the component tolerances.
01005 to 2220, Melf, SOT,
SOD
0201 (metric) to 2220, Melf, SOT, SOD,
Bare-Die, Flip-Chip
Component spec.
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
4 mm
250 µm
100 µm
400 µm
200 µm
0.18 mm x 0.18 mm
6mm x 6 mm
1 g
4 mm
80 µm
30 µm
100 µm
50 µm
0.12 mm x 0.12 mm
6 mm x 6 mm
1 g
Set-down force Touchless Placement, 0.5 N, 1 N to 4.5 N
Nozzle types 40xx 40xx
X/Y accuracy
*b
*)b The accuracy values fulfill the conditions in the ASM scope of supply and services.
± 30µm / 3σ ± 30 µm/3σ
± 25 µm/3σ
*c
*)c With accuracy class. Setting in SIPLACE Pro Component Shape Editor.
Angular accuracy ± 0.5° / 3σ ± 0.5° / 3σ
Illumination level 5 5
Standard functions Vacuum sensor, force measurement, PCB warpage check,
individual image of each component
Options Nozzle changer, special nozzles