00197975-06_UM_TX-Serie_EN.pdf - 第137页

User manual SIPLACE TX-Series 3 Technical data and assemblies From software version 713.0 Edition 01/2020 3.5 Placement head 137 3.5.4.10 T echnical Data for SIPLACE MultiS tar (CPP M) on SIPL ACE TX Micron SIPLACE Multi…

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3 Technical data and assemblies User manual SIPLACE TX-Series
3.5 Placement head From software version 713.0 Edition 01/2020
136
3.5.4.9 Technical data for SIPLACE MultiStar (CPP) on SIPLACE TX2i W
SIPLACE MultiStar (CPP)
With component camera type 30
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-
specific standards, the component packaging tolerances and the component tolerances.
01005 to 27 mm x 27 mm
Component spec.
Max height
*b
Max. height
*c
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*)b CPP head: in low installation position (stationary component camera not possible).
*)c CPP head: in high installation position
6.0 mm
8.5 mm
250 µm
100 µm
*d
/ 200 µm
*e
250 µm
e
/ 350 µm
f
140 µm
e
/ 200 µm
f
0.4mm x 0.2mm
27 mm x 27 mm
4 g
*)d For components < 18 mm x 18 mm
*)e For components ≥ 18 mm x18 mm
Set-down force 1.0 - 10 N
Nozzle types 20xx, 28xx
X/Y accuracy
*f
*)f The accuracy values fulfill the conditions in the ASM scope of supply and services.
± 40 µm/3σ
Angular accuracy ± 0.20° / 3σ
*g
, ± 0.38° / 3σ
*h
*)g Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)h Component dimensions smaller than 6 mm x 6 mm.
Illumination level 5
User manual SIPLACE TX-Series 3 Technical data and assemblies
From software version 713.0 Edition 01/2020 3.5 Placement head
137
3.5.4.10 Technical Data for SIPLACE MultiStar (CPP M) on SIPLACE TX Micron
SIPLACE MultiStar (CPP M)
With component camera type 45
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific
standards, the component packaging tolerances and the component tolerances.
01005 to 15 mm x 15 mm
Component spec.
Max height
*b
Max. height
*c
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*)b CPP M head: in low installation position
*)c CPP M head: in high installation position
*d
6.0 mm
8.5 mm
250 µm / 120 µm
50 µm
140 µm
70 µm
0.11 mm x 0.11 mm
15 mm x 15 mm
4 g
*)d Only possible for components which are within the camera focal area of ± 1.3 mm.
Set-down force 1.0 - 15 N
Nozzle types 20xx, 28xx
X/Y accuracy
*e
With "accuracy class"
*f
Without "accuracy class"
*)e The accuracy values fulfill the conditions in the ASM scope of supply and services.
*)f Setting in SIPLACE Pro Component Shape Editor.
± 20 µm/3σ
± 25 µm/3σ
Angular accuracy ± 0.38° / 3σ
Illumination level 5
3 Technical data and assemblies User manual SIPLACE TX-Series
3.5 Placement head From software version 713.0 Edition 01/2020
138
3.5.5 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 10 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis