3D+AOI软件编程手册_20201204.pdf - 第3页

目录 第一章 绪论 ......... .......................... ......................... .......................... ......................... .......................... .. 6 1.1 前言 ....................... ......................... .....…

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矩子科技股份有限公司
JUTZE INTELLIGENCE TECHNOLOGY CO.,LTD
www.jutze.com.cn
版本：V 7.0.4584.0-2
目录
第一章 绪论........................................................................................................................................... 6
1.1 前言..................................................................................................................................................6
1.2 关于本手册
......................................................................................................................................
6
1.3 矩子 3D AOI 简介........................................................................................................................... 6
1.4 安全操作指南和注意事项..............................................................................................................7
1.5 设备放置场所环境要求
..................................................................................................................
7
第二章 工作原理................................................................................................................................... 8
2.1 二维成像原理..................................................................................................................................8
2.2 二维检查原理
................................................................................................................................
11
2.3 三维测算原理................................................................................................................................13
2.4 定位方式........................................................................................................................................14
第三章 软件主界面和基本操作指令介绍......................................................................................... 16
3.1 主界面............................................................................................................................................16
3.2 基本操作指令
................................................................................................................................
17
第四章 元件编辑界面和基本操作指令介绍..................................................................................... 24
4.1 元件编辑界面................................................................................................................................24
4.2 基本操作指令
................................................................................................................................
25
第五章 新程序的创建和生成............................................................................................................. 28
5.1 CAD 的导入
..................................................................................................................................
28
5.2 基板全图的相关应用....................................................................................................................33
5.3 基板坐标变换................................................................................................................................35
5.4 检测程序的保存和程序文件的生成
............................................................................................
36
第六章 基准标记点的制作................................................................................................................. 37
6.1 第一个 Mark 的制作.....................................................................................................................37
6.2 第二个 Mark 的制作
.....................................................................................................................
43
第七章 CHIP 类元件通用资料库的编写............................................................................................ 47
7.1 程序制作流程
................................................................................................................................
47
7.2 进入元件编辑界面........................................................................................................................48
7.3 焊盘不良 1.................................................................................................................................... 49
7.4 焊盘不良 2
....................................................................................................................................
50
7.5 使用 ImageMatch 算法定位焊盘................................................................................................52
7.6 偏移................................................................................................................................................53
7.7 缺件
................................................................................................................................................
54
7.8 立碑................................................................................................................................................55
7.9 错件................................................................................................................................................56
7.10 使用 OCVBIN 算法检测错件
....................................................................................................
56
7.11 虚焊..............................................................................................................................................57
7.12 生成元件库，更新库图像......................................................................................................... 59
7.13 确认程序制作结果
.....................................................................................................................
60
第八章 IC 类元件通用资料库的编写................................................................................................ 61
8.1 程序制作流程................................................................................................................................61
8.2 进入元件编辑界面
........................................................................................................................
62
8.3 本体不良........................................................................................................................................63
8.4 焊盘不良 1.................................................................................................................................... 65
8.5 焊盘不良 2
....................................................................................................................................
66
8.6 使用 ImageMatch 算法定位焊盘................................................................................................67
8.7 偏移................................................................................................................................................68
8.8 立碑
................................................................................................................................................
70
8.9 错件................................................................................................................................................70
8.10 引脚不良..................................................................................................................................... 72
8.11 生成元件库，更新库图像
..........................................................................................................
77
8.12 确认程序制作结果..................................................................................................................... 77
第九章 快速编程功能的使用............................................................................................................. 78
9.1 快速编程功能的开启
....................................................................................................................
78
9.2 CHIP 类元件的快速编程............................................................................................................. 78
9.3 IC 类元件的快速编程...................................................................................................................79
第十章 主要算法逻辑解释................................................................................................................. 81
10.1 MarkSearch................................................................................................................................81
10.2 Scale
...........................................................................................................................................
82
10.3 Mean........................................................................................................................................... 84
10.4 Max/Min/Range......................................................................................................................... 85
10.5 OCR
.............................................................................................................................................
86
10.6 OCV (Optical Character Verification)..................................................................................... 87
10.7 OCVBIN (Optical Character Verification - Binaryzation).....................................................88
10.8 ImageMatch
...............................................................................................................................
89
10.9 LBandSearch / WBandSearch................................................................................................ 90
10.10 ContoursFind........................................................................................................................... 91
10.11 LeadBox
....................................................................................................................................
93
10.12 Connex..................................................................................................................................... 96
10.13 Flatness.................................................................................................................................... 97
10.14 HighDifference
.........................................................................................................................
98
10.15 LeadHeight...............................................................................................................................99
10.16 Distance-L/Distance-W........................................................................................................ 100
10.17 DefectFinder
..........................................................................................................................
102
10.18 BaseHeight............................................................................................................................ 103
10.19 Mask....................................................................................................................................... 103
第十一章 资料库的导出和载入
.......................................................................................................
104
11.1 系统库....................................................................................................................................... 104
11.2 元件库....................................................................................................................................... 106