FX3_动作说明书.pdf - 第5页
Rev1.00 动作说明书 iii 3-11-3 指定标记的修正方法 .............................................................................................................................. ............... 3-45 3-11-4 OCC （ Offset Correction Ca mer…
Rev1.00
动作说明书
ii
3-4 激光识别 ............................................................................................................................................................................... 3-13
3-4-1 激光识别元件的安装流程 ................................................................................................................................... 3-13
3-4-2 VCS识别元件的贴装流程 ...................................................................................................................................... 3-13
3-5 Zθ轴动作............................................................................................................................................................................. 3-14
3-5-1 Z轴的速度分类 ......................................................................................................................................................... 3-14
3-5-2 Z轴的动作行程 ......................................................................................................................................................... 3-16
3-5-2-1 吸附下降时的Z轴动作................................................................................................................................. 3-16
3-5-2-2 吸附下降时的Z轴动作................................................................................................................................. 3-17
3-5-2-3 LA的元件识别时的Z轴动作 ...................................................................................................................... 3-18
3-5-2-4 识别下降时的Z轴动作................................................................................................................................. 3-19
3-5-2-5 识别上升时的Z轴动作................................................................................................................................. 3-20
3-5-2-6 贴装下降时的Z轴动作................................................................................................................................. 3-21
3-5-2-7 贴装上升时的Z轴动作................................................................................................................................. 3-22
3-5-2-8 带式供料器推顶开始，XY轴移动开始时间....................................................................................... 3-23
3-5-2-9 Z轴速度方式 .................................................................................................................................................... 3-24
3-5-3 Z轴的速度比，加速度比...................................................................................................................................... 3-25
3-5-3-1 LNC贴装头........................................................................................................................................................ 3-25
3-5-4 θ轴的速度比............................................................................................................................................................ 3-25
3-5-4-1 θ轴速度方式 .................................................................................................................................................. 3-25
3-5-5 θ轴动作速度·
加速度 ........................................................................................................................................ 3-26
3-5-6 轴其他动作θ
............................................................................................................................................................ 3-26
3-6 芯片跳起检测...................................................................................................................................................................... 3-27
3-6-1 概要 ............................................................................................................................................................................... 3-27
3-6-2 判定方法...................................................................................................................................................................... 3-27
3-7 真空同步时间...................................................................................................................................................................... 3-30
3-7-1 元件类别的分类....................................................................................................................................................... 3-30
3-7-2 吸附时的真空同步时间 ........................................................................................................................................ 3-31
3-7-3 贴装时的真空同步时间 ........................................................................................................................................ 3-32
3-7-4 向废弃箱之外废弃元件时的真空同步时间 ................................................................................................. 3-33
3-7-5 向废弃箱废弃元件时的真空同步时间........................................................................................................... 3-34
3-8 激光识别动作...................................................................................................................................................................... 3-35
3-9 激光识别异常...................................................................................................................................................................... 3-37
3-10 供料器的驱动...................................................................................................................................................................... 3-39
3-11 ＢＯＣ标识识别 .................................................................................................................................................................... 3-43
3-11-1 动作时间...................................................................................................................................................................... 3-43
3-11-2 识别顺序...................................................................................................................................................................... 3-43
Rev1.00
动作说明书
iii
3-11-3 指定标记的修正方法 ............................................................................................................................................. 3-45
3-11-4 OCC（Offset Correction Ca
mera）的说明.................................................................................................. 3-48
3-11-4-1 OCC配件的构成 ............................................................................................................................................ 3-48
3-11-4-2 照明种类.......................................................................................................................................................... 3-48
3-11-4-3 照明图案.......................................................................................................................................................... 3-49
3-11-4-4 电流调整值..................................................................................................................................................... 3-49
3-12 坏标记检测........................................................................................................................................................................... 3-49
3-12-1 坏标记检测................................................................................................................................................................. 3-49
4 机器部的说明............................................................................................................................................................................4-1
4-1 人机部的构成.........................................................................................................................................................................4-1
4-2 人机部的功能.........................................................................................................................................................................4-1
5 机器控制部的说明 ..................................................................................................................................................................5-1
5-1 各基板的功能.........................................................................................................................................................................5-1
5-1-1 CPU基板 .........................................................................................................................................................................5-1
5-1-2 POSITION控制板 ........................................................................................................................................................5-4
5-1-3 IEEE1394A板.................................................................................................................................................................5-4
5-1-4 ETHERMAIN基板.........................................................................................................................................................5-4
5-1-5 ETHERSLAVE基板......................................................................................................................................................5-4
5-1-6 XY RELAY基板.............................................................................................................................................................5-4
5-1-7 BASE CARRY基板......................................................................................................................................................5-5
5-1-8 FEEDER基板 .................................................................................................................................................................5-5
5-1-9 HEAD MAIN基板..........................................................................................................................................................5-5
5-1-10 温度传感器基板..........................................................................................................................................................5-5
5-1-11 操作基板.........................................................................................................................................................................5-6
5-1-12 IP-X5 基板 .....................................................................................................................................................................5-6
Rev1.00
动作说明书
1-1
1 电气装备部概要
1-1 电气装备部的布局
图 1-1 显示主机正面图，图 1-2 显示主机背面图。
图 1-1 主机正面图
• 各部分的名称（主机正面图）
① 液晶电动机 ② HOD（选购品） ③ 操作面板
④ 键盘（贮藏式） ⑤ 鼠标（贮藏式） ⑥ 电源开关
⑦ DVD-ROM＆CD-R/RW（选购品） ⑧ FDD（选购品）
⑨ HDD
⑩ 控制装置
• CPU 接口基板 • ETHER MAIN 基板 • 位置接口基板 • 图象基板（IPX-5）
• C-CPI 后接口基板
⑪ USB×2 口 ⑫ XY伺服驱动 ⑬ 贴装头主基板
⑭ 步进驱动（传送装置）
⑮ OCC 摄像头、同轴投射照明基板、角度照明基板
⑯ 贴装头装置（LNC60 贴装头）、坏板标记（选购品） ⑲ UPS（无停电电源）
注）⑰、⑱请参照下个项、主机背面图。