00198375-02_UM_OnBoardPCB-Inspection-R18-1_DE_EN.pdf - 第37页
37 User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018 Contents Contents 1 Introduction .. 39 1.1 General .. 40 1.1.1 Symbols / Notes .. 40 1.1.2 ASM on the World Wide Web .. 40 1.1.3 Release History…
5 Inspection Process at the Station
5.1 Successful Inspection Results
User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018 61
5 Inspection Process at the Station
5.1 Successful Inspection Results
If the inspection was completed successfully, the relevant dialog will be shown. A few examples of
successful inspection results are shown below.
Good example for successful solder paste inspection
Good example for successful inspection of components before placement (required
components are present)
37User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018
Contents
Contents
1 Introduction.. 39
1.1 General.. 40
1.1.1 Symbols / Notes.. 40
1.1.2 ASM on the World Wide Web.. 40
1.1.3 Release History.. 40
2 What is Onboard PCB Inspection?.. 41
2.1 Customer Benefits.. 41
2.2 System Requirements.. 41
2.3 The Inspection Methods.. 42
2.3.1 Solder Paste Inspection (SPI).. 42
2.3.2 Before Placement Inspection (BPI).. 42
2.3.3 After Placement Inspection (API).. 42
2.4 Prerequisites and Restrictions.. 42
2.4.1 General Notes.. 42
2.4.2 Regarding Solder Paste Inspection (SPI).. 43
2.4.3 Regarding Before Placement Inspection (BPI).. 43
2.4.4 Regarding After Placement Inspection (API).. 44
3 Programming and Download.. 45
3.1 Assigning Inspection Options to the Placement Position.. 45
3.2 Download to the Station.. 45
3.3 Precedence Rules in After Placement Inspection.. 46
4 Teaching Inspection Areas at the Station.. 49
4.1 Teaching Required.. 49
4.2 Teaching Solder Paste Inspection (SPI).. 50
4.2.1 Setting the Illumination... 50
4.2.2 Inspecting the Solder Deposit Teaching Area.. 52
4.2.3 Evaluating the Teaching Result.. 53
4.2.3.1 Evaluating the solder deposit.. 53
4.2.3.2 Average Heights of Solder Deposits.. 54
4.3 Teaching with Before Placement Inspection (BPI).. 55
4.3.1 Setting the Illumination... 56
4.3.2 Setting the Teaching Area.. 56
4.3.3 Defining Exclusion Areas.. 58
4.3.4 Applying the Successful Teaching Run.. 59
4.3.4.1 Checking Obscured Areas.. 60
4.4 Teaching with After Placement Inspection.. 60
5 Inspection Process at the Station.. 61
5.1 Successful Inspection Results.. 61
5.2 Comparing Solder Height Differences From Model.. 62
5.3 Handling of Bad Inspection Results.. 62
5.3.1 Compare solder deposits.. 62
5.3.2 Lost Components Recognized.. 63
5.3.3 Offset Recognized.. 65
