00198375-02_UM_OnBoardPCB-Inspection-R18-1_DE_EN.pdf - 第54页
4 Teaching Inspection Areas at the Station 4.2 Teaching Solder Paste Inspection (SPI) 54 User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018 Successful With errors If defects are already detected here, teach…
4 Teaching Inspection Areas at the Station
4.2 Teaching Solder Paste Inspection (SPI)
User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018 53
ð The model is taught internally. The result of this procedure is shown below.
► Go to Recognition step and click on Learned solder deposits/components.
ð All successfully recognized solder deposits will be marked with a green border.
Tips and tricks
If not all of the solder deposits to be inspected are marked with a green border, you will need to
teach again. Select stronger lighting, correct the teaching areas and repeat the procedure.
Parameters
Various parameters can be set to improve the result.
●
Inspection type
– Shows the setting of the inspection type in SIPLACE Pro for your information.
●
Max. height difference for solder deposit
– The maximum value by which the measured solder height (average value of all height val-
ues of a solder deposit) may deviate from the target value.
●
Solder height average value as reference
– If No is selected, for example, a separate average solder height is calculated for each
solder deposit. Each solder deposit has its own target values during the inspection then.
– If Yes is selected, there are common target values. For the "average solder height" the
(common) target value is calculated from the average value (average of the average solder
height of all teached deposits).
●
Min. volume difference for solder deposit
– Lower threshold value of the solder volume (in % of the target value)
●
Max. volume difference for solder deposit
– Upper threshold value of the solder volume (in % of the target value)
4.2.3 Evaluating the Teaching Result
Here, you see the inspection result. If defects are already detected here, teach again with a better
sample PCB.
4.2.3.1 Evaluating the solder deposit
After teaching the model, a test inspection is automatically started with the current model.
To view the test inspection result, go to Monitor => Recognition step => Evaluation of solder
deposits.
4 Teaching Inspection Areas at the Station
4.2 Teaching Solder Paste Inspection (SPI)
54 User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018
Successful
With errors
If defects are already detected here, teach again with a better sample PCB.
In the example, a solder pad is marked red for defective. The respective error message with a solu-
tion will be shown.
In example no. 942: Solder volume and/or solder height of individual deposits too small.
4.2.3.2 Average Heights of Solder Deposits
The average height for each detected solder deposit is shown in a 3D view.
► Go to Recognition step and select Average height of solder deposits.
4 Teaching Inspection Areas at the Station
4.3 Teaching with Before Placement Inspection (BPI)
User Manual / Bedienungsanleitung Onboard PCB Inspection 06/2018 55
The operator is warned if the detected solder heights differ greatly. Consider this message (1).
Nevertheless, you can start the inspection.
Tips and tricks
●
Re-teach with a better solder paste pressure.
4.3 Teaching with Before Placement Inspection (BPI)
Two things are inspected:
Lost components
●
Is there a (previously lost) component in the inspection area which does not belong there?
– This check covers the entire inspection area.
Components already placed
●
Have all components been correctly placed?
– The aim of teaching is to learn where already placed components are located. Only these
can be inspected later on.
– A typical application case is to check whether all the components in this area have been
placed before another component (e.g. shield) is placed above them.