TRS Advanced WB Intel Issue 02.pdf - 第6页
TRS Advanced Maintenance 6 Issue 2, Nov 14 Objective 2: Identify the key benefi ts and features of the TRS option. • Ball placement application on singulated su bstrates (BGA devices) improved by Z locking towers • Bette…
Issue 2, Nov 14
TRS Advanced Maintenance
5
Objective 1: Locate the hazardous areas of the machine.
Warning
* Moving machine parts can cause injury.
* During this course the machine may be operated with covers
removed.
* Always remove system power prior to undertaking any work on
machine.
* Ensure you DO NOT push or press any buttons or operate the
machine until all personnel are clear of danger.
Personal Safety
Tick each safety item as it is demonstrated to you by your instructor:
Strong Magnet Warning (Machines with Linear Motors only)
The linear motors inside the machine contain*
strong permanent magnets.
These may interfere with pacemakers and metallic implants.*
These magnets could potentially erase data on credit cards,*
ID cards etc.
))
((
Wear eye protection and gloves when working with solder paste
and solvents.
If in doubt press the E-stop, EMO
Do not bypass camsafe switches
ESD Hazard
* The printer contains Electro-Static Sensitive Devices (ESD).
* Do not touch any electronic component of PCB unless wearing
a correctly grounded wrist strap.
Safety Objective
I have been briefed on the above safety aspects and I am fully satised with my
responsibilities..
Sign
Date
TRS Advanced Maintenance
6
Issue 2, Nov 14
Objective 2: Identify the key benefits and features of the TRS option.
• Ball placement application on singulated substrates (BGA devices) improved by Z
locking towers
• Better print quality with improve co-planarity (TRP improvements)
• Better alignment capabilities through less tolerance stack up (active surround system)
• JEDEC tray, J boat, Flat boat
• Passive solder paste printing down to 01005
• Processing singulated substrates typically PGA, LGA flip chip devices for GPU or
CPU’s
• Processing multiple substrates from carriers in a single process stroke
• TRP (Top referencing plate) a structure that compresses the substrates removing
warpage
• Active surround for substrate alignment and snugging
• Z locking towers for substrate thickness variation
• Self-centring towers, with no alignment capabilities for improved throughput a low
carrier interference
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