TRS Advanced WB Intel Issue 02.pdf - 第7页

Issue 2, Objec t Nu m Nov 14 t ive 3: Ide n m be r 1 2 3 4 5 6 7 8 9 n tify the c c ompone n n ts of the T D T RS syst e D escription T R e m R S Advanc e e d Maintena 7 nce 7

TRS Advanced Maintenance

Issue 2, Nov 14

Objective 2: Identify the key benefits and features of the TRS option.

• Ball placement application on singulated substrates (BGA devices) improved by Z

locking towers

• Better print quality with improve co-planarity (TRP improvements)

• Better alignment capabilities through less tolerance stack up (active surround system)

• JEDEC tray, J boat, Flat boat

• Passive solder paste printing down to 01005

• Processing singulated substrates typically PGA, LGA flip chip devices for GPU or

CPU’s

• Processing multiple substrates from carriers in a single process stroke

• TRP (Top referencing plate) a structure that compresses the substrates removing

warpage

• Active surround for substrate alignment and snugging

• Z locking towers for substrate thickness variation

• Self-centring towers, with no alignment capabilities for improved throughput a low

carrier interference

Issue 2,

Objec

Nov 14

ive 3: Ide

tify the

ompone

ts of the

RS syst

escription

S Advanc

d Maintena

nce

TRS Advanced Maintenance

Issue 2, Nov 14

Objective 4: Theory of operation

Number the list below in the right sequence.

___ Z-Lock ON (Lock Heights)

___ Z-Lock OFF (Reset Heights)

___ Load Board

___ Table to Separation Height

___ Table to Print Height

___ Unload Board

___ Secure Board

___ Table to Transport Height

___ Fiducial Camera Sweep and Pre-Inspection

___ TRP to Home Position

___ Vacuum OFF

___ Table to Vision Height

___ End Print Run

___ Active Surround Snugger ON

___ Vacuum Pressure Check (Pre-Vision)

___ Print Board

___ TRP to Pressure Position

___ Table to Vision Height (Boards Flattened)

___ Active Surround Snugger OFF

___ Release Board

___ TRP to Forward Position

___ Vacuum ON

___ Vacuum Pressure Check

___ Board Printed