IPC J-STD-001E CN 焊接的电气与电子组件要求 2010年4月.pdf - 第10页
4.17 再流焊接 ................................................................12 4.17.1 通孔再流焊接（孔内焊膏） ...................................12 4.18 焊接连接 ................................................................13 4.18.1 暴…
⽬录
1 总则 ...............................................................................1
1.1 范围........................................................................1
1.2 目的........................................................................1
1.3 分级........................................................................1
1.4 测量单位及应用......................................................1
1.4.1 尺寸的验证 .............................................................1
1.5 对要求的说明 .........................................................1
1.5.1 部件缺陷和制程警示 ..............................................2
1.5.2 材料和工艺不符合 ..................................................2
1.6 一般要求 ................................................................2
1.7 优先顺序 ................................................................3
1.7.1 冲突........................................................................3
1.7.2 引用条款 ................................................................3
1.7.3 附录........................................................................3
1.8 术语和定义 .............................................................3
1.8.1 缺陷........................................................................3
1.8.2 处置........................................................................3
1.8.3 电气间隙 ................................................................3
1.8.4 高电压 ....................................................................3
1.8.5 制造商（组装厂） ..................................................3
1.8.6 客观证据 ................................................................3
1.8.7 过程控制 ................................................................4
1.8.8 制程警示 ................................................................4
1.8.9 熟练程度 ................................................................4
1.8.10 焊接终止面 .............................................................4
1.8.11 焊接起始面 .............................................................4
1.8.12 供应商 ....................................................................4
1.8.13 用户........................................................................4
1.8.14 导线过缠绕 .............................................................4
1.8.15 导线重叠 ................................................................4
1.9 要求下传 ................................................................4
1.10 员工熟练程度 ..........................................................5
1.11 验收要求 ................................................................5
1.12 通用组装要求 .........................................................5
1.13 其它要求 ................................................................5
1.13.1 健康和安全 .............................................................5
1.13.2 专用技术程序 .........................................................5
2 引⽤⽂件........................................................................5
2.1 EIA .........................................................................5
2.2 IPC .........................................................................6
2.3 联合工业标准 .........................................................7
2.4 ASTM .....................................................................7
2.5 静电放电协会 .........................................................7
3 材料、元器件和设备要求 ..............................................7
3.1 材料........................................................................7
3.2 焊料........................................................................7
3.2.1 无铅焊料 ................................................................7
3.2.2 焊料纯度的维持......................................................8
3.3 助焊剂 ....................................................................8
3.3.1 助焊剂涂敷 .............................................................9
3.4 焊膏........................................................................9
3.5 预成形焊料 .............................................................9
3.6 粘合剂 ....................................................................9
3.7 化学剥除剂 .............................................................9
3.8 元器件 ....................................................................9
3.8.1 元器件和密封损伤 ..................................................9
3.8.2 弯月面涂层 .............................................................9
3.9 焊接工具和设备......................................................9
4 焊接和组装通⽤要求......................................................9
4.1 静电放电（ESD） ..................................................9
4.2 设施 .......................................................................10
4.2.1 环境控制................................................................10
4.2.2 温度和湿度 ............................................................10
4.2.3 照明 .......................................................................10
4.2.4 现场装配作业 ........................................................10
4.3 可焊性 ...................................................................10
4.4 可焊性维护 ............................................................10
4.5 元器件表面涂层的去除 ..........................................10
4.5.1 除金 .......................................................................10
4.5.2 其他金属表面涂层的去除 ......................................11
4.6 热保护 ...................................................................11
4.7 不可焊元器件的返工..............................................11
4.8 焊接前清洁度要求 .................................................11
4.9 元器件安装通用要求..............................................11
4.9.1 应力释放................................................................11
4.10 孔阻塞 ...................................................................11
4.11 金属外壳元器件的隔离 ........................................11
4.12 粘合剂的覆盖范围 .................................................11
4.13 部件上安装部件（元器件叠装）............................11
4.14 连接器和接触区 .....................................................11
4.15 元器件的操作 ........................................................12
4.15.1 预热 .......................................................................12
4.15.2 冷却控制................................................................12
4.15.3 烘干／排气 ............................................................12
4.15.4 元器件和材料的持拿..............................................12
4.16 机器（非再流）焊接..............................................12
4.16.1 机器控制................................................................12
4.16.2 焊料槽 ...................................................................12
2010年4月 IPC J-STD-001E-2010
vii
4.17 再流焊接................................................................12
4.17.1 通孔再流焊接（孔内焊膏） ...................................12
4.18 焊接连接................................................................13
4.18.1 暴露的表面 ............................................................13
4.18.2 焊接连接缺陷 ........................................................13
4.18.3 部分可见或隐藏的焊接连接 ...................................13
4.19 可热收缩的焊接器件..............................................13
5 导线和接线柱连接 ........................................................14
5.1 导线和线缆的准备 .................................................14
5.1.1 绝缘皮损伤 ............................................................14
5.1.2 股线损伤................................................................14
5.1.3 多股导线上锡 ........................................................14
5.2 焊接接线柱 ............................................................15
5.3 叉形、塔形和槽形接线柱的安装............................15
5.3.1 柄部损伤................................................................15
5.3.2 翻边损伤................................................................15
5.3.3 喇叭口形翻边角度 .................................................15
5.3.4 接线柱安装 – 机械 .................................................16
5.3.5 接线柱安装 – 电气 .................................................16
5.3.6 接线柱焊接 ............................................................16
5.4 安装到接线柱 ........................................................16
5.4.1 通用要求................................................................16
5.4.2 双叉接线柱和塔形接线柱 ......................................18
5.4.3 槽形接线柱 ............................................................20
5.4.4 钩形接线柱 ............................................................20
5.4.5 穿孔接线柱 ............................................................21
5.4.6 焊锡杯和空心圆柱形接线柱 ...................................22
5.5 焊接到接线柱 ........................................................22
5.5.1 锡杯形和空心圆柱形接线柱 ...................................22
6 通孔安装和端⼦ ............................................................23
6.1 通孔端子通用要求 .................................................23
6.1.1 引线成形................................................................23
6.1.2 引线变形限度 ........................................................23
6.1.3 端子要求................................................................23
6.1.4 引线修整................................................................24
6.1.5 层间连接................................................................24
6.1.6 焊料中的弯月面涂层..............................................24
6.2 支撑孔 ...................................................................25
6.2.1 焊料的施加 ............................................................25
6.2.2 通孔元器件引线焊接............................................25
6.3 非支撑孔................................................................25
6.3.1 非支撑孔中引线端子要求 ......................................25
7 元器件的表⾯贴装 ........................................................26
7.1 表面贴装器件引线成形 ..........................................26
7.1.1 引线变形限度 ........................................................26
7.1.2 扁平封装平行度 .....................................................27
7.1.3 表面贴装器件引线的弯曲 ......................................27
7.1.4 扁平引线................................................................27
7.1.5 双列直插式封装（DIP） ........................................27
7.1.6 非表面贴装结构元器件 ..........................................27
7.2 有引线元器件本体的间隙 ......................................27
7.2.1 轴向引线元器件 ..................................................27
7.3 垛形引线贴装结构元器件 ......................................27
7.4 表面贴装引线的压紧..............................................27
7.5 焊接要求................................................................27
7.5.1 元器件偏移 ............................................................28
7.5.2 未规定及特殊要求 .................................................28
7.5.3 仅有底部端子 ........................................................29
7.5.4 片式元器件 – 矩形或方形端元器件 –
1、3或5面端子.......................................................30
7.5.5 圆柱体帽形端子 .....................................................31
7.5.6 城堡形端子 ............................................................32
7.5.7 扁平鸥翼形引线 .....................................................33
7.5.8 圆形或扁圆（精压）鸥翼形引线............................34
7.5.9 J 形引线 .................................................................35
7.5.10 垛形／I 形连接（不允许用于3级产品） ................36
7.5.11 扁平焊片引线 ........................................................37
7.5.12 仅有底部端子的高外形元器件 ...............................38
7.5.13 内弯L形带状引线...................................................39
7.5.14 表面贴装面阵列封装..............................................40
7.5.15 底部端子元器件（BTC） ......................................42
7.5.16 具有底部散热面端子的元器件（D-Pak） ..............43
7.5.17 平头柱连接 ............................................................44
7.6 特殊SMT端子 ........................................................44
8 清洗⼯艺要求................................................................45
8.1 免除清洗................................................................45
8.2 超声波清洗 ............................................................45
8.3 焊后清洁度 ............................................................45
8.3.1 颗粒物 ...................................................................45
8.3.2 助焊剂残留物和其它离子或有机污染物 .................45
8.3.3 焊后清洗标志 ........................................................45
8.3.4 清洗选项................................................................45
8.3.5 清洁度测试 ............................................................46
8.3.6 测试 .......................................................................46
9PCB要求 .......................................................................47
9.1 印制电路板损伤 .....................................................47
9.1.1 起泡／分层 ............................................................47
9.1.2 露织物／切纤维 .....................................................47
9.1.3 晕圈 .......................................................................47
9.1.4 连接盘分离 ............................................................47
9.1.5 连接盘／导体尺寸的减小 ......................................47
9.1.6 挠性电路的分层 .....................................................47
9.1.7 挠性电路的损伤 .....................................................47
9.1.8 烧焦 .......................................................................47
9.1.9 金接触件上的焊料 .................................................47
2010年4月IPC J-STD-001E-2010
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9.1.10 白斑 .......................................................................47
9.2 标记 .......................................................................48
9.3 弓曲和扭曲（翘曲）..............................................48
10 涂覆、灌封和加固（粘合剂） ......................................48
10.1 敷形涂覆................................................................48
10.1.1 应用 .......................................................................48
10.1.2 性能要求................................................................49
10.1.3 敷形涂覆检查 ........................................................49
10.1.4 敷形涂覆的返工 .....................................................49
10.2 灌封 .......................................................................49
10.2.1 应用 .......................................................................49
10.2.2 灌封材料性能要求 .................................................50
10.2.3 灌封材料返工 ........................................................50
10.2.4 灌封材料检查 ........................................................50
10.3 加固（粘合剂） .....................................................50
10.3.1 加固 .......................................................................51
10.3.2 加固（检查） ........................................................51
11 产品保证 .......................................................................51
11.1 要求处置的硬件缺陷..............................................51
11.2 检验方法................................................................51
11.2.1 工艺验证检验 ........................................................51
11.2.2 目检 .......................................................................51
11.2.3 抽样检查................................................................51
11.3 过程控制要求 ........................................................52
11.3.1 机会数的确定 ........................................................52
11.4 统计过程控制 ........................................................53
12 返⼯和维修 ...................................................................53
12.1 返工 .......................................................................53
12.2 维修 .......................................................................53
12.3 返工／维修后的清洗..............................................53
附录A 焊接⼯具和设备指南 ............................................55
附录B 最⼩电⽓间隙-导体间距 .......................................57
图
图1–1 过缠绕
....................................................................4
图1–2 重叠 .......................................................................4
图4–1 孔阻塞 ...................................................................11
图4–2 可接受的润湿角 .....................................................13
图5–1 翻边损伤................................................................16
图5–2 喇叭口形翻边角度 .................................................16
图5–3 接线柱安装 - 机械 .................................................16
图5–4 接线柱安装 - 电气 .................................................16
图5–5 绝缘间隙测量 ........................................................17
图5–6 导线布线维修环 .....................................................17
图5–7 应力释放示例 ........................................................17
图5-8 串联绕接................................................................18
图5–9 导线和引线缠绕 .....................................................18
图5–10 双叉接线柱的的侧面进线连接和缠绕 ....................19
图5-11 接线柱顶部和底部进线连接 ...................................20
图5–12 钩形接线柱连接 .....................................................21
图5–13 穿孔接线柱上的导线缠绕 ......................................22
图5–14 焊料（填充）高度 .................................................22
图6–1 引线弯曲................................................................23
图6–2 引线修整................................................................24
图6–3 垂直填充示例 ........................................................26
图7–1 表面贴装元件引线成形 ..........................................26
图7–2 表面贴装元件引线成形 ..........................................26
图7–3 仅有底部端子 ........................................................29
图7–4 矩形和方形端元器件..............................................30
图7–5 圆柱体帽形端子 .....................................................31
图7–6 城堡形端子 ............................................................32
图7–7 扁平、鸥翼形引线 .................................................33
图7–8 圆形或扁圆（精压）鸥翼形引线............................34
图7–9 J形引线 ..................................................................35
图7–10 垛形／I形连接 .......................................................36
图7–11 扁平焊片引线 ........................................................37
图7–12 仅有底部端子的高外形元器件 ...............................38
图7–13 内弯L形带状引线...................................................39
图7–14 BGA焊料球间隔 ....................................................40
图7–15 底部端子元器件 .....................................................42
图7–16 具有底部散热面端子的元器件 ...............................43
图7–17 平头柱端子 ............................................................44
表
表1–1 设计和制造规范
.....................................................3
表3–1 焊料槽中杂质的最大限值 .......................................8
表5–1 允许的受损股线数 .................................................15
表5–2 接线柱的焊接要求 .................................................17
表5–3 导线在塔形和直针形接线柱上的放置 ....................18
表5–4 AWG30及更细导线的缠绕要求 ..............................19
表5–5 双叉接线柱导线的放置 – 侧面进线 ........................19
表5-6 侧面进线直接穿过柱干的加固要求 –
双叉接线柱
............................................................20
表5–7 双叉接线柱导线的放置 – 底部进线 ........................20
表5–8 钩形接线柱导线的放置 ..........................................21
表5–9 导线在穿孔接线柱上的放置 ...................................21
表5-10 导线与柱干之间的焊料要求 ...................................22
表6–1 引线弯曲半径 ........................................................23
表6–2 引线在支撑孔中的伸出 ..........................................24
表6–3 非支撑孔中引线的伸出 ..........................................24
表6–4 有元器件引线的支撑孔，最低可接受条件 .............25
表6–5 有元器件引线的非支撑孔，
最低可接受条件
.....................................................25
表7–1 SMT引线成形后的最小引线长度 ...........................26
表7-2 表面贴装元器件 .....................................................28
表7–3 尺寸要求 -片式元器件 – 仅有底部端子 .................29
表7-4 尺寸要求 – 片式元器件 – 矩形或方形
端元器件 –1，3或5面端子
....................................30
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