IPC J-STD-001E CN 焊接的电气与电子组件要求 2010年4月.pdf - 第8页

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Patrick Kane, Raytheon System

Technology

Steven Herrberg, Raytheon Systems

Company

Paula Jackson, Raytheon Systems Ltd.

Lisa Cottone, Robins AFB

David Adams, Rockwell Collins

David Hillman, Rockwell Collins

Beverly MacTaggart, Rockwell

Collins

Douglas Pauls, Rockwell Collins

Gary Roper, Roper Resources, Inc.

Gaston Hidalgo, Samsung

Telecommunications America

Donald Daebler, Sanmina-SCI

Dan Kelsey, Scienscope International

Corporation

Finn Skaanning, Skaanning Quality &

Certification-SQC

Terry Clitheroe, Solder Technologies

Frank Hules, Stellar Microelectronics

Inc.

Mel Parrish, STI Electronics

Patricia Scott, STI Electronics

Tracy Clancy, Technical Training

Center

Jennifer Day, U.S. Army Aviation &

Missile Command

Sharon Ventress, U.S. Army Aviation

& Missile Command

Constantin Hudon, Varitron

Technologies Inc.

Denis Barbini, Vitronics Soltec

Lionel Fullwood, WKK Distribution

Ltd.

Steven Sauer, Xetron Corp.

J-STD-001技术组成员 (5-22aCN)

Zhang Yuan, Huawei Technologies

Co., Ltd.

Liu Yunji, Huawei Technologies Co.,

Ltd.

He Dapeng, Huawei Technologies

Co., Ltd.

J-STD-001技术组成员 (5-22aND)

Turi Bach Roslund, Bang &

Olufsen A/S

Keld Maaløe, BB Electronics A/S

Benny N. Nilsson, Ericsson AB

Oluf Richard Cramer, Flextronics A/S

Mona Johannesen, Flextronics A/S

Jesper Konge, Gåsdal

Bygningsindustri A/S

Michael Lassen, Grundfos A/S

Palle Lund Pedersen, Grundfos A/S

Svein Kolbu, Hadeland Produkter

Jens Andersen, HYTEK

Alex Christensen, HYTEK

Christian Houmann, HYTEK

Poul Juul, HYTEK

Anny Benthe Emmerud, Kongsberg

Defence & Aerospace AS

Gregers Dybdal, Linak A/S

Mari Pääkkönen, Nokia Siemens

Networks Oy

Torgrim Nordhus, Norautron AS

Jens R. Gøttler, OJ Electronics A/S

Finn Skaanning, Skaanning Quality &

Certification

Kai-Lykke Mathiasen, Styromatic A/S

Brian Jakobsen, Terma A/S

Michael Poulsen, Terma A/S

Torben Kruse, Vestas Control Systems

A/S

Jan Vindvik, WesternGeco

参与J-STD-001E中⽂版开发的5-22CN技术组成员名单

张源（主席）华为技术有限公司

郭建军宁波屹东电子股份有限公司

贺光辉工业和信息化部电子第五研究所

（中国赛宝实验室）

汤海林杭州华三通信技术有限公司

赵松涛深圳市易思维科技有限公司

杜娟诺基亚通信有限公司

李晓燕诺基亚通信有限公司

2010年4月 IPC J-STD-001E-2010

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IPC J-STD-001E-2010 2010年4月

⽬录

1 总则 ...............................................................................1

1.1 范围........................................................................1

1.2 目的........................................................................1

1.3 分级........................................................................1

1.4 测量单位及应用......................................................1

1.4.1 尺寸的验证 .............................................................1

1.5 对要求的说明 .........................................................1

1.5.1 部件缺陷和制程警示 ..............................................2

1.5.2 材料和工艺不符合 ..................................................2

1.6 一般要求 ................................................................2

1.7 优先顺序 ................................................................3

1.7.1 冲突........................................................................3

1.7.2 引用条款 ................................................................3

1.7.3 附录........................................................................3

1.8 术语和定义 .............................................................3

1.8.1 缺陷........................................................................3

1.8.2 处置........................................................................3

1.8.3 电气间隙 ................................................................3

1.8.4 高电压 ....................................................................3

1.8.5 制造商（组装厂） ..................................................3

1.8.6 客观证据 ................................................................3

1.8.7 过程控制 ................................................................4

1.8.8 制程警示 ................................................................4

1.8.9 熟练程度 ................................................................4

1.8.10 焊接终止面 .............................................................4

1.8.11 焊接起始面 .............................................................4

1.8.12 供应商 ....................................................................4

1.8.13 用户........................................................................4

1.8.14 导线过缠绕 .............................................................4

1.8.15 导线重叠 ................................................................4

1.9 要求下传 ................................................................4

1.10 员工熟练程度 ..........................................................5

1.11 验收要求 ................................................................5

1.12 通用组装要求 .........................................................5

1.13 其它要求 ................................................................5

1.13.1 健康和安全 .............................................................5

1.13.2 专用技术程序 .........................................................5

2 引⽤⽂件........................................................................5

2.1 EIA .........................................................................5

2.2 IPC .........................................................................6

2.3 联合工业标准 .........................................................7

2.4 ASTM .....................................................................7

2.5 静电放电协会 .........................................................7

3 材料、元器件和设备要求 ..............................................7

3.1 材料........................................................................7

3.2 焊料........................................................................7

3.2.1 无铅焊料 ................................................................7

3.2.2 焊料纯度的维持......................................................8

3.3 助焊剂 ....................................................................8

3.3.1 助焊剂涂敷 .............................................................9

3.4 焊膏........................................................................9

3.5 预成形焊料 .............................................................9

3.6 粘合剂 ....................................................................9

3.7 化学剥除剂 .............................................................9

3.8 元器件 ....................................................................9

3.8.1 元器件和密封损伤 ..................................................9

3.8.2 弯月面涂层 .............................................................9

3.9 焊接工具和设备......................................................9

4 焊接和组装通⽤要求......................................................9

4.1 静电放电（ESD） ..................................................9

4.2 设施 .......................................................................10

4.2.1 环境控制................................................................10

4.2.2 温度和湿度 ............................................................10

4.2.3 照明 .......................................................................10

4.2.4 现场装配作业 ........................................................10

4.3 可焊性 ...................................................................10

4.4 可焊性维护 ............................................................10

4.5 元器件表面涂层的去除 ..........................................10

4.5.1 除金 .......................................................................10

4.5.2 其他金属表面涂层的去除 ......................................11

4.6 热保护 ...................................................................11

4.7 不可焊元器件的返工..............................................11

4.8 焊接前清洁度要求 .................................................11

4.9 元器件安装通用要求..............................................11

4.9.1 应力释放................................................................11

4.10 孔阻塞 ...................................................................11

4.11 金属外壳元器件的隔离 ........................................11

4.12 粘合剂的覆盖范围 .................................................11

4.13 部件上安装部件（元器件叠装）............................11

4.14 连接器和接触区 .....................................................11

4.15 元器件的操作 ........................................................12

4.15.1 预热 .......................................................................12

4.15.2 冷却控制................................................................12

4.15.3 烘干／排气 ............................................................12

4.15.4 元器件和材料的持拿..............................................12

4.16 机器（非再流）焊接..............................................12

4.16.1 机器控制................................................................12

4.16.2 焊料槽 ...................................................................12

2010年4月 IPC J-STD-001E-2010

vii