00192405-02.pdf - 第174页
5 Station extensions User Manual S IPLACE S-25 H M 5.5 Ceramic substrate centering Software Vers ion SR.502.xx 01/2001 US Edition 174 Fig. 5.5 - 2 Ceramic subst rate centering (side view) (1) Connec ting nozz le (2) ‘ Ce…
User Manual SIPLACE S-25 HM 5 Station extensions
Software Version SR.502.xx 01/2001 US Edition 5.5 Ceramic substrate centering
173
Fig. 5.5 - 1 General overview (plan view)
5 Station extensions User Manual SIPLACE S-25 HM
5.5 Ceramic substrate centering Software Version SR.502.xx 01/2001 US Edition
174
Fig. 5.5 - 2 Ceramic substrate centering (side view)
(1) Connecting nozzle
(2) ‘Ceramic substrate centering’ sensor
(3) Base
5.5.3.3 Maintenance
– Clean and grease the ball race in the X-axis centering unit.
– If necessary, check that the pneumatic driving mechanism is running smoothly.
– The conveyor should be maintained as described in the maintenance instructions.
User Manual SIPLACE S-25 HM 5 Station extensions
Software Version SR.502.xx 01/2001 US Edition 5.5 Ceramic substrate centering
175
5.5.4 Technical data
5.5.5 Optical centering with oblique lighting
5.5.5.1 General
For optical centering, the special features of the ceramic substrate must be taken into account.
The contrast depends very much on the paste used for the adjustment structure, the clear area
surrounding the adjustment structure, and the type of illumination. 5
The oblique lighting unit is located on the front part of the sub-gantry camera. 5
Fig. 5.5 - 3 Oblique lighting unit for the sub-gantry camera
5
5
Substrate format 50 mm x 50 mm to 100 mm x 180 mm
Substrate thickness 0.5 mm to 1.5 mm
Substrate model unscribed (without problems)
scribed (requires testing)
Support on the conveyor 2.5 mm
Optical centering: field of view of the PCB vision module
Type of illumination for light pastes:
Type of illumination for dark pastes and close spacing to
adjacent structures (> 1 mm)
5.7 mm x 5.7 mm
PCB vision module (standard)
Oblique lighting (option)
Fiducial criteria See PCB vision module position recog-
nition
Mechanical centering:
X/Y centering accuracy ± 0.07 mm / 4 sigma
PCB underside clearance 12 mm
Compressed air connection 5.5 bar