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User Manual SIPLAC E S-25 HM 1 Introduction, technical data Software Version SR.502.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads 39 – The co mponent vision camera creates an image of the c urrent …
1 Introduction, technical data User Manual SIPLACE S-25 HM
1.13 Overview of the modules - placement heads Software Version SR.502.xx 01/2001 US Edition
38
1.13 Overview of the modules - placement heads
1.13.1 Structure of the 12-segment collect&place head
1
Fig. 1.13 - 1 Structure of the 12-segment collect&place head
All the components are inserted with the same cycle time. Before the component is inserted,
it is measured by the optoelectronic vision module. 1
(1) Star with 12 sleeves (2) Motor for "Reject" valve adjustment drive
(3) Turning station (4) Component vision module
(5) Z-axis drive (6) Star motor
User Manual SIPLACE S-25 HM 1 Introduction, technical data
Software Version SR.502.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads
39
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
1.13.2 Description of the 12-segment collect&place head
– The 12-segment collect&place head works using the "collect & place" principle, i.e. the com-
ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– Defective components are rejected and are picked up again during a repair run.
1.13.3 Technical data - 12-segment collect&place head
1
Range of components 0402 to PLCC44, including BGA, µBGA, flip-chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
6 mm
0.5 mm
0.35 mm
0.2 mm
0.5 mm x 1.0 mm
18.7 mm x 18.7 mm
2 g
Maximum stroke of the Z axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 12,500 components/h
Nozzle types 9xx
Angular accuracy ± 0.70° / 4 σ
Placement accuracy ± 90 µm / 4 σ
1 Introduction, technical data User Manual SIPLACE S-25 HM
1.13 Overview of the modules - placement heads Software Version SR.502.xx 01/2001 US Edition
40
1.13.4 Structure of the 6-segment collect&place head with standard component
vision module
1
Fig. 1.13 - 2 Overview of the 6-segment collect&place head with standard component vision module
(1) Star with 6 sleeves
(2) Motor for "Reject" valve adjustment drive
(3) Turning station
(4) Standard vision module
(5) Z axis driving mechanism
(6) Star motor
1