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User Manual SIPLAC E S-25 HM 1 Introduction, technical data Software Version SR.502.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads 41 1.13 .5 Descr iption of the 6 -segmen t colle ct&plac e head…
1 Introduction, technical data User Manual SIPLACE S-25 HM
1.13 Overview of the modules - placement heads Software Version SR.502.xx 01/2001 US Edition
40
1.13.4 Structure of the 6-segment collect&place head with standard component
vision module
1
Fig. 1.13 - 2 Overview of the 6-segment collect&place head with standard component vision module
(1) Star with 6 sleeves
(2) Motor for "Reject" valve adjustment drive
(3) Turning station
(4) Standard vision module
(5) Z axis driving mechanism
(6) Star motor
1
User Manual SIPLACE S-25 HM 1 Introduction, technical data
Software Version SR.502.xx 01/2001 US Edition 1.13 Overview of the modules - placement heads
41
1.13.5 Description of the 6-segment collect&place head
The functionality of the 6-segment revolver head is similar to that of the 12-segment revolver head.
With its standard vision module, the 6-segment revolver head can quickly and accurately place
ICs with an edge length of up to 32mm x 32mm. It really comes into its own when there is a very
high proportion of ICs in the placement process. The cycle time of the 6-segment revolver head
depends on the dimensions and number of component leads or bumps. 1
1.13.6 Technical data of the 6-segment collect&place head with standard compo-
nent vision module
1
Component range 0603 to 32mm x 32mm
PLCC,SO, QFP, TSDP, SOT, MELF,
CHIP, IC, BGA
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.5 mm
0.56 mm
0.32 mm
0.5 mm x 1.0 mm
32 mm x 32 mm
5 g
Maximum stroke of the Z axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 8xx, 9xx
Nozzle types 8.000 BE/h
Angular accuracy ± 0.30° / 4 σ
Placement accuracy ± 80 µm / 4 σ
1 Introduction, technical data User Manual SIPLACE S-25 HM
1.14 Overview of the modules - vision modules Software Version SR.502.xx 01/2001 US Edition
42
1.14 Overview of the modules - vision modules
Each placement system has 1
– two component vision cameras on the placement heads and
– two PCB vision cameras on the underside of the X-axis gantries.
1
The vision analysis unit is located in the control unit for the placement system and the component
vision module is used to determine: 1
– the precise position of the components at the nozzle and
– the geometry of the package form.
1
The PCB vision module uses fiducials on the PCBs to determine: 1
– the position of the PCB,
– its rotation angle
– and the PCB delay.
1
The PCB vision module also uses fiducials on the feeder modules to determine the exact pick-up
position of components, which is particularly important for small components. 1
1.14.1 Technical data - component vision module on the 12-segment collect&place
head
Component dimensions 0.5 mm x 1.0 mm up to 18.7 mm x 18.7 mm
Range of components 0402 to PLCC44
including BGA, µBGA, flip-chip, TSOP, QFP
PLCC, SO to SO32, DRAM
Min. lead pitch 0.5 mm
Field of vision 24 mm x 24 mm
Illumination method Front-lighting
(3 levels programmable as required)