[Renewal UI] Chapter4_3D Inspector_CHN 20130305.pdf - 第3页
Pr ogra mmer ’ s Manual | 3 Table of Content s Table of Contents ................................................................................ 3 1. 3D Inspe ctor™ 简介 ...................................................…
2 | Chapter 4. 3D Inspector
3D Solder Paste Inspection System
KOH YOUNG TECHNOLOGY INC.
Revision History
Date Revision Writer Comments
28. Nov. 2008 1.0 Created
30. Aug. 2010 2.0 Lucy Lee
GUI Ver. 3.6.2203
20. Jul. 2012 2.1 Lucy Lee
GUI Ver. 3.6.2500P08
Programmer’s Manual | 3
Table of Contents
Table of Contents ................................................................................ 3
1. 3D Inspector™简介 ......................................................................... 6
2. 3D Inspector™的两种模式 .............................................................. 7
3. 3D Inspector™画面结构 .................................................................. 8
3.1. 主菜单......................................................................................................... 9
3.1.1. Production ................................................................................................. 9
3.1.2. Job Creation ............................................................................................ 10
3.1.3. SPC ......................................................................................................... 20
3.1.4. Setting ..................................................................................................... 21
3.1.5. Diagnosis ................................................................................................. 43
3.1.6. Favorite ................................................................................................... 45
3.1.7. Help ......................................................................................................... 45
3.2. 执行检测工具栏 ........................................................................................ 47
3.3. SPI设备状态显示领域 ............................................................................... 48
3.4. 主界面....................................................................................................... 49
3.4.1. 手动输入条形码........................................................................................ 50
3.4.2. 查询JOB文件名/Pad数量 ......................................................................... 50
3.4.3. 当前FOV Step /总Step数 .......................................................................... 50
3.4.4. PCB View 选项 ........................................................................................ 50
3.5. 不良信息（Defect View） ........................................................................ 52
3.5.1. 查看不良图像及Pad ................................................................................. 53
3.6. 详细信息（Detail View） ......................................................................... 54
3.7. 进行状态查询对话框 ................................................................................. 55
4. 3D Inspector™执行步骤 ................................................................ 59
4.1. 设置及更改用户权限 ................................................................................. 60
4.1.1. 更改用户 .................................................................................................. 60
4.1.2. 设置用户权限 ........................................................................................... 61
4.1.3. 增加/修改/删除用户 .................................................................................. 62
4.2. 载入及编辑JOB文件 ................................................................................. 64
4 | Chapter 4. 3D Inspector
3D Solder Paste Inspection System
KOH YOUNG TECHNOLOGY INC.
4.2.1. PCB生产数量 ........................................................................................... 64
4.2.2. 载入JOB文件 ........................................................................................... 65
4.2.3. 编辑JOB文件 ........................................................................................... 66
4.3. Teaching .................................................................................................. 67
4.3.1. Bare Board Teaching ............................................................................... 67
4.3.2. Multi-Vendor Teaching ............................................................................. 69
4.3.3. Fiducial Teaching ..................................................................................... 73
4.3.4. Bad Mark Teaching .................................................................................. 76
4.4. 更改检测条件 ............................................................................................ 79
4.5. PCB检测 .................................................................................................. 80
5. 附件 ................................................................................................ 81