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Pr ogra mmer ’ s Manual | 5 List of Figur es Figure 2 - 1. Sing le Lane 模式和 Dual La ne 模式的差异 .......................................................................... 7 Figure 3 - 1. 3 D Inspect or™ 的画面结构 ..............…

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4 | Chapter 4. 3D Inspector
3D Solder Paste Inspection System
KOH YOUNG TECHNOLOGY INC.
4.2.1. PCB生产数量 ........................................................................................... 64
4.2.2. 载入JOB文件 ........................................................................................... 65
4.2.3. 编辑JOB文件 ........................................................................................... 66
4.3. Teaching .................................................................................................. 67
4.3.1. Bare Board Teaching ............................................................................... 67
4.3.2. Multi-Vendor Teaching ............................................................................. 69
4.3.3. Fiducial Teaching ..................................................................................... 73
4.3.4. Bad Mark Teaching .................................................................................. 76
4.4. 更改检测条件 ............................................................................................ 79
4.5. PCB检测 .................................................................................................. 80
5. 附件 ................................................................................................ 81
Programmer’s Manual | 5
List of Figures
Figure 2-1. Single Lane模式和Dual Lane模式的差异.......................................................................... 7
Figure 3-1. 3D Inspector™的画面结构 ................................................................................................. 8
Figure 3-2. 主菜单组成 ......................................................................................................................... 9
Figure 3-3. Fiducial Tool对话框– Basic标签................................................................................. 11
Figure 3-4. Fiducial Tool0对话框- Shape标签................................................................................. 13
Figure 3-5. Fiducial Tool对话框 - Fiducial Move标签 .................................................................. 14
Figure 3-6. Fiducial Tool对话框 - ROI Move标签 ........................................................................... 15
Figure 3-7. Fiducial Tool对话框 – Teaching标签 ......................................................................... 16
Figure 3-8. Fiducial Tool对话框-Add Fid.标签 ............................................................................... 17
Figure 3-9. Settings对话框–检测选择 ............................................................................................. 21
Figure 3-10. Settings对话框– 显示 ................................................................................................. 26
Figure 3-11. Settings对话框 – 照明选项 ........................................................................................ 27
Figure 3-12. Settings对话框 – 高级功能 ........................................................................................ 28
Figure 3-13. Settings对话框 – 保存 ............................................................................................... 29
Figure 3-14. Settings对话框 – 输出 ............................................................................................... 30
Figure 3-15. Settings对话框 – 条形码 ........................................................................................... 31
Figure 3-16. Settings对话框 –检测类型 .......................................................................................... 32
Figure 3-17. 生产数量对话框.............................................................................................................. 43
Figure 3-18. Communication Data Dialog Box .................................................................................. 46
Figure 3-19. 主界面 ............................................................................................................................ 49
Figure 3-20. 手动输入条形码对话框 ................................................................................................... 50
Figure 3-21. Inspection Result Dialog Box .................................................................................... 52
Figure 3-22. 进行状态查询对话框 ...................................................................................................... 55
Figure 4-1. 3D INSPECTOR™执行步骤 ................................................................................................... 59
Figure 4-2. PCB生产数量对话框 .......................................................................................................... 64
6 | Chapter 4. 3D Inspector
3D Solder Paste Inspection System
KOH YOUNG TECHNOLOGY INC.
1. 3D INSPECTOR™简介
本章主要介绍3D Inspector™功能。
3D Inspector™是通过三维检测PCB锡膏印刷形态判断PCB合格与不合格的程序。
3D Inspector™基于CEditor™输入的JOB文件 （ *.mdb ） 检测PCB ， 其检测结果通过SPC Plus™生成
PCB锡膏状态检测统计资料。因此 ， 3D Inspector™在画面显示3D形状数据 ， 可以采取防止重复性
不良的对策。
3D Inspector™主要功能如下。
PCB锡膏印刷状态检测功能
根据PCB锡膏印刷状态缺陷向用户报警功能
辨别PCB锡膏印刷状态缺陷类型及画面显示
针对PCB检测情况的画面显示
SPI设备设置及控制功能
与CEditor™或SPC Plus™联动