Koh Young AOIGUI Programming Manual V2.7.4.pdf - 第5页
K oh Y oung Technolog y Inc. 5 5.3. 对元件引脚的预设置及 检测条件设 置 ................................................................................ 136 5.4. 对 Chips 的检测条件设 置 (Solder Fillet only) .....................................…
Koh Young Technology Inc.
4
目录
1. 序言 .................................................................................................................... 7
1.1. 必备程序及信息 .......................................................................................................................... 7
1.2. 程式编程步骤及检测项目 ......................................................................................................... 7
2. 基本软件 ......................................................................................................... 10
2.1. ePM-AOI ................................................................................................................................... 11
2.2. AOI GUI ...................................................................................................................................... 13
2.3. 维修站 ......................................................................................................................................... 66
3. 加载程式 ......................................................................................................... 75
3.1. 打开程式文件 ............................................................................................................................ 75
3.2. 自动导入最近打开的程式文件 ............................................................................................... 82
4. 生成程式文件 ................................................................................................. 83
4.1. 生成KYPCB文件 ........................................................................................................................ 84
4.2. 基准点校准 ................................................................................................................................ 88
4.3. 采集图片 .................................................................................................................................... 96
4.4. CRD导入 ..................................................................................................................................... 99
4.5. 封装登录 .................................................................................................................................. 101
4.6. 代替料号(Alternative Part) .................................................................................................. 106
4.7. 设置检测条件 .......................................................................................................................... 112
4.8. Copy & Paste Condition ...................................................................................................... 114
5. 检测条件设置 ............................................................................................... 116
5.1. 定义检测算法&封装类型 ...................................................................................................... 117
5.2. 对元件本体的预设置及检测条件设置................................................................................. 120
Koh Young Technology Inc.
5
5.3. 对元件引脚的预设置及检测条件设置 ................................................................................ 136
5.4. 对Chips的检测条件设置(Solder Fillet only) ..................................................................... 150
5.5. 在不良视图上确认检测结果 ................................................................................................. 154
5.6. PressFit Inspection Condition ............................................................................................ 158
5.7. Through Hole Inspection .................................................................................................... 161
6. 高级功能（Advanced Functions） ......................................................... 167
6.1. Job Tag Set（程式标记） .................................................................................................... 167
6.2. Array Barcode Automatic Mapping ................................................................................. 174
6.3. Register All Chips .................................................................................................................. 177
6.4. 距离检测功能(Pairing Inspection) ..................................................................................... 181
6.5. Auto-Tuning (Inspection Condition Learning, ICL) ...................................................... 187
6.6. 2D本体定位功能(2D Body Finding) ................................................................................... 190
6.7. Flipper（翻转机） ................................................................................................................. 195
6.8. 以GPU重建元件的3D图像 .................................................................................................... 198
7. 程式管理器(Job Manager) ...................................................................... 202
7.1. 运行程式管理器 ...................................................................................................................... 202
7.2. 界面构成 .................................................................................................................................. 205
7.3. 调整主界面 .............................................................................................................................. 208
7.4. 程式管理器(Job Manager)的主要功能 .............................................................................. 212
7.5. 配置 ........................................................................................................................................... 226
8. OPO (Offline Program Optimizer) ......................................................... 228
8.1. 界面构成 .................................................................................................................................. 228
8.2. 选项设置 .................................................................................................................................. 241
8.3. OPO使用步骤 .......................................................................................................................... 246
Koh Young Technology Inc.
6
9. OLP(Off-line Programming) ................................................................... 262
9.1. 收集数据 .................................................................................................................................. 262
9.2. 运行OLP模式 ........................................................................................................................... 265
9.3. Job Deploy .............................................................................................................................. 266
10. 自动验证(Auto Verification) .................................................................... 268
10.1. 自动验证基本设置 .................................................................................................................. 268
10.2. 运行自动验证 .......................................................................................................................... 277
11. Whole Board Foreign Material Inspection (整板异物检测) ........... 279
11.1. 需求 ........................................................................................................................................... 279
11.2. 使用方法 .................................................................................................................................. 280
11.3. WFMI 手动检测 ..................................................................................................................... 289
12. 长板检测(Long Board Inspection)选项 ............................................... 291
12.1. 系统要求 .................................................................................................................................. 292
12.2. 详细设置方法 .......................................................................................................................... 292
12.3. 进行长板检测 .......................................................................................................................... 299
12.4. 长板例外处理 .......................................................................................................................... 301
13. 侧面相机(Side Camera Option) ............................................................ 303
13.1. 设置方法 .................................................................................................................................. 303
13.2. 校准方法 .................................................................................................................................. 305
13.3. 用户界面更改 .......................................................................................................................... 308