IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第100页

4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for SOD 123 components. Component Identifier L (mm) S (mm) W1 (mm) W2 (mm) T (mm) H min max min max min max min max min max max SOD 123 3.55 3.85 2.35 2.…

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1.0 SCOPE
This subsection provides the component and land pattern
dimensions for SOD 123 (small outline diode) components.
Basic construction of the SOD 123 device is also covered. At
the end of this subsection is a listing of the tolerances and
target solder joint dimensions used to arrive at the land pat-
tern dimensions.
2.0 APPLICABLE DOCUMENTS
See Section 8.0 for documents applicable to the subsections.
2.1 Electronic Industries Association (EIA)
JEDEC Pub-
lication 95 Registered and Standard Outlines for Solid State
and Related Products, DO-214, Issue ‘‘B’’ dated 3/91
Application for copies should be addressed to:
Global Engineering Documents
1990 M Street N.W.
Washington, DC
3.0 COMPONENT DESCRIPTIONS
3.1 Basic Construction
The small outline diode comes in
two configurations. One is gullwing-leaded as shown in Figure
1. The other is molded with terminations as dimensioned in
Figure 2.
3.1.1 Termination Materials
Leads should be solder-
coated with a tin/lead alloy. The solder should contain
between 58 to 68% tin. Solder may be applied to the leads by
hot dipping or by plating from solution. Plated solder termina-
tions should be subjected to post-plating reflow operation to
fuse the solder. The tin/lead finish should be at least 0.0075
mm [0.0003 in] thick.
Solder finish applied over precious metal electrodes should
have a diffusion barrier layer between the electrode metalliza-
tion and the solder finish. The barrier layer should be nickel or
an equivalent diffusion barrier, and should be at least 0.00125
mm [0.00005 in] thick.
3.1.2 Marking
Parts are available with or without marked
values.
3.1.3 Carrier Package Format Carrier package formats
are tape and reel; 12 mm tape/8 mm pitch.
3.1.4 Resistance to Soldering
Parts should be capable of
withstanding ten cycles through a standard reflow system
operating at 215°C. Each cycle shall consist of 60 seconds
exposure at 215°C. Parts must also be capable of withstand-
ing a minimum of 10 seconds immersion in molten solder at
260°C.
IPC-782-8-8-1
Figure 1 SOD 123 construction
IPC-SM-782
Surface Mount Design
and Land Pattern Standard
Date
5/96
Section
8.8
Revision
A
Subject
SOD 123
Page1of4
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4.0 COMPONENT DIMENSIONS
Figure 2 provides the component dimensions for SOD 123 components.
Component
Identifier
L (mm) S (mm) W1 (mm) W2 (mm) T (mm) H
min max min max min max min max min max max
SOD 123 3.55 3.85 2.35 2.93 0.45 0.65 1.40 1.70 0.25 0.60 1.35
SMB 5.21 5.59 2.17 3.31 1.96 2.21 3.30 3.94 0.76 1.52 2.41
Figure 2 SOD 123 component dimensions
IPC-782-8-8-2
IPC-SM-782
Subject
SOD 123
Date
5/96
Section
8.8
Revision
A
Page2of4
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5.0 LAND PATTERN DIMENSIONS
Figure 3 provides the land pattern dimensions for SOD 123
components. These numbers represent industry consensus
on the best dimensions based on empirical knowledge of fab-
ricated land patterns.
In the table, the dimensions shown are at maximum material
condition (MMC). The least material condition (LMC) should
not exceed the fabrication (F) allowance shown on page 4.
The LMC and the MMC provide the limits for each dimension.
The dotted line in Figure 3 shows the grid placement court-
yard which is the area required to place land patterns and
their respective components in adjacent proximity without
interference or shorting. Numbers in the table represent the
number of grid elements (each element is 0.5 by 0.5 mm) in
accordance with the international grid detailed in IEC publica-
tion 97.
RLP No.
Component
Identifier Z (mm) G (mm) X (mm)
Y (mm) C (mm)
X-Z Placement Grid
(No. of Grid Elements)ref ref
220A SOD 123 5.00 1.80 0.80 1.60 3.40 4X12
221A SMB 6.80 2.00 2.40 2.40 4.40 8X16
Figure 3 SOD 123 land pattern dimensions
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▼
▼
▼
▼
▼
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C
G
Z
X
Y
Grid
placement
courtyard
▼
IPC-782-8-8-3
IPC-SM-782
Subject
SOD 123
Date
5/96
Section
8.8
Revision
A
Page3of4
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