IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第122页

4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for SSOIC components. Component Identiﬁer JEDEC Number L (mm) S (mm) W (mm) A (mm) B (mm) H (mm) T (mm) P (mm) min max min max min max min max min max m…

1.0 SCOPE

This subsection provides the component and land pattern

dimensions for small outline integrated circuits (SSOIC com-

ponents) with gullwing leads. Basic construction of the SSOIC

device is also covered. At the end of this subsection is a list-

ing of the tolerances and target solder joint dimensions used

to arrive at the land pattern dimensions.

2.0 APPLICABLE DOCUMENTS

See Section 9.0 and the following for documents applicable to

this subsection.

2.1 Electronic Industries Association

JEDEC Publication 95

Registered and Standard Outlines for

Solid State and Related Products, ‘‘Small Outline Gullead, 12

mm Body, 0.80 mm lead Spacing,’’ Outline M0-117, issue

‘‘A,’’ and ‘‘Shrink Small Outline Package Family, 7.62 mm

body, 0.635 mm,’’ Outline MO-018, issue ‘‘A’’

Application for copies should be addressed to:

Global Engineering Documents

1990 M Street N.W.,

Washington,DC

3.0 COMPONENT DESCRIPTIONS

These components are all on 0.635 mm pitch, and are avail-

able in wide body (7.50 mm) and extra wide body (12.00 mm)

sizes, ranging from 48 to 64 pins.

3.1 Basic Construction

See Figure 1. Basic construction

consists of a plastic body and metallic leads.

3.1.1 Termination Materials

Leads should be solder-

coated with a tin/lead alloy. The solder should contain

between 58 to 68% tin. Solder may be applied to the termi-

nation by hot dipping or by plating from solution. Plated sol-

der terminations should be subjected to a post-plating reflow

operation to fuse the solder. The tin/lead finish should be at

least 0.00075 mm [0.0003 in] thick.

3.1.2 Marking

All parts shall be marked with a part number

and ‘‘Pin 1’’ location. ‘‘Pin 1’’ location may be molded into the

plastic body.

3.1.3 Carrier Package Format

Bulk rods, 24 mm tape/

8–12 mm pitch is preferred for best handling. Tube carriers

are also used.

3.1.4 Resistance to Soldering

Parts should be capable of

withstanding ten cycles through a standard reflow system

operating at 215°C. Each cycle shall consist of 60 seconds

exposure at 215°C. Parts must also be capable of withstand-

ing a minimum of 10 seconds immersion in molten solder at

260°C.

IPC-782-9-2-1

Figure 1 SSOIC construction

IPC-SM-782

Surface Mount Design

and Land Pattern Standard

Date

5/96

Section

9.2

Revision

Subject

SSOIC

Page1of4

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4.0 COMPONENT DIMENSIONS

Figure 2 provides the component dimensions for SSOIC components.

Component

Identiﬁer

JEDEC

Number

L (mm) S (mm) W (mm) A (mm) B (mm) H (mm) T (mm)

(mm)

min max min max min max min max min max min max min max basic

SS048 M0118

10.03 10.67 7.99 8.95 0.20 0.30 7.40 7.60 15.75 16.00 2.41 2.20 0.51 1.02 0.635

SS056 M0118

10.03 10.67 7.99 8.95 0.20 0.30 7.40 7.60 18.29 18.54 2.41 2.20 0.51 1.02 0.635

S064 M0117 14.00 14.50 12.40 13.05 0.30 0.45 11.90 12.10 26.17 26.43 1.92 2.00 0.51 0.80 0.800

Figure 2 SSOIC component dimensions

▼

A S

▼

IPC-782-9-2-2

IPC-SM-782

Subject

SSOIC

Date

5/96

Section

9.2

Revision

Page2of4

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5.0 LAND PATTERN DIMENSIONS

Figure 3 provides the land pattern dimensions for SSOIC

components. These numbers represent industry consensus

on the best dimensions based on empirical knowledge of fab-

ricated land patterns.

In the table, the dimensions shown are at maximum material

condition (MMC). The least material condition (LMC) should

not exceed the fabrication (F) allowance shown on page 4.

The LMC and the MMC provide the limits for each dimension.

The dotted line in Figure 3 shows the grid placement court-

yard which is the area required to place land patterns and

their respective components in adjacent proximity without

interference or shorting. Numbers in the table represent the

number of grid elements (each element is 0.5 by 0.5 mm) in

accordance with the international grid detailed in IEC publica-

tion 97.

RLP No.

Component

Identiﬁer Z (mm) G (mm) X (mm)

YCDE

Placement Grid

(No. Grid

Elements)ref (mm) ref (mm) ref (mm) ref (mm)

330A SS048 11.60 7.20 0.40 2.20 9.40 14.61 0.64 24x34

331A SS056 11.60 7.20 0.40 2.20 9.40 17.15 0.64 24x38

332A S064 15.40 11.40 0.50 2.00 13.40 24.80 0.80 32x54

Figure 3 SSOIC land pattern dimensions

▼

GCZ

▼

Full radius typical

Grid placement courtyard

▼

IPC-782-9-2-3

IPC-SM-782

Subject

SSOIC

Date

5/96

Section

9.2

Revision

Page3of4

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