IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第3页
IPC-SM-782A Surface Mount Design and Land Pattern Standard Developed by the Surface Mount Land Patterns Subcommittee (1-13) of the Printed Board Design Committee (1-10) of IPC Users of this standard are encouraged to par…
The Principles of
Standardization
In May 1995 the IPC’s Technical Activities Executive Committee adopted Principles of
Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should:
• Show relationship to Design for Manufacturability
(DFM) and Design for the Environment (DFE)
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feedback system on use and
problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot
be defended with data
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Statement on
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Revision Change
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©Copyright 1999. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions.
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IPC-SM-782A
Surface Mount Design
and Land Pattern
Standard
Developed by the Surface Mount Land Patterns Subcommittee (1-13)
of the Printed Board Design Committee (1-10) of IPC
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
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Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Surface Mount Land Patterns Subcommittee of the Printed Board Design Committee are shown below, it is not
possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of the IPC
extend their gratitude.
Printed Board Design
Committee
Surface Mount Land Patterns
Subcommittee
Technical Liaison of the
IPC Board of Directors
Chairman
Joe Fjelstad
Tessera Inc.
Chairman
Nick Mescia
General Dynamics
Advanced Technology
Stan Gentry
Noble Industries Ltd.
Surface Mount Land Patterns Subcommittee
Anderson, R., AT&T Interconnect
Center of Excellence
Artaki, I., Lucent Technologies Inc.
Baker, R.J., Central Texas Electronics
Association (CTEA)
Banks, S., Trimble Navigation
Barlow, M., Lytton Inc.
Belin, J., Automata Inc.
Berkman, E., Excalibur Systems Inc.
Bittle, D.W., Raytheon Aircraft
Company
Boerdner, R.W., EJE Research
Bourque, J., Shure Brothers Inc.
Brydges, P., Panametrics Inc.
Burg, J.S., 3M Company
Cash, A.S., Northrop Grumman
Corporation
Caterina, J., Northrop Grumman
Corporation
Clifton, L., Intel Corporation
Cohen, L., Formation Inc.
Collins, S., Texscan Corporation
Couble, E.C., Shipley Co.
Coucher, M.M., Sequent Computer
Systems Inc.
Crowley, B., Hewlett Packard
Laboratories
D’Andrade, D., The Surface Mount
Technology Centre Inc.
Daugherty, D., Siemens Energy &
Automation
Davy, J., Northrop Grumman
Electronic Sensors & Systems Div
Dieffenbacher, W.C., Lockheed
Martin Corporation
DiFranza, M.J., The Mitre Corp.
Dolence, C., Tektronix Board Build
Operation
Easterling, T., SCI Systems Inc.
Edwards, W.J., Lucent Technologies
Inc.
Eldan, E., Orbotech Inc.
Engelmaier, W., Engelmaier
Associates Inc.
Feldmesser, H.S., Johns Hopkins
University
Firestein, I., Tadiran Telecom Group
Freedman, M.G., Amp Inc.
Giardina, J., Miteq Inc.
Grannells, R.T., United Technologies
Gray, B.W., Bull Electronics
Gray, F.L., Texas Instruments Inc.
Hargreaves, L., DC. Scientific Inc.
Hartsgrove, M., I-CON Industries
Inc.
Hastings, D.W., Lockheed Martin
Aeronutronic
Heath, B., TMD (Technology
Manufacturing Inc.)
Hersey, R.J., Ralph Hersey &
Associates
Hinton, P.E., Hinton PWB
Engineering
Holland, D.L., Sanders, A Lockheed
Martin Co.
Horton, R.N., Northrop Grumman
Electronic Sensors & Systems Div
Humpal, T.L., O.E.M. Worldwide
Hymes, L., The Complete Connection
Jawitz, M.W., Eimer Company
Johnson, B., Pacific Testing
Laboratories, Inc.
Johnson, K.L., Hexacon Electric
Company
Kemp, C.A., Lockheed Martin
Corporation
Kenyon, W.G., Global Centre for
Process Change
Kern, T., Axiom Electronics, Inc.
Knapp, C.W., Litton Guidance &
Control Systems
Koebert, M., Eaton Corp.
Korf, D.W., Zycon Corporation
Korth, C.M., Hibbing Electronics
Corp.
Kotecki, G.T., Northrop Grumman
Corporation
Lambert, L.P., EPTAC Corporation
Landolt, R.H., Enthone-OMI Inc.
Maguire, J.F., Boeing Defense &
Space Group
Malanchuk, D.J., Eastman Kodak Co.
KAD
Malewicz, W.R., Siemens Medical
Electronics
Mather, J.C., Rockwell International
Metcalf, R.J., Morton Electronic
Materials
Miller, R.F., Lockheed Martin
Corporation
MiLosh, D., LTX Corporation
Miosi, D., Toppan West Inc.
Morton, J.H., Lockheed Martin
Federal Systems
Murray, J.L., Clark-Schwebel Inc.
Norton, J.S., Tektronix Inc.
Officer, R., Sanders, A Lockheed
Martin Co.
Payne, C.W., Merix Corporation
Payne, J.R., Molex Electronics Ltd.
Pham, H., Symbol Technologies Inc.
Pope, D., Intel Corporation
Porter, C., Newbridge Networks
Corporation
Prachanronarong, K., GTE CSD
Prasad, R., Ray Prasad Consultancy
Group
Rassai, D., 3COM Corporation
IPC-SM-782A December 1999
ii
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