IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第217页

1.0 SCOPE This subsection provides the component and land pattern dimensions for rectangular 1.27 mm pitch Plastic Ball Grid Arrays (PBGA). 2.0 APPLICABLE DOCUMENTS The following documents, of the issue in effect on the …

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IPC-SM-782
Subject
1.0 mm Pitch PBGA JEDEC MO-151
Date
4/99
Section
14.1.3
Revision
—
Page6of6
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1.0 SCOPE
This subsection provides the component and land pattern
dimensions for rectangular 1.27 mm pitch Plastic Ball Grid
Arrays (PBGA).
2.0 APPLICABLE DOCUMENTS
The following documents, of the issue in effect on the current
revision date of this section, form a part of this specification to
the extent specified herein.
2.1 Joint Electronic Device Engineering Council
1
JEDEC Publication 95 Registered and Standard Outlines for
Solid State and Related Products:
• Rectangular Plastic Ball Grid Array (R-PBGA), MS-028
3.0 COMPONENT DESCRIPTION
These components are all on 1.27 mm pitch. They are avail-
able in a wide variety of body sizes. The data supplied in the
detail and table reflect a full matrix. Specific contact and
depopulation and pin assignment must be furnished by the
device manufacturer (see Section 14.0 for more information
on depopulation methods).
1. JEDEC: 2500 Wilson Blvd., Arlington, VA, 22201-3834, USA.
IPC-SM-782
Surface Mount Design
and Land Pattern Standard
Date
4/99
Section
14.2
Revision
—
Subject
1.27 mm Pitch
Rectangular PBGA
JEDEC MS-028
Page1of4
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4.0 COMPONENT DIMENSIONS
Figure 1 provides the component dimensions for rectangular PBGAs.
Component ABCDWPHFG
Identifier max max max max nom. basic max nom. nom.
R-PBGA 22x14 14.00 22.00 7.62 20.32 0.75 1.27 3.50 3.19 0.84
R-PBGA 22x14 14.00 22.00 10.16 20.32 0.75 1.27 3.50 1.92 0.84
R-PBGA 25x21 21.00 25.00 12.70 22.86 0.75 1.27 3.50 4.15 1.07
FE = Full Even Matrix
FO = Full Odd Matrix
Figure 1 R-PBGA component dimensions
IPC-SM-782
Subject
1.27 mm Pitch Rectangular PBGA JEDEC MS-028
Date
4/99
Section
14.2
Revision
—
Page2of4
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ