IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第152页

4.0 COMPONENT DIMENSIONS In this subsection, Figures 2a–2d provide the component dimensions for SQFP (Square) components. (Also see pages 4, 6 and 8.) Component Identiﬁer L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) P (mm) …

1.0 SCOPE

This subsection provides the component and land pattern

dimensions for square SQFP (Shrink Quad Flat Pack) and QFP

(metric plastic quad flat pack) components. Basic construc-

tion of the SQFP device is also covered. At the end of this

subsection is a listing of the tolerances and target solder joint

dimensions used to arrive at the land pattern dimensions.

2.0 APPLICABLE DOCUMENTS

See Section 11.0 and the following for documents applicable

to this subsection.

2.1 Electronic Industries Association (EIA)

JEDEC Publication 95

Registered and Standard Outlines for

Solid State and Related Products, ‘‘Metric Quad Flat Pack

Family 3.2 mm Footprint,’’ Outline MO-108, issue ‘‘A,’’ dated

10/90

Application for copies should be addressed to:

Global Engineering Documents

1990 M Street N.W.

Washington, DC

2.2 Electronic Industries Association of Japan (EIAJ)

EIAJ-ED-7404-1

General Rules for the Preparation of Outline

Drawings of Integrated Circuits Fine Pitch Quad Flat Packages

(dated January 26, 1989)

3.0 COMPONENT DESCRIPTIONS

Flatpacks are widely used in a variety of applications for com-

mercial, industrial, or military electronics.

3.1 Basic Construction

See Figure 1.

The shrink quad flat pack has been developed for applications

requiring low height and high density. The SQFP, along with

the TSOP components, are frequently used in memory card

applications. The square SQFP family comes in 13 standard

sizes, each of which sizes can come in either a 0.5, 0.4, or 0.3

mm pitch. There are therefore 39 configurations for square

SQFPs.

Two different pin counts are allowed for each package and

the component will still meet the standard (e.g., a 5x5 pack-

age with a 0.3 mm pitch can have either 56 or 48 pins, and

still meet EIAJ-7404-1).

QFPs are also square and come in larger pitches. Wherever

applicable, the body sizes of the components identified in Fig-

ures 2 and 3 show the relationships and pin numbers for

SQFPs and QFPs that have the same body size.

3.1.1 Termination Materials

Leads must be solder-

coated with a tin/lead alloy. The solder should contain

between 58 to 68% tin. Solder may be applied to the leads by

hot dipping or by plating from solution. Plated solder termina-

tions should be subjected to post-plating reflow operation to

fuse the solder. The tin/lead finish should be at least 0.0075

mm [0.0003 in] thick.

3.1.2 Marking

All parts shall be marked with a part number

and an index area. The index area shall identify the location of

pin 1.

3.1.3 Carrier Package Format

The carrier package for-

mat for flatpacks may be tube format; but, in most instances,

flatpacks are delivered in a carrier tray.

3.1.4 Process Considerations

SQFPs and QFPs are usu-

ally processed using standard solder reflow processes. Parts

should be capable of withstanding ten cycles through a stan-

dard reflow system operating at 215°C. Each cycle shall con-

sist of 60 seconds exposure and 215°C.

IPC-782-11-2-1

Figure 1 SQFP & QFP (Square)

IPC-SM-782

Surface Mount Design

and Land Pattern Standard

Date

5/96

Section

11.2

Revision

Subject

SQFP/QFP (Square)

Page1of10

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4.0 COMPONENT DIMENSIONS

In this subsection, Figures 2a–2d provide the component

dimensions for SQFP (Square) components. (Also see

pages 4, 6 and 8.)

Component

Identiﬁer

L (mm) S (mm) W (mm) T (mm)

(mm)

min max min max min max min max ref ref basic max

SQFP 5X5-24 6.80 7.20 5.20 5.89 0.10 0.30 0.40 0.80 5.00 5.00 0.50 1.70

SQFP 5X5-32 6.80 7.20 5.20 5.89 0.10 0.30 0.40 0.80 5.00 5.00 0.50 1.70

SQFP 5X5-32-F 6.80 7.20 5.20 5.89 0.05 0.22 0.40 0.80 5.00 5.00 0.40 1.70

SQFP 5X5-40 6.80 7.20 5.20 5.89 0.05 0.22 0.40 0.80 5.00 5.00 0.40 1.70

SQFP 5X5-48 6.80 7.20 5.20 5.89 0.05 0.15 0.40 0.80 5.00 5.00 0.30 1.70

SQFP 5X5-56 6.80 7.20 5.20 5.89 0.05 0.15 0.40 0.80 5.00 5.00 0.30 1.70

SQFP 6X6-32 7.80 8.20 6.20 6.89 0.10 0.30 0.40 0.80 6.00 6.00 0.50 1.70

SQFP 6X6-40 7.80 8.20 6.20 6.89 0.10 0.30 0.40 0.80 6.00 6.00 0.50 1.70

SQFP 6X6-40-F 7.80 8.20 6.20 6.89 0.05 0.22 0.40 0.80 6.00 6.00 0.40 1.70

SQFP 6X6-48 7.80 8.20 6.20 6.89 0.05 0.22 0.40 0.80 6.00 6.00 0.40 1.70

SQFP 6X6-56 7.80 8.20 6.20 6.89 0.05 0.15 0.40 0.80 6.00 6.00 0.30 1.70

SQFP 6X6-64 7.80 8.20 6.20 6.89 0.05 0.15 0.40 0.80 6.00 6.00 0.30 1.70

SQFP 7X7-40 8.80 9.20 7.20 7.89 0.10 0.30 0.40 0.80 7.00 7.00 0.50 1.70

SQFP 7X7-48 8.80 9.20 7.20 7.89 0.10 0.30 0.40 0.80 7.00 7.00 0.50 1.70

SQFP 7X7-56 8.80 9.20 7.20 7.89 0.05 0.22 0.40 0.80 7.00 7.00 0.40 1.70

SQFP 7X7-64 8.80 9.20 7.20 7.89 0.05 0.22 0.40 0.80 7.00 7.00 0.40 1.70

SQFP 7X7-72 8.80 9.20 7.20 7.89 0.05 0.15 0.40 0.80 7.00 7.00 0.30 1.70

SQFP 7X7-80 8.80 9.20 7.20 7.89 0.05 0.15 0.40 0.80 7.00 7.00 0.30 1.70

Figure 2a SQFP (Square) component dimensions

0~ 0.25

▼

0~ 10°

▼

IPC-782-11-2-2a

IPC-SM-782

Subject

SQFP/QFP (Square)

Date

5/96

Section

11.2

Revision

Page2of10

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5.0 LAND PATTERN DIMENSIONS

In this subsection, Figures 3a–3d provide the land pattern

dimensions for SQFP (Square) components. These numbers

represent industry consensus on the best dimensions based

on empirical knowledge of fabricated land patterns. (Also see

pages 5, 7, and 9.)

In the table, the dimensions shown are at maximum material

condition (MMC). The least material condition (LMC) should

not exceed the fabrication (F) allowance shown on page 10.

The LMC and the MMC provide the limits for each dimension.

The dotted line in Figure 3 shows the grid placement court-

yard which is the area required to place land patterns and

their respective components in adjacent proximity without

interference or shorting. Numbers in the table represent the

number of grid elements (each element is 0.5 by 0.5 mm) in

accordance with the international grid detailed in IEC publica-

tion 97.

RLP No. Component Identiﬁer Z (mm) G (mm) X (mm)

Y (mm) C (mm) D (mm) E (mm)

Placement Grid

(No. of Grid

Elements)ref ref ref ref

550A SQFP 5x5-24 7.80 4.60 0.30 1.60 6.20 2.50 0.50 18x18

551A SQFP 5x5-32 7.80 4.60 0.30 1.60 6.20 3.50 0.50 18x18

552A SQFP 5x5-32-F 7.80 4.60 0.25 1.60 6.20 2.80 0.40 18x18

553A SQFP 5x5-40 7.80 4.60 0.25 1.60 6.20 3.60 0.40 18x18

554A SQFP 5x5-48 7.80 4.60 0.17 1.60 6.20 3.30 0.30 18x18

555A SQFP 5x5-56 7.80 4.60 0.17 1.60 6.20 3.90 0.30 18x18

556A SQFP 6x6-32 8.80 5.60 0.30 1.60 7.20 3.50 0.50 20x20

557A SQFP 6x6-40 8.80 5.60 0.30 1.60 7.20 4.50 0.50 20x20

558A SQFP 6x6-40-F 8.80 5.60 0.25 1.60 7.20 3.60 0.40 20x20

559A SQFP 6x6-48 8.80 5.60 0.25 1.60 7.20 4.40 0.40 20x20

560A SQFP 6x6-56 8.80 5.60 0.17 1.60 7.20 3.90 0.30 20x20

561A SQFP 6x6-64 8.80 5.60 0.17 1.60 7.20 4.50 0.30 20x20

562A SQFP 7x7-40 9.80 6.60 0.30 1.60 8.20 4.50 0.50 22x22

563A SQFP 7x7-48 9.80 6.60 0.30 1.60 8.20 5.50 0.50 22x22

564A SQFP 7x7-56 9.80 6.60 0.25 1.60 8.20 5.20 0.40 22x22

565A SQFP 7x7-64 9.80 6.60 0.25 1.60 8.20 6.00 0.40 22x22

566A SQFP 7x7-72 9.80 6.60 0.17 1.60 8.20 5.10 0.30 22x22

567A SQFP 7x7-80 9.80 6.60 0.17 1.60 8.20 5.70 0.30 22x22

Figure 3a SQFP (Square) land pattern dimensions

Full radius

optional

▼

Grid placement courtyard

▼

IPC-782-11-2-3a

IPC-SM-782

Subject

SQFP/QFP (Square)

Date

5/96

Section

11.2

Revision

Page3of10

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