IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第5页
Riesenbeck, J., L ytton Inc. Rietdorf, B.C., Hughes Defense Communications Rudy , D., Lucent T echnologies Inc. Rumps, D.W ., Lucent T echnologies Inc. Russell, R., T exas Instruments Inc. Seltzer , M.L., Hughes Delco Sy…
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members
of the IPC Surface Mount Land Patterns Subcommittee of the Printed Board Design Committee are shown below, it is not
possible to include all of those who assisted in the evolution of this Standard. To each of them, the members of the IPC
extend their gratitude.
Printed Board Design
Committee
Surface Mount Land Patterns
Subcommittee
Technical Liaison of the
IPC Board of Directors
Chairman
Joe Fjelstad
Tessera Inc.
Chairman
Nick Mescia
General Dynamics
Advanced Technology
Stan Gentry
Noble Industries Ltd.
Surface Mount Land Patterns Subcommittee
Anderson, R., AT&T Interconnect
Center of Excellence
Artaki, I., Lucent Technologies Inc.
Baker, R.J., Central Texas Electronics
Association (CTEA)
Banks, S., Trimble Navigation
Barlow, M., Lytton Inc.
Belin, J., Automata Inc.
Berkman, E., Excalibur Systems Inc.
Bittle, D.W., Raytheon Aircraft
Company
Boerdner, R.W., EJE Research
Bourque, J., Shure Brothers Inc.
Brydges, P., Panametrics Inc.
Burg, J.S., 3M Company
Cash, A.S., Northrop Grumman
Corporation
Caterina, J., Northrop Grumman
Corporation
Clifton, L., Intel Corporation
Cohen, L., Formation Inc.
Collins, S., Texscan Corporation
Couble, E.C., Shipley Co.
Coucher, M.M., Sequent Computer
Systems Inc.
Crowley, B., Hewlett Packard
Laboratories
D’Andrade, D., The Surface Mount
Technology Centre Inc.
Daugherty, D., Siemens Energy &
Automation
Davy, J., Northrop Grumman
Electronic Sensors & Systems Div
Dieffenbacher, W.C., Lockheed
Martin Corporation
DiFranza, M.J., The Mitre Corp.
Dolence, C., Tektronix Board Build
Operation
Easterling, T., SCI Systems Inc.
Edwards, W.J., Lucent Technologies
Inc.
Eldan, E., Orbotech Inc.
Engelmaier, W., Engelmaier
Associates Inc.
Feldmesser, H.S., Johns Hopkins
University
Firestein, I., Tadiran Telecom Group
Freedman, M.G., Amp Inc.
Giardina, J., Miteq Inc.
Grannells, R.T., United Technologies
Gray, B.W., Bull Electronics
Gray, F.L., Texas Instruments Inc.
Hargreaves, L., DC. Scientific Inc.
Hartsgrove, M., I-CON Industries
Inc.
Hastings, D.W., Lockheed Martin
Aeronutronic
Heath, B., TMD (Technology
Manufacturing Inc.)
Hersey, R.J., Ralph Hersey &
Associates
Hinton, P.E., Hinton PWB
Engineering
Holland, D.L., Sanders, A Lockheed
Martin Co.
Horton, R.N., Northrop Grumman
Electronic Sensors & Systems Div
Humpal, T.L., O.E.M. Worldwide
Hymes, L., The Complete Connection
Jawitz, M.W., Eimer Company
Johnson, B., Pacific Testing
Laboratories, Inc.
Johnson, K.L., Hexacon Electric
Company
Kemp, C.A., Lockheed Martin
Corporation
Kenyon, W.G., Global Centre for
Process Change
Kern, T., Axiom Electronics, Inc.
Knapp, C.W., Litton Guidance &
Control Systems
Koebert, M., Eaton Corp.
Korf, D.W., Zycon Corporation
Korth, C.M., Hibbing Electronics
Corp.
Kotecki, G.T., Northrop Grumman
Corporation
Lambert, L.P., EPTAC Corporation
Landolt, R.H., Enthone-OMI Inc.
Maguire, J.F., Boeing Defense &
Space Group
Malanchuk, D.J., Eastman Kodak Co.
KAD
Malewicz, W.R., Siemens Medical
Electronics
Mather, J.C., Rockwell International
Metcalf, R.J., Morton Electronic
Materials
Miller, R.F., Lockheed Martin
Corporation
MiLosh, D., LTX Corporation
Miosi, D., Toppan West Inc.
Morton, J.H., Lockheed Martin
Federal Systems
Murray, J.L., Clark-Schwebel Inc.
Norton, J.S., Tektronix Inc.
Officer, R., Sanders, A Lockheed
Martin Co.
Payne, C.W., Merix Corporation
Payne, J.R., Molex Electronics Ltd.
Pham, H., Symbol Technologies Inc.
Pope, D., Intel Corporation
Porter, C., Newbridge Networks
Corporation
Prachanronarong, K., GTE CSD
Prasad, R., Ray Prasad Consultancy
Group
Rassai, D., 3COM Corporation
IPC-SM-782A December 1999
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Riesenbeck, J., Lytton Inc.
Rietdorf, B.C., Hughes Defense
Communications
Rudy, D., Lucent Technologies Inc.
Rumps, D.W., Lucent Technologies
Inc.
Russell, R., Texas Instruments Inc.
Seltzer, M.L., Hughes Delco Systems
Operations
Siegel, E.S., Pace Inc.
Skelly, H., Boeing Defense & Space
Group
Smith, E., Lucent Technologies Inc.
Socolowski, N., Alpha Metals Inc.
Solberg, V., Tessera Inc.
Stepp, L., Whittaker Electronic
Systems
Theiler, G.P., Fluke Corporation
Theroux, G., Honeywell Inc.
Thompson, R.T., Loctite Corporation
Thrasher, H.M., Shipley Co.
Torres, S., Corlund Electronics Corp.
Treutler, L.E., Fachverband
Elektronik Design e.V.
Turbini, L.J., Georgia Institute of
Technology
Vanech, R., Northrop Grumman
Norden Systems
Vaught, J., Hughes Aircraft Co.
Virmani, N., NASA/Goddard Space
Flight Center
Vollmar, E.L, Methode Electronics
Inc.
Weiner, E.M., Weiner & Associates
Inc.
Weiner, M., Tadiran Telecom Group
White, T.M., Boeing Defense &
Space Group
Williams, J.J., Smiths Industries
Wingate, P., Amkor Electronics Inc.
Winslow, H., SCI Systems Inc.
Wood, M., The Surface Mount
Technology Centre Inc.
Woodhouse, G.P., Micron Custom
Mfg. Services Inc.
Wooldridge, J.R., Rockwell
International
Wu, F.B., Hughes Aircraft Co.
Special Note of Appreciation
A special note of appreciation goes to
the following principle members of
the committee who led the effort to
make this document possible.
John Biancini, Advanced Flex
Gary Ferrari, IPC
Cynthia Jonas, Pitney Bowes
Vern Solberg, Tessera Inc.
Vivian Vosburg, Pac-El
Cover art by:
IPC Designers Council
William Burt
Custom Photo and Design, Inc.
December 1999 IPC-SM-782A
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Table of Contents
1.0 SCOPE
...................................................................... 1
1.1 Purpose................................................................. 1
1.2 Performance Classification.................................. 1
1.3 Assembly Types................................................... 2
1.4 Presentation.......................................................... 2
1.5 Profile Tolerances................................................. 2
1.6 Land Pattern Determination ............................... 2
2.0 APPLICABLE DOCUMENTS
................................... 4
2.1 IPC ...................................................................... 4
2.2 Electronic Industries Association ....................... 4
2.3 Joint Industry Standards (IPC)............................ 5
2.4 American Society of Mechanical Engineers....... 5
3.0 DESIGN REQUIREMENTS
..................................... 5
3.1 Terms and Definitions.......................................... 5
3.2 Component Acronyms ......................................... 7
3.3 Dimensioning Systems ........................................ 7
3.4 Design for Producibility.................................... 17
3.5 Environmental Constraints ............................... 18
3.6 Design Rules...................................................... 20
3.7 Outer Layer Finishes ........................................ 34
4.0 QUALITY AND RELIABILITY VALIDATION
....... 37
4.1 Validation Techniques........................................ 37
4.2 Test Patterns—In-Process Validator.................. 38
4.3 Stress Testing ..................................................... 38
5.0 TESTABILITY
........................................................ 45
5.1
Testing Considerations ..................................... 45
5.2
Nodal Access...................................................... 45
5.3
Full Nodal Access.............................................. 46
5.4
Limited Nodal Access........................................ 47
5.5
No Nodal Access ............................................... 47
5.6
Clam Shell Fixtures Impact............................... 48
5.7
Printed Board Test Characteristics ................... 48
6.0 PACKAGING AND INTERCONNECTING
STRUCTURE TYPES
............................................. 48
6.1
General Considerations...................................... 49
6.2
Organic-Base Material P&IS............................. 50
6.3
Non-Organic Base Materials............................. 50
6.4
Supporting-Plane P&I Structures...................... 50
6.5
Constraining Core P&I Structures .................... 52
7.0 ASSEMBLY CONSIDERATIONS FOR
SURFACE MOUNT TECHNOLOGY (SMT)
........... 53
7.1
SMT Assembly Process Sequence .................... 53
7.2 Substrate Preparation Adhesive,
Solder Paste ...................................................... 53
7.3 Component Placement....................................... 53
7.4 Soldering............................................................ 56
7.5 Cleaning ............................................................. 57
7.6
Repair/Rework ................................................... 57
8.0 DISCRETE COMPONENTS
8.1 Chip Resistors
8.2 Chip Capacitors
8.3 Inductors
8.4 Tantalum Capacitors
8.5 Metal Electrode Face (MELF) Components
8.6 Small Outline Transistor (SOT) 23
8.7 Small Outline Transistor (SOT) 89
8.8 Small Outline Diode (SOD) 123
8.9 Small Outline Transistor (SOT) 143
8.10 Small Outline Transistor (SOT) 223
8.11 Modified Through-Hole Component (TO) 252
9.0 COMPONENTS WITH GULLWING LEADS ON
TWO SIDES
9.1 Small Outline Integrated Circuits (SOIC)
9.2 Small Outline Integrated Circuits (SSOIC)
9.3 Small Outline Package Integrated Circuit
(SOPIC)
9.4 Thin Small Outline Package
9.5 Ceramic Flat Pack (CFP)
10.0 COMPONENTS WITH J LEADS ON TWO SIDES
10.1 Small Outline Integrated Circuits with J Leads
(SOJ)–7.63 mm [0.300] Body Size
10.2 Small Outline Integrated Circuits with J Leads
(SOJ)–8.88 mm [0.350] Body Size
10.3 Small Outline Integrated Circuits with J Leads
(SOJ)–10.12 mm [0.400] Body Size
10.4 Small Outline Integrated Circuits with J Leads
(SOJ)–11.38 mm [0.450] Body Size
11.0 COMPONENTS WITH GULLWING LEADS ON
FOUR SIDES
11.1 Plastic Quad Flat Pack (PQFP)
11.2 Shink Quad Flat Pack (SQFP), Square
11.3 Shrink Quad Flat Pack (SQFP), Rectangular
11.4 Ceramic Quad Flat Pack (CQFP)
12.0 COMPONENTS WITH J LEADS ON FOUR SIDES
12.1 Plastic Leaded Chip Carrier (PLCC), Square
12.2 Plastic Leaded Chip Carrier (PLCC), Rectangular
12.3 Leadless Ceramic Chip Carrier (LCC)
13.0 MODIFIED DUAL-IN-LINE PIN (DIP)
COMPONENTS
December 1999 IPC-SM-782A
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