IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第140页

4.0 COMPONENT DIMENSIONS In this subsection, Figures 2a–2b provide the component dimensions for SOJ components. (Also see page 4.) Component Identiﬁer (Pin Count) L (mm) S (mm) W (mm) T (mm) B (mm) H (mm) P (mm) min max …

1.0 SCOPE

This subsection provides the component and land pattern

dimensions for small outline integrated circuits with ‘‘J’’ leads

(SOJ components). Basic construction of the SOJ device is

also covered. At the end of this subsection is a listing of the

tolerances and target solder joint dimensions used to arrive at

the land pattern dimensions.

2.0 APPLICABLE DOCUMENTS

See Section 10.0 for documents applicable to the subsec-

tions.

3.0 COMPONENT DESCRIPTIONS

The two-sided J lead family is a small outline family identified

by the dimension of the body size in inches. For example, the

SOJ/300 has a body size of 0.300 inches or 7.63 mm, the

SOJ/350 has a body size of 0.350 inches or 8.88 mm, the

SOJ/400 has a body size of 0.400 inches or 10.12 mm, and

the SOJ/450 has a body size of 0.450 inches or 11.38 mm.

Package lead counts range from 14 to 28 pins.

The small-outline ‘‘J’’ (SOJ) package has leads on two sides,

similar to a DIP. The lead configuration, like the letter J,

extends out the side of the package and bends under the

package forming a J bend. The point of contact of the lead to

the land

pattern is at the apex of the J bend and is the basis for the

span of the land pattern.

The leads must be coplanar within 0.1 mm. That is, when the

component is placed on a flat surface, no lead may be more

than 0.1 mm off the flat surface.

The SOJ package takes advantage of chips having parallel

address or data line layouts. For example, memory IC’s are

often used in multiples, and buss lines connect to the same

pin on each chip. Memory chips in SOJ packages can be

placed close to one another because of the parallel pin layout

and the use of ‘‘J’’ leads. With high capacity memory sys-

tems, the space savings can be significant.

3.1 Basic Construction

See Figure 1. Basic construction

consists of a plastic body, and metallic ‘‘J’’ leads.

3.1.1 Termination Materials

Leads must be solder-

coated with a tin/lead alloy. The solder should contain

between 58 to 68% lead. Solder may be applied to theleads

by hot dipping or by plating from solution. Plated solder termi-

nations should be subjected to post-plating reflow operation

to fuse the solder. The tin/lead finishshould be at least 0l.0075

mm [0.0003 in] thick.

3.1.2 Marking

The SOIC family of parts is generally

marked with manufacturers part numbers, manufacturers

name or symbol, and a pin 1 indicator. Some parts may have

a pin 1 feature in the case shape instead of pin 1 marking.

Additional markings may include date code/manufacturing lot

and/or manufacturing location.

3.1.3 Carrier Package Format

Components may be pro-

vided in tube or tape packaging. Tape is preferred for best

handling and high volume applications. Bulk packaging is not

acceptable because of lead coplanarity requirements required

for placement and soldering. EIA-481 provides details on tape

requirements.

3.1.4 Process Considerations

J lead packages are nor-

mally processed using standard solder reflow processes.

Parts should be capable of withstanding ten cycles through a

standard reflow system operating at 215°C. Each cycle shall

consist of 60 seconds exposure at 215°C.

IPC-782-10-1-1

Figure 1 SOJ construction

IPC-SM-782

Surface Mount Design

and Land Pattern Standard

Date

5/96

Section

10.1

Revision

Subject

SOJ

Page1of6

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4.0 COMPONENT DIMENSIONS

In this subsection, Figures 2a–2b provide the component

dimensions for SOJ components. (Also see page 4.)

Component

Identiﬁer (Pin

Count)

L (mm) S (mm) W (mm) T (mm) B (mm) H (mm) P (mm)

min max min max min max min max m in max max basic

SOJ 14/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 9.65 9.96 3.75 1.27

SOJ 16/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 10.92 11.23 3.75 1.27

SOJ 18/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 12.19 12 .50 3.75 1.27

SOJ 20/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 13.46 13.77 3.75 1.27

SOJ 22/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 14.73 15.04 3.75 1.27

SOJ 24/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 16.00 16.31 3.75 1.27

SOJ 26/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 17.27 17.58 3.75 1.27

SOJ 28/300 8.38 8.76 4.38 5.06 0.38 0.51 1.60 2.00 18.54 18.85 3.75 1.27

SOJ 14/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 9.65 9.96 3.75 1.27

SOJ 16/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 10.92 11.23 3.75 1.27

SOJ 18/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 12.19 12.50 3.75 1.27

SOJ 20/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 13.46 13.77 3.75 1.27

SOJ 22/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 14.73 15.04 3.75 1.27

SOJ 24/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 16.00 16.31 3.75 1.27

SOJ 26/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 17.27 17.58 3.75 1.27

SOJ 28/350 9.65 10.03 5.65 6.33 0.38 0.51 1.60 2.00 18.54 18.85 3.75 1.27

Figure 2a SOJ component dimensions

▼

1.02

1.17

▼

A (in.)

ref.

0.300

0.350

A (mm)

min max

7.49 7.75

8.76 9.02

IPC-782-101-2a

IPC-SM-782

Subject

SOJ

Date

5/96

Section

10.1

Revision

Page2of6

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5.0 LAND PATTERN DIMENSIONS

In this subsection, Figures 3a–3b provide the land pattern

dimensions for SOJ components. These numbers represent

industry consensus on the best dimensions based on empiri-

cal knowledge of fabricated land patterns. (Also see page 5.)

In the table, the dimensions shown are at maximum material

condition (MMC). The least material condition (LMC) should

not exceed the fabrication (F) allowance shown on page 6.

The LMC and the MMC provide the limits for each dimension.

The dotted line in Figure 3 shows the grid placement court-

yard which is the area required to place land patterns and

their respective components in adjacent proximity without

interference or shorting. Numbers in the table represent the

number of grid elements (each element is 0.5 by 0.5 mm) in

accordance with the international grid detailed in IEC publica-

tion 97.

RLP No.

Component

Identiﬁer

(Pin Count) Z (mm) G (mm) X (mm)

Y (mm) C (mm) D (mm) E (mm)

Placement Grid

(No. Grid

Elements)ref ref basic basic

480A SOJ 14/300 9.40 5.00 0.60 2.20 7.20 7.62 1.27 20x22

481A SOJ 16/300 9.40 5.00 0.60 2.20 7.20 8.89 1.27 20x24

482A SOJ 18/300 9.40 5.00 0.60 2.20 7.20 10.16 1.27 20x26

483A SOJ 20/300 9.40 5.00 0.60 2.20 7.20 11.43 1.27 20x28

484A SOJ 22/300 9.40 5.00 0.60 2.20 7.20 12.70 1.27 20x32

485A SOJ 24/300 9.40 5.00 0.60 2.20 7.20 13.97 1.27 20x34

486A SOJ 26/300 9.40 5.00 0.60 2.20 7.20 15.24 1.27 20x36

487A SOJ 28/300 9.40 5.00 0.60 2.20 7.20 16.51 1.27 20x38

490A SOJ 14/350 10.60 6.20 0.60 2.20 8.40 7.62 1.27 24x22

491A SOJ 16/350 10.60 6.20 0.60 2.20 8.40 8.89 1.27 24x24

492A SOJ 18/350 10.60 6.20 0.60 2.20 8.40 10.16 1.27 24x26

493A SOJ 20/350 10.60 6.20 0.60 2.20 8.40 11.43 1.27 24x28

494A SOJ 22/350 10.60 6.20 0.60 2.20 8.40 12.70 1.27 24x32

495A SOJ 24/350 10.60 6.20 0.60 2.20 8.40 13.97 1.27 24x34

496A SOJ 26/350 10.60 6.20 0.60 2.20 8.40 15.24 1.27 24x36

497A SOJ 28/350 10. 60 6.20 0.60 2.20 8.40 16.51 1.27 24x38

Figure 3a SOJ land pattern dimensions

▼

Grid

Placement

Courtyard

IPC-782-10-1-3a

IPC-SM-782

Subject

SOJ

Date

5/96

Section

10.1

Revision

Page3of6

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