IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第131页

5.0 LAND PATTERN DIMENSIONS Figure 3 provides the land pattern dimensions for TSOP com- ponents. These numbers represent industry consensus on the best dimensions based on empirical knowledge of fabricated land patterns.…

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4.0 COMPONENT DIMENSIONS
Figure 2 provides the component dimensions for TSOP components.
Component
Identifier
(mm)
Pin
Count
L (mm) S (mm) W (mm) T (mm) A (mm) B (mm)
H
(mm)
P
(mm)
min max min max min max m in max min max min max max basic
TSOP 6x14 16 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 5.80 6.20 12.20 12.60 1.27 0.65
TSOP 6x16 24 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 5.80 6.20 14.20 14.60 1.27 0.50
TSOP 6x18 28 17.80 18.20 16.40 16.78 0.05 0.22 0.40 0.70 5.80 6.20 16.20 16.60 1.27 0.40
TSOP 6x20 36 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 5.80 6.20 18.20 18.60 1.27 0.30
TSOP 8x14 24 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 7.80 8.20 12.20 12.60 1.27 0.65
TSOP 8x16 32 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 7.80 8.20 14.20 14.60 1.27 0.50
TSOP 8x18 40 17.80 18.20 16.40 16.98 0.05 0.22 0.40 0.70 7.80 8.20 16.20 16.60 1.27 0.40
TSOP 8x20 52 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 7.80 8.20 18.20 18.60 1.27 0.30
TSOP
10x14
28 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 9.80 10.20 12.20 12.60 1.27 0.65
TSOP
10x16
40 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 9.80 10.20 14.20 14.60 1.27 0.50
TSOP
10x18
48 17.80 18.20 16.40 16.98 0.05 0.22 0.40 0.70 9.80 10.20 16.20 16.60 1.27 0.40
TSOP
10x20
64 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 9.80 10.20 18.20 18.60 1.27 0.30
TSOP
12x14
36 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 11.80 12.20 12.20 12.60 1.27 0.65
TSOP
12x16
48 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 11.80 12.20 14.20 14.60 1.27 0.50
TSOP
12x18
60 17.80 18.20 16.40 16.98 0.05 0.22 0.40 0.70 11.80 12.20 16.20 16.60 1.27 0.40
TSOP
12x20
76 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 11.80 12.20 18.20 18.60 1.27 0.30
Figure 2 TSOP component dimensions
IPC-782-9-4-2
IPC-SM-782
Subject
TSOP
Date
5/96
Section
9.4
Revision
A
Page2of4
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
5.0 LAND PATTERN DIMENSIONS
Figure 3 provides the land pattern dimensions for TSOP com-
ponents. These numbers represent industry consensus on the
best dimensions based on empirical knowledge of fabricated
land patterns.
In the table, the dimensions shown are at maximum material
condition (MMC). The least material condition (LMC) should
not exceed the fabrication (F) allowance shown on page 4.
The LMC and the MMC provide the limits for each dimension.
The dotted line in Figure 3 shows the grid placement court-
yard which is the area required to place land patterns and
their respective components in adjacent proximity without
interference or shorting. Numbers in the table represent the
number of grid elements (each element is 0.5 by 0.5 mm) in
accordance with the international grid detailed in IEC publica-
tion 97.
RLP No.
Component
Identifier (mm) Z (mm) G (mm) X (mm)
Y (mm) C (mm) D (mm) E (mm)
Pin
Count
Placement Grid
(No. of Grid
Elements)ref ref ref basic
390A 6x14 14.80 11.60 0.40 1.60 13.20 4.55 0.65 16 14x32
391A 6x16 16.80 13.60 0.30 1.60 15.20 5.50 0.50 24 14x36
392A 6x18 18.80 15.60 0.25 1.60 17.20 5.20 0.40 28 14x40
393A 6x20 20.80 17.60 0.17 1.60 19.20 5.10 0.30 36 14x44
394A 8x14 14.80 11.60 0.40 1.60 13.20 7.15 0.65 24 18x32
395A 8x16 16.80 13.60 0.30 1.60 15.20 7.50 0.50 32 18x36
396A 8x18 18.80 15.60 0.25 1.60 17.20 7.60 0.40 40 18x40
397A 8x20 20.80 17.60 0.17 1.60 19.20 7.50 0.30 52 18x44
398A 10x14 14.80 11.60 0.40 1.60 13.20 8.45 0.65 28 22x32
399A 10x16 16.80 13.60 0.30 1.60 15.20 9.50 0.50 40 22x36
400A 10x18 18.80 15.60 0.25 1.60 17.20 9.20 0.40 48 22x40
401A 10x20 20.80 17.60 0.17 1.60 19.20 9.30 0.30 64 22x44
402A 12x14 14.80 11.60 0.40 1.60 13.20 11.05 0.65 36 26x32
403A 12x16 16.80 13.60 0.30 1.60 15.20 11.50 0.50 48 26x36
404A 12x18 18.80 15.60 0.25 1.60 17.20 11.60 0.40 60 26x40
405A 12x20 20.80 17.60 0.17 1.60 19.20 11.10 0.30 76 26x44
Figure 3 TSOP land pattern dimensions
Grid placement courtyard
E
C
G
Z
D
Full radius preferred
Y
X
IPC-782-9-4-3
IPC-SM-782
Subject
TSOP
Date
5/96
Section
9.4
Revision
A
Page3of4
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
6.0 TOLERANCE AND SOLDER JOINT ANALYSIS
Figure 4 provides an analysis of tolerance assumptions and
resultant solder joints based on the land pattern dimensions
shown in Figure 3. Tolerances for the component dimensions,
the land pattern dimensions (fabrication tolerances on the
interconnecting substrate), and the component placement
equipment accuracy are all taken into consideration.
Figure 4 provides the solder joint minimums for toe, heel, and
side fillets, as discussed in Section 3.3. The tolerances are
addressed in a statistical mode, and assume even distribution
of the tolerances for component, fabrication, and placement
accuracy.
Individual tolerances for fabrication (‘‘F’’) and component
placement equipment accuracy (‘‘P’’) are assumed to be as
given in the table. These numbers may be modified based on
user equipment capability or fabrication criteria. Component
tolerance ranges (C
L
,C
S
, and C
W
) are derived by subtracting
minimum from maximum dimensions given in Figure 2. The
user may also modify these numbers, based on experience
with their suppliers. Modification of tolerances may result in
alternate land patterns (patterns with dimensions other than
the IPC registered land pattern dimensions).
The dimensions for minimum solder fillets at the toe, heel, or
side (J
T
,J
H
,J
S
) have been determined based on industry
empirical knowledge and reliability testing. Solder joint
strength is greatly determined by solder volume. An observ-
able solder fillet is necessary for evidence of proper wetting.
Thus, the values in the table usually provide for a positive sol-
der fillet. Nevertheless, the user may increase or decrease the
minimum value based on process capability.
RLP No.
Tolerance
Assumptions (mm)
Solder Joint
Toe (mm) Heel (mm) Side (mm)
FPC
L
J
T
min J
T
max C
S
J
H
min J
H
max C
W
J
S
min J
S
max
390A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
391A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
392A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.10 -0.01 0.10
393A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.06 -0.03 0.06
394A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
395A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
396A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.17 -0.01 0.10
397A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.10 -0.03 0.06
398A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
399A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
400A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.17 -0.01 0.10
401A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.10 -0.03 0.06
402A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
403A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.20 -0.02 0.10
404A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.17 -0.01 0.10
405A 0.10 0.10 0.40 0.29 0.50 0.58 0.39 0.69 0.10 -0.03 0.06
Figure 4 Tolerance and solder joint analysis
Zmax
Lmin
▼
▼
▼
▼
1
/2 T
T
J
T
min
Smax
J
H
min
1
/2 T
H
Xmax
▼
▼
Toe Fillet
▼
▼
▼
Heel Fillet
Side Fillet
▼
▼
▼
▼
▼
J
T
max
J
H
max
J
S
min
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
▼
Gmin
▼
1
/2 T
S
J
S
max
▼
▼
▼
Wmin
▼
IPC-782-9-4-4
IPC-SM-782
Subject
TSOP
Date
5/96
Section
9.4
Revision
A
Page4of4
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ