IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第197页

1.0 INTRODUCTION This section covers land pattern recommendations for ball grid array (BGA) contact devices. Each subsection contains information in accordance with the following format. 1.0 Scope 2.0 Applicable Document…

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IPC-SM-782A
Subject
Components with Ball Grid Array Contacts
Date
4/99
Section
14.0
Revision
—
Page6of6
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
1.0 INTRODUCTION
This section covers land pattern recommendations for ball
grid array (BGA) contact devices. Each subsection contains
information in accordance with the following format.
1.0 Scope
2.0 Applicable Documents
3.0 General Component Description
4.0 Component Outline
5.0 Land Pattern Dimensions
6.0 Land Pattern Analysis
The following is the table of contents for this section:
Table of Contents
Components with Ball Grid Array Contacts
Section
14.1.1
14.1.2
14.1.3
Standard Source
JEDEC MO-151
JEDEC MO-151
JEDEC MO-151
Pitch
1.5 mm
1.27 mm
1.0 mm
2.0 APPLICABLE DOCUMENTS
The following documents, of the issue in effect on the current
revision date of this section, form a part of this specification to
the extent specified herein.
2.1 Joint Electronic Device Engineering Council
1
JEDEC Publication 95
Registered and Standard Outlines for
Solid State and Related Products:
• Plastic Ball Grid Array (PBGA), MO-151
3.0 GENERAL INFORMATION
3.1 Component Description
The Grid Array device family
includes square and rectangular package configurations and
is furnished in a plastic base material. Figure 3-1 shows the
elements of a BGA. Base material serves as a mounting struc-
ture for attaching the die. Depending on the physical charac-
teristics of the material, flip-chip or wire bond technologies
may be employed to route the signal from the die bond pads
to the array matrix on the base interface structure.
1. JEDEC: 2500 Wilson Blvd., Arlington, VA, 22201-3834, USA.
IPC-782143-1
Figure 3-1 Ball Grid Array IC package example
IPC-SM-782
Surface Mount Design
and Land Pattern Standard
Date
4/99
Section
14.1
Revision
—
Subject
Plastic Ball Grid Array
Page1of2
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
This Page Intentionally Left Blank
IPC-SM-782A
Subject
Plastic Ball Grid Array
Date
4/99
Section
14.1
Revision
—
Page2of2
电子技术应用　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ