IPC-SM-782A 表面安装设计和焊盘设计标准(带BGA).pdf - 第188页
IPC-782-13-1-2 A ▼ ▼ B ▼ ▼ H ▼ ▼ ▼ ▼ .38 ▼ ▼ D W P ▼ ▼ ▼ ▼ L ▼ ▼ ▼ ▼ T W .25 ▼ ▼ ▼ ▼ ▼ Cut line S ▼ 4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for DIP components. Component Identifier L (mm) S (mm…
1.0 SCOPE
This subsection provides the component and land pattern
dimensions for DIPs (Modified Dual-In-Line components).
Basic construction of the DIP device is also covered. At the
end of this subsection is a listing of the tolerances and target
solder joint dimensions used to arrive at the land pattern
dimensions.
2.0 APPLICABLE DOCUMENTS
See Section 13.0 for documents applicable to the subsec-
tions.
3.0 COMPONENT DESCRIPTIONS
3.1 Basic Construction
See Figure 1. Construction is usu-
ally made of plastic or ceramics.
3.1.1 Termination Materials
Leads should be solder-
coated with a tin/lead alloy. The solder should contain
between 58 to 68% tin. Solder may be applied to the termi-
nation by hot dipping or by plating from solution. Plated sol-
der terminations should be subjected to a post-plating reflow
operation to fuse the solder. The tin/lead finish should be at
least 0.00075 mm [0.0003 in] thick.
Solder finish applied over precious-metal leads shall have a
diffusion-barrier layer between the lead metallization and the
solder finish. The barrier layer should be nickel or an equiva-
lent diffusion barrier, and should be at least 0.00125 mm
[0.00005 in] thick.
3.1.2 Marking
Parts shall be marked with the part number
and a date code. In addition, pin 1 shall be identified.
3.1.3 Carrier Package Format
Carrier format may be
tubes or as agreed to between user and vendor.
3.1.4 Resistance to Soldering
The parts should be
capable of withstanding ten cycles through a standard reflow
system operating at 215°C. Each cycle shall consist of a mini-
mum of 60 seconds exposure at 215°C.
IPC-782-13-1-1
Figure 1 DIP construction
IPC-SM-782
Surface Mount Design
and Land Pattern Standard
Date
8/93
Section
13.1
Revision Subject
DIP
Page1of4
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IPC-782-13-1-2
A
▼
▼
B
▼
▼
H
▼
▼ ▼
▼
.38
▼
▼
D
W
P
▼
▼
▼
▼
L
▼
▼
▼
▼
T
W
.25
▼
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Cut line
S
▼
4.0 COMPONENT DIMENSIONS
Figure 2 provides the component dimensions for DIP components.
Component
Identifier
L (mm) S (mm) W (mm) T (mm) A (mm) B (mm)
H
(mm)
P
(mm)
min max min max min max min max m in max min max max basic
DIP 8 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 8.84 10.92 5.33 2.54
DIP 14 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 18.42 20.19 5.33 2.54
DIP 16 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 18.93 21.33 5.33 2.54
DIP 18 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 21.47 23.49 5.33 2.54
DIP 20 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 23.50 26.90 5.33 2.54
DIP 22L 9.91 10.79 9.15 10.07 0.36 0.56 0.20 0.38 8.39 9.65 26.67 28.44 5.33 2.54
DIP 24 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 28.60 32.30 5.33 2.54
DIP 24L 9.91 10.79 9.15 10.07 0.36 0.56 0.20 0.38 8.39 9.65 29.21 30.98 5.33 2.54
DIP 24X 15.24 15.87 14.48 15.16 0.36 0.56 0.20 0.38 12.32 14.73 29.30 32.70 6.35 2.54
DIP 28 7.62 8.25 6.86 7.54 0.36 0.56 0.20 0.38 6.10 7.11 34.20 36.20 5.33 2.54
DIP 28X 15.24 15.87 14.48 15.16 0.36 0.56 0.20 0.38 12.32 14.73 35.10 39.70 6.35 2.54
DIP 40X 15.24 15.87 14.48 15.16 0.36 0.56 0.20 0.38 12.32 14.73 50.30 53.20 6.35 2.54
DIP 48X 15.24 15.87 14.48 15.16 0.36 0.56 0.20 0.38 12.32 14.73 60.70 63.10 6.35 2.54
Figure 2 DIP component dimensions
IPC-SM-782
Subject
DIP
Date
8/93
Section
13.1
Revision
Page2of4
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5.0 LAND PATTERN DIMENSIONS
Figure 3 provides the land pattern dimensions for DIP compo-
nents. These numbers represent industry consensus on the
best dimensions based on empirical knowledge of fabricated
land patterns.
In the table, the dimensions shown are at maximum material
condition (MMC). The least material condition (LMC) should
not exceed the fabrication (F) allowance shown on page 4.
The LMC and the MMC provide the limits for each dimension.
The dotted line in Figure 3 shows the grid placement court-
yard which is the area required to place land patterns and
their respective components in adjacent proximity without
interference or shorting. Numbers in the table represent the
number of grid elements (each element is 0.5 by 0.5 mm) in
accordance with the international grid detailed in IEC publica-
tion 97.
RLP No.
Component
Identifier Z (mm) G (mm) X (mm)
Y (mm) C (mm) D (mm) E (mm)
Placement Grid
(No. of Grid
Elements)ref ref ref ref
860 DIP 8 9.80 5.40 1.20 2.20 7.60 7.62 2.54 22x24
861 DIP 14 9.80 5.40 1.20 2.20 7.60 15.24 2.54 22x42
862 DIP 16 9.80 5.40 1.20 2.20 7.60 17.78 2.54 22x44
863 DIP 18 9.80 5.40 1.20 2.20 7.60 20.32 2.54 22x48
864 DIP 20 9.80 5.40 1.20 2.20 7.60 22.86 2.54 22x56
865 DIP 22L 12.40 8.00 1.20 2.20 10.20 25.40 2.54 26x58
866 DIP 24 9.80 5.40 1.20 2.20 7.60 27.94 2.54 38x66
867 DIP 24L 12.40 8.00 1.20 2.20 10.20 27.94 2.54 26x64
867 DIP 24X 17.40 13.00 1.20 2.20 15.20 27.94 2.54 36x68
869 DIP 28 9.80 5.40 1.20 2.20 7.60 33.02 2.54 22x74
870 DIP 28X 17.40 13.00 1.20 2.20 15.20 33.02 2.54 36x84
871 DIP 40X 17.40 13.00 1.20 2.20 15.20 48.26 2.54 36x110
872 DIP 48X 17.40 13.00 1.20 2.20 15.20 58.42 2.54 36x130
Figure 3 DIP land pattern dimensions
IPC-782-13-1-3
IPC-SM-782
Subject
DIP
Date
8/93
Section
13.1
Revision
Page3of4
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