N7201A616E00_0317.pdf - 第111页

NPM-W 2 EJM7DE-MB-02O-0 0 First layer Second layer Third layer Fourth layer 2-2-2 -10 Library Displays the library data of installable feeders. Displays the library data of available nozzles. Placement nozzle Feeder Data…

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NPM-W2 EJM7DE-MB-02O-00
First layer Second layer Third layer Fourth layer
2-2-2-9
Engineer mode 3
Compo-
nent
names
Menu configuration 5
Operating procedure
2-2-2
PCB
Feeder
Production
data menu
Data
modification
Placement
Checks and modifies
production data.
Pattern
Tray
Dispensing
(Dispensing
head)
Checks the component list used in
the table.
Checks the component shape data
used in the table.
Enters and modifies the dispensing
condition data used in the table.
Checks and modifies pattern attribute
data.
Checks and modifies group attribute
data.
Enters and modifies the tray-related
data including tray sizes and pitches.
Configures pallet and feeder settings.
Enters and modifies component
shape data.
Enters and modifies placement
condition data.
Checks and modifies PCB warpage
data.
Configures pallet and feeder settings.
Enters and modifies component
shape data.
Enters and modifies placement
condition data.
Checks and modifies PCB data.
Checks and modifies PCB recognition
data.
Checks and modifies support pin
(for automatic change) data.
NPM-W2 EJM7DE-MB-02O-00
First layer Second layer Third layer Fourth layer
2-2-2-10
Library
Displays the library data of installable feeders.
Displays the library data of available nozzles.
Placement nozzle
Feeder
Data check
Checks production data
Checks transcription conditions.
(Displayed when the transcription unit is mounted)
(option)
Nozzle stock
Displays information on the nozzles retained by the
nozzle changer.
Soft switch
Checks the setting status of the soft
switch used to set up operating
conditions.
Checks the setting status of the
machine’s communication switch.
Nozzle selection
(dispensing head)
Checks the nozzle and adhesive set in the head.
Checks and modifies the control conditions when adhesive
is dispensed.
Dispensing
Checks and modifies the dispensing data.
Dummy
dispensing
(dispensing
head)
Checks and modifies the dummy
dispensing data.
Checks and modifies the dummy
dispensing recognition data.
Displays the library data of applicable adhesive (material for
dispensing).
Adhesive
Displays the library data of available nozzles.
Dispensing nozzle
Preparation
NPM-W2 EJM7DE-MB-02O-00
First layer Second layer Third layer Fourth layer
2-2-2-11
Engineer mode 4
Compo-
nent
names
Menu configuration 6
Operating procedure
2-2-2
Production
data menu
Teach
Checks the PCB recognition
process and fixes PCB recognition
coordinates.
PCB
Feeder
Placement
Pattern attribute
Tray
Dispensing
Checks dispensing conditions for
PCB and conditions for adjusting
dispensing position misalignment.
Checks dispensing conditions
regarding dummy dispensing
(including adhesive recognition)
action and modifies the data.
Checks an image with lighting changed for
confirmation of the light condition which is
suitable for inspection.
Inspection
By changing the light value, checks
the conditions best for inspection
with watching on the screen.
Checks the component recognition
process and modifies component data.
Moves to a component pickup
position and sets the pickup offset.
Moves to a component pickup position
and sets the tray pickup position.
Checks PCB placement state and then
the conditions to correct PCB
displacement.
Checks the bad mark recognition
process and modifies the bad mark
coordinates.
Selects a target for conditional
placement on a placement point basis.
Checks the machine judgment mark
recognition process.
Checks the component recognition
process and modifies component data.
Checks the PCB warpage process and
modifies the measurement point data.
Dummy dispensing