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NPM-W 2 EJM7DE-MB-09O -00 9-1-1 -6 At a glance BGA / CSP recognition condition (T ype 1 ) Conditions of BGA and CSP which can be placed are as follows: *1) 8-nozzle head 3-nozzle head Outer dimensions 2 x 2 to 32 x 32 mm…

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NPM-W2 EJM7DE-MB-09O-00
9-1-1-5
Recognition unit configuration 1
■Multi-recognition camera: [Type 1]
Corrects position and angle displacement during component pickup.
It also enabled to detect BGA / CSP solder ball presence / absence using the lateral light (option).
*1) There are some limitations for detectable parts.
For details, (see →”BGA/CSP recognition condition (Type1 )””
Recognition
method
Recognition speed Applicable component
Batch recognition High speed
General chip components including a square chip of 03015
*2)
or larger
e.g.: BGA / CSP, QFP, SOP, connector, etc
QFP recognition condition (Type 1 )
Conditions of QFP which enables to be placed are as follows
*3)
.
8-nozzle head 3-nozzle head
Outer dimensions 5 x 5 to 32 x 32 mm 5 x 5 to 45 x 45 mm
Thickness 1.0 to 12 mm 1.0 to 30 mm
Lead pitch
0.5 mm, 0.65 mm, 1.0 mm,1.27 mm,
1.5 mm
0.4 mm, 0.5 mm, 0.65 mm, 1.0 mm, 1.27 mm,
1.5 mm
Lead width 0.2 mm or longer
Lead shape The amount of lead protrusion from the mold should be 1 mm or more.
Supply type: Tape, tray
*3) Basically, either OK or NG is judged by placement review and experimental trial using sample.
●For components other than above specifications, contact us.
*2) When “03015 placement support (option) is selected
Specifi-
cation
Machine specifications/
Basic performance 3
Operating procedure
9-1-1
NPM-W2 EJM7DE-MB-09O-00
9-1-1-6
At
a glance
BGA / CSP recognition condition (Type 1 )
Conditions of BGA and CSP which can be placed are as follows:
*1)
8-nozzle head 3-nozzle head
Outer dimensions 2 x 2 to 32 x 32 mm
*2)
2 x 2 to 45 x 45 mm
*2)
Thickness 0.3 to 12 mm 0.3 to 30 mm
Ball pitch 0.4
*2)
to 1.5 mm 0.3
*2)
to 1.5 mm
Ball diameter φ0.15 to φ0.9 mm
Ball shape Ball or cylinder type
*3)
Ball material High temperature solder or eutectic solder
Maximum
number of balls
4096 balls
For positive-grid arrangement: (The number of rows x the number of columns) in the
outermost region is (64 x 64) balls
For staggered arrangement: (The number of rows x the number of columns) in the
outermost region is (32 x 32) balls
Minimum number
of balls
9 balls
(The number of rows x the number of columns) in the outermost region is (3 x 3) balls
Ball arraignment The balls should be uniform in pitch and size.
*4)
Supply type: Tape, tray
・The recognition of the outer shape of BGA / CSP and the simultaneous recognition of solder balls are
intended for those whose body is made of glass epoxy.
Recognition may be difficult depending on the condition of the solder ball placement surface (presence of
patterns / through holes, gloss, etc.).
・Those whose body is made of ceramic, or whose body color is gold, are placed by using the outer shape
recognition only.
・Keep the ball surfaces from becoming cloudy or turbid due to oxidation. You need to experimentally confirm
what degree of oxidation affects the availability of recognition.
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) Consult us for large-sized fine-pitch components.
*3) Certain combinations of 2 ball pitches and ball diameters may make it impossible for you to perform
placement.
*4) The same Ball Miss and Plover pattern that are provided in the JEDEC and EIAJ with respect to BGA /
CSP are used.
●For components outside the above specifications, contact us.
NPM-W2 EJM7DE-MB-09O-00
Specifi-
cation
Machine specifications/
Basic performance 4
Operating procedure
9-1-1
9-1-1-7
Recognition unit configuration 2
Connector recognition condition (Type 1 )
General conditions of a connector which can be placed are as follows
*1)
.
8-nozzle head
3-nozzle head
Outer dimensions 32 x 32 mm or less L 100 x W 90 mm or less
*2)
Lead pitch 0.5 mm or more
Lead width 0.2 mm or more
Lead shape The amount of lead protrusion from the body should be 1 mm or more.
Other shape
There should be no through holes in a vertical direction around contact pins.
Contact pins should not be exposed on the under surface.
Supply type: Tape, tray, stick
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) In the case of placement of a large connector, its size may be limited due to a relationship between the
pickup position and the camera view as well as this condition.
For details, contact us.