晶圆测试说明书Cascade-11861-6-Manual.pdf - 第40页
16 • Summit 11K/12K Probe Station User’ s Guide 12500 G UARDED P RO B E S TATIONS The 12500 has a triaxial guarded architectu re. The station provides a low residual- capacitance measuremen t environmen t for subs trate …
Chapter 2: Station Specifications •
15
X-Y STAGE
a
Repeatability and accuracy specs are one sigma.
Z STAGE
a
Repeatability and accuracy specs are one sigma.
MICROCHAMBER
12500, 12600, 12700, 12800
12100 PROBE STATIONS
The 12100 probe stations are designed so that they can be easily reconfigured and
upgraded.
Chuck Specifications
Travel 203 mm x 203 mm
(8 in. x 8 in.)
Resolution 0.1 micron (.004 mil)
Bearings Cross-roller
Stage travel speed: >51 mm/second (2 in./second)
Repeatability
a
≤ + 1 micron (.04 mil)
Accuracy
a
≤ + 2 micron (.08 mil)
Travel 5 mm (.20 in.)
Resolution 1 micron (.04 mil)
Stage travel speed: >15 mm/second (.6 in/second)
Repeatability
a
≤ + 1 micron (.04 mil)
Accuracy
a
≤ + 2 micron (.08 mil)
EMI Isolation Yes
Light tight Yes
Enclosure Dry air, inert gas purge capable
Maximum number of positioners Eight DCM (seven with high-power
microscope) or four RF
Flatness 10-micron (0.39 mil) across total
surface
Isolation, chuck to base > 10 TΩ
Auxiliary chucks Two with individual vacuum control
Breakdown bias voltage > 1000-volts
Vacuum distribution area 13, 75, or 152 mm (selectable)
16
• Summit 11K/12K Probe Station User’s Guide
12500 GUARDED PROBE STATIONS
The 12500 has a triaxial guarded architecture. The station provides a low residual-
capacitance measurement environment for substrate measurements. By
eliminating residual capacitance, the 12500 enables precise, low-level
measurements without using integration intervals. Typical improvements are
from 100 to 1000 times in the sub-pA measurement range.
The MicroChamber works as a Faraday cage to further reduce chuck variation to
30 fF (12550), and as low as 3 fF (12560) with the AttoGuard version. This feature
enables you to measure capacitance without having to null position-dependent
capacitance changes.
Chuck Specifications
Flatness 10 micron (0.39 mil) across total
surface
Residual capacitance, chuck to shield
(FemtoGuard version)
< 20 pF
Residual capacitance, chuck to shield
(AttoGuard version)
< 0.2 pF
Capacitance variation over chuck
surface
≤ 3 fF with AttoGuard
≤ 30 fF with FemtoGuard
Isolation, chuck to shield > 10 TΩ
Breakdown bias voltage > 1000-volts
Chuck leakage current after 10
seconds (FemtoGuard version)
5 fA @ 0-volts
10 fA @ 10-volts
20 fA @ 100-volts
Chuck leakage current after 10
seconds (AttoGuard version)
3 fA @ 0 -100-volts
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
Chapter 2: Station Specifications •
17
12600 THERMAL PROBE STATIONS
The 12600 provides temperature control of wafers over a -65
o
C to +200
o
C range
(300
o
C on HT version). Since the wafer is enclosed in the low-volume
MicroChamber, temperature transitions are fast. You can verify the calibration at
each temperature level using a Cascade ISS on an integrated auxiliary stage and
Cascade's VNA calibration software.
Chuck Specifications
12700 GUARDED THERMAL PROBE STATIONS
The 12700 offers the same thermal testing capacity as a 12600, but with an
advanced reduced-noise thermal chuck. Using Cascade Microtech’s patented
FemtoGuard thermal chuck technology, the 12700 provides wafer temperature
control in a reduced noise and capacitance environment. Chuck noise is reduced
1000-times over standard thermal chucks. The noise on topside probes reduces to
fA levels.
Chuck Specifications
Flatness 25 micron (1 mil) to 130 °C, 51 micron (2
mil) to 200 °C
Residual capacitance, chuck to
shield (standard version)
< 950 pF
Isolation, chuck to shield > 1 GΩ at 500-volts DC at 25 °C
Breakdown bias voltage > 500-volts
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5 °C or +0.5%,
whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
Flatness 25 micron (1 mil) to 130 °C, 51 micron (2
mil) to 200 °C
Residual capacitance, chuck to
shield
< 50 pF
Capacitance variation over chuck
surface
≤ 30 fF
Isolation, chuck to shield > 1 TΩ
Breakdown bias voltage > 500-volts
Chuck leakage current, thermal
chuck on
0 to 100-volts: < 50 fA
Chuck leakage current, thermal
chuck off
0 to 100-volts, 20 fA
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5 °C or 0.5% whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control