晶圆测试说明书Cascade-11861-6-Manual.pdf - 第87页
Chapter 4: Verifying and Operating • 63 Before loading and unloading wafers , take the following precautions: • Make sure that the a ccess door interlock conne cts to the chuck-biasing power- supply’s interlock and opera…
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• Summit 11K/12K Probe Station User’s Guide
N
OTE
If the system has not been purged for several days, you should purge the system
for 30 minutes. For subsequent purges, 15 minutes should be sufficient.
After the initial purge you can reduce the purge flow rate to three SCFM. Chuck
temperature transitions occur faster at lower purge rates.
Never operate the system with a purge flow rate less than three SCFM
at
temperatures below 41°C.
For temperatures above 41°C, use a purge flow rate of two SCFM to minimize
thermal coupling between the chuck and the probes and cables.
SECOND STEP
With the Temptronic controller, fill the coolant reservoir
1. Turn on the Temptronic controller.
2. Fill the coolant reservoir. See also, the Temptronic manual.
3. Power up the station.
4. Set T1 and T2 on the Temptronic controller to the desired temperatures
(between -55 and +200°C). See the section “Local Operation” in the
Temptronic ThermoChuck Operator’s Manual for how to set temperatures.
5. Wait until the Temptronic controller verifies that the specified temperatures
are reached.
6. Inspect the coolant lines and fittings for coolant leaks. If there are no leaks,
slide the insulating covers over the fittings.
7. Check for frost on the chuck. Check at different temperatures to ensure that
frost is not accumulating.
8. If frost forms, see Troubleshooting.
Air Dryer Settings
See air dryer
documentation.
When you first purge the MicroChamber at the end of installation, or when you
haven't used it for several days, set the flow rate at 7 SCFM for 30 minutes to
thoroughly dry the MicroChamber. After the initial purge, you can reduce the
purge time to 15 minutes after each time you open and close the MicroChamber.
After purging, you can set the operating temperature. Set the flow rate at 3 SCFM
for temperatures below 41°C. For temperatures above 41°C, set the flow rate to 2
SCFM.
Handling Wafers with the MicroChamber
DANGER
Chuck bias voltages can be lethal; chuck temperature extremes can cause serious
injury. Before opening the MicroChamber access door, ensure that voltage is not
applied to the chuck, and the chuck is not at a temperature extreme.
Chapter 4: Verifying and Operating •
63
Before loading and unloading wafers, take the following precautions:
• Make sure that the access door interlock connects to the chuck-biasing power-
supply’s interlock and operates correctly.
• Set the power source to zero volts before changing the wafer.
• Make sure that the chuck is close to room temperature.
• In addition to the connection to the power-supply’s interlock, you can set up
prober control software to indicate whether the door is open or closed.
CAUTION
Avoid touching the chuck. Chuck surface contaminants can interfere with electrical
contact between the chuck and wafer.
To load a wafer
1. Raise the Z-lever.
2. Open the MicroChamber access door.
3. Rotate the roll-out stage handle counterclockwise to unlock, then pull the
stage forward.
4. Turn off chuck vacuum.
5. Use wafer tweezers to place the wafer in the chuck center, aligning it visually.
6. Turn on chuck vacuum.
7. Using the roll-out stage handle, push back the stage all the way, and then
rotate the handle clockwise to lock the roll-out stage.
8. Close the MicroChamber access door.
To unload a wafer
Follow the first four preceding steps, and then:
1. Use wafer tweezers to remove the wafer.
2. Using the roll-out stage handle, push back the stage all the way, and then
rotate the handle clockwise to lock the roll-out stage.
3. Close the MicroChamber access door.
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• Summit 11K/12K Probe Station User’s Guide