晶圆测试说明书Cascade-11861-6-Manual.pdf - 第41页
Chapter 2: Station Specifications • 17 12600 T HERMAL P ROB E S TATIONS The 12600 provides temperat ure control of wafers over a -65 o C to +200 o C range (300 o C on HT version). Since the wafer is enclosed in the low-v…
16
• Summit 11K/12K Probe Station User’s Guide
12500 GUARDED PROBE STATIONS
The 12500 has a triaxial guarded architecture. The station provides a low residual-
capacitance measurement environment for substrate measurements. By
eliminating residual capacitance, the 12500 enables precise, low-level
measurements without using integration intervals. Typical improvements are
from 100 to 1000 times in the sub-pA measurement range.
The MicroChamber works as a Faraday cage to further reduce chuck variation to
30 fF (12550), and as low as 3 fF (12560) with the AttoGuard version. This feature
enables you to measure capacitance without having to null position-dependent
capacitance changes.
Chuck Specifications
Flatness 10 micron (0.39 mil) across total
surface
Residual capacitance, chuck to shield
(FemtoGuard version)
< 20 pF
Residual capacitance, chuck to shield
(AttoGuard version)
< 0.2 pF
Capacitance variation over chuck
surface
≤ 3 fF with AttoGuard
≤ 30 fF with FemtoGuard
Isolation, chuck to shield > 10 TΩ
Breakdown bias voltage > 1000-volts
Chuck leakage current after 10
seconds (FemtoGuard version)
5 fA @ 0-volts
10 fA @ 10-volts
20 fA @ 100-volts
Chuck leakage current after 10
seconds (AttoGuard version)
3 fA @ 0 -100-volts
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
Chapter 2: Station Specifications •
17
12600 THERMAL PROBE STATIONS
The 12600 provides temperature control of wafers over a -65
o
C to +200
o
C range
(300
o
C on HT version). Since the wafer is enclosed in the low-volume
MicroChamber, temperature transitions are fast. You can verify the calibration at
each temperature level using a Cascade ISS on an integrated auxiliary stage and
Cascade's VNA calibration software.
Chuck Specifications
12700 GUARDED THERMAL PROBE STATIONS
The 12700 offers the same thermal testing capacity as a 12600, but with an
advanced reduced-noise thermal chuck. Using Cascade Microtech’s patented
FemtoGuard thermal chuck technology, the 12700 provides wafer temperature
control in a reduced noise and capacitance environment. Chuck noise is reduced
1000-times over standard thermal chucks. The noise on topside probes reduces to
fA levels.
Chuck Specifications
Flatness 25 micron (1 mil) to 130 °C, 51 micron (2
mil) to 200 °C
Residual capacitance, chuck to
shield (standard version)
< 950 pF
Isolation, chuck to shield > 1 GΩ at 500-volts DC at 25 °C
Breakdown bias voltage > 500-volts
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5 °C or +0.5%,
whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
Flatness 25 micron (1 mil) to 130 °C, 51 micron (2
mil) to 200 °C
Residual capacitance, chuck to
shield
< 50 pF
Capacitance variation over chuck
surface
≤ 30 fF
Isolation, chuck to shield > 1 TΩ
Breakdown bias voltage > 500-volts
Chuck leakage current, thermal
chuck on
0 to 100-volts: < 50 fA
Chuck leakage current, thermal
chuck off
0 to 100-volts, 20 fA
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5 °C or 0.5% whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
18
• Summit 11K/12K Probe Station User’s Guide
12800 GUARDED THERMAL PROBE STATIONS
The 12800 offers the same thermal testing capacity as a 12700, but with an
advanced reduced-noise thermal chuck. Using Cascade Microtech’s patented
FemtoGuard thermal chuck technology, the 12700 provides wafer temperature
control in a reduced noise and capacitance environment. Chuck noise is reduced
1000-times over standard thermal chucks. The noise on topside probes reduces to
fA levels.
Chuck Specifications
Flatness 25-micron (1 mil) to 130°C, 51-micron
(2 mil) to 200°C
Residual capacitance, chuck to shield 1 pF
Capacitance variation over chuck
surface
3 fF
Isolation, chuck to shield > 1 TΩ
Breakdown bias voltage > 500-volts
Chuck leakage current, thermal
chuck on
0 to 100 volts: < 50 fA
Chuck leakage current, thermal
chuck off
0 to 100 volts, 20 fA
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5 °C or 0.5% whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control