00198442-04_UM_TX-V2_EN.pdf - 第135页

Instruction manual SIPLACE TX 3 Technical data and assemblies From software version 714.0 12/2020 3.5 Placement head 135 3.5.5.9 T echnical dat a for SIPLACE MultiSt ar (CPP M) in SIPLACE TX2 m SIPLACE MultiStar (CPP M) …

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3 Technical data and assemblies Instruction manual SIPLACE TX
3.5 Placement head From software version 714.0 12/2020
134
3.5.5.8 Technical data for SIPLACE MultiStar (CPP) on SIPLACE TX
3
SIPLACE MultiStar (CPP)
With component camera
type 30
With component camera
type 45
With component camera
type 33
(stationary camera)
Component range
*a
01005 to 27 mm x 27 mm 01005 to 15 mm x 15 mm 0402 to 50 mm x 40 mm
*b
Component spec.
Max height
*c
Max. height
*d
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
4.0 mm
*e
/ 6.0 mm
8.5 mm
250 µm
100 µm
*f
/ 200 µm
*g
250 µm
e
/ 350 µm
140 µm
e
/ 200 µm
f
0.4 mm x 0.2 mm
27 mm x 27 mm
4 g
*h
4.0 mm
*e
/ 6.0 mm
8.5 mm
250 µm / 120 µm
*i
50 µm
140 µm
70 µm
0.11 mm x 0.11 mm
15 mm x 15 mm
4 g
h
11.5 / 15.5 mm
*j
300 µm
150 µm
350 µm
200 µm
1.0 mm x 0.5 mm
50 mm x 40 mm
8 g
h
Set-down force 1.0 - 15 N
i
Nozzle types 20xx, 28xx 20xx, 28xx 20xx, 28xx
X/Y accuracy
*k
Standard ± 35 µm/3σ ± 35 µm/3σ ± 35 µm/3σ
Angular accuracy ± 0.20° / 3σ
*l
, ± 0.38° /
3σ
*m
± 0.38° / 3σ ± 0.14° / 3σ
Illumination level 5 5 6
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b A diagonal of 69 mm is possible during multiple measurements (e.g. 64 mm x 10 mm).
*)c CPP head: in low installation position (stationary component camera not possible).
*)d CPP head: In high installation position
*)e Only 4 mm possible for SIPLACE TX2i.
*)f For components < 18 mm x 18 mm.
*)g For components ≥ 18 mm x18 mm.
*)h 20 g in "Pick&Place" mode
*)i Only possible for components which are within the camera focal area of ± 1.3 mm.
*)j 15.5 mm available only in high assembly position, with OSC package and restrictions.
*)k The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.
*)l Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)m Component dimensions smaller than 6 mm x 6 mm.
Instruction manual SIPLACE TX 3 Technical data and assemblies
From software version 714.0 12/2020 3.5 Placement head
135
3.5.5.9 Technical data for SIPLACE MultiStar (CPP M) in SIPLACE TX2 m
SIPLACE MultiStar (CPP M)
With component camera
type 45 (Standard)
With component camera
type 30 (Optional)
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific
standards, the component packaging tolerances and the component tolerances.
01005 to 15 mm x 15 mm 01005 to 27 mm x 27 mm
Component specifications
Max. height
*b
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*)b CPP M head: in low installation position
6.0 mm
250 µm / 120 µm
*c
50 µm
140 µm
70 µm
0.11 mm x 0.11 mm
15 mm x 15 mm
4 g
*)c Only possible for components which are within the camera focal area of ± 1.3 mm.
6.0 mm
250 µm
100 µm
*d
/ 200 µm
*e
250 µm
e
/ 350 µm
f
140 µm
e
/ 200 µm
f
0.4 mm x 0.2 mm
27 mm x 27 mm
4 g
*)d For components < 18 mm x 18 mm.
*)e For components ≥ 18 mm x18 mm
Programmable set-down force 1.0 - 15 N
Nozzle types 20xx, 28xx
X/Y accuracy
*f
With "accuracy class"
*g
Without "accuracy class"
*)f The benchmark and accuracy values are measured during the machine acceptance tests and correspond
to the conditions set out in the ASM scope of service and supply.
*)g Setting the accuracy class in the SIPLACE Pro Component Shape Editor or Placement Position Editor.
± 20 µm/3σ
± 25 µm/3σ
± 20 µm/3σ
± 25 µm/3σ
Angular accuracy ± 0.18° / 3σ ± 0.18° / 3σ
Illumination level 5 5
Standard functions High-resolution camera, vacuum sensor, force measurement,
component sensor, integrated turning station per segment, PCB
warpage check, individual image of each component
3 Technical data and assemblies Instruction manual SIPLACE TX
3.5 Placement head From software version 714.0 12/2020
136
3.5.6 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 11 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1)
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis