IPC-CM-770D-1996.pdf - 第10页
IPC-CM-770 Januaty 1996 15.0 15.1 15.2 15.3 15.4 15.5 15.6 15.7 Table of Contents . Section 4 CONNECTORS ....................................................... 4-1 19.0 Performance Considerations .......................…
January
1996
IPC-CM-770
Figure 10-5
Figure 10-6
Figure 10-7
Figure 10-8
Figure 10-9
Figure 10-10
Figure 10-11
Figure 11-1
Figure 11-2
Figure 11-3
Figure 11-4
Figure 11-5
Figure 11-6
Figure 11-7
Figure 11-8
Figure 11-9
Figure 11-10
Figure 11-1 1
Figure 11-12
Figure 11-13
Figure 11-14
Figure 11-15
Figure 12-1
Figure 12-2
Figure 12-3
Figure 12-4
Figure 12-5
Figure 12-6
Figure 13-1
Figure 13-2
Figure 13-3
Figure 13-4
Figure 14-1
Figure 14-2
Figure 14-3
Figure 14-4
Resilient Spacer to Heat Sink Frame
........................
3-9
Modifying DIP for Surface Mounting
......................
3-9
Gull-Wing Lead for SIP-type Component
................
3-9
Dual-in-line Package Gripping Tools
......................
3-10
DIP Clearances
.........................................................
3-10
DIP Layout in Rows and Columns
.........................
3-11
DIP Slide Magazines
...............................................
3-11
Flatpack Outline Drawing
.......................................
3-12
Quad Pack Configuration
........................................
3-12
Typical Ribbon Leaded Discrete Device
Outline Drawing
......................................................
3-13
Staggered Hole Pattern Mounting
.
“MO” Flatpack
Outline Drawing (Only Inches Shown)
..................
3-13
Through-hole Mounting
.
“MO” Flatpack
Outline Drawing
......................................................
3-13
Through-the-board board Mounting with
Unclinched Leads
....................................................
3-13
Through-the-board Mounting with Clinched
Leads and Circumscribing Land
.............................
3-14
Through-the-board Mounting with Offset Land
.....
3-14
Lead Bending Requirements for Surface
Mounting
..................................................................
3-14
Surface-mounted Flatpacks
.....................................
3-15
Typical Surface Land Flatpack Mounting
..............
3-15
Minimum Planar Lead Contact
...............................
3-15
Axial Alignment
.......................................................
3-15
Lead Extension
........................................................
3-16
Welded Configurations
............................................
3-16
The 50-mil Center JEDEC Packages
......................
3-18
Features Common to the 50-mil Center
Packages
...................................................................
3-18
Type A (Leaded Type B)
.........................................
3-19
Criteria for Lead Attachment to Leadless
Double Row Plastic Chip Carrier
...........................
3-21
Criteria for Lead Attachment to Leadless
Type A (Leaded Type B)
.........................................
3-21
Land Pattern for Type A Leaded Chip Carrier
Mounting
..................................................................
3-22
149 Pin Array Package
............................................
3-23
I/O
Density Versus Lead Count (All Dimensions
in Inches)
.................................................................
3-24
Zero Insertion Force Socket
....................................
3-24
Ball Grid Array Package Outline
............................
3-27
Packaging and Assembling Integrated Circuits
......
3-28
Face-down Bonding Concepts
.................................
3-28
Beam-lead Transistor
...............................................
3-29
Wire Bonding Layout Features
..............................
3-30
Tables
Table 12-1 Chip Carrier Application Considerations
...................
3-17
Table 12-2 JEDEC Ceramic Sizes and Fine Pitch
Terminal Counts
.........................................................
3-19
Table 12-3 JEDEC Designations
..................................................
3-20
Table 13-1 Variations in BGA Package Sizes
..............................
3-25
Table 13-2 BGA Solder Sphere Dimensions and Package
Coplanarity
..................................................................
3-26
Table 14-1 Various Chip Bonding Adhesive Types
.....................
3-29
Table 14-2 Wire Bonding Feature Limits (see Figure 14-4)
.......
3-29
V
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
IPC-CM-770
Januaty
1996
15.0
15.1
15.2
15.3
15.4
15.5
15.6
15.7
Table
of
Contents
.
Section
4
CONNECTORS
.......................................................
4-1
19.0
Performance Considerations
.........................
4-
1
Selection Considerations 4-
1
Part Type Descriptions 4-2
Through-Hole Mount Connectors 4-3
Surface Mounting
.........................................
4-4
Mixed Technology 4-5
Manual Assembly
.........................................
4-5
19.1
19.2
19.3
..............................
.................................
................
19.4
........................................
15.8 Automated Assembly
....................................
4-5
15.9 Handling and Storage
...................................
4-5
15.10
Soldering
.......................................................
4-6
15.11
Cleaning
........................................................
4-6
15.12 Coating
..........................................................
4-6
16.0
DISCRETE COMPONENT SOCKETS
...................
4-6
16.1 Part Type Description
...................................
4-6
16.2 Through-Hole Mounting
.............................
4-1
1
16.3 Surface Mounting
.......................................
4-13
16.4 Mixed Technology
......................................
4-14
16.5 Manual Assembly
.......................................
4-15
16.6 Automated Assembly
..................................
4-15
16.7 Handling and Storage
.................................
4-15
16.8 Soldering
.....................................................
4-15
16.9 Cleaning
......................................................
4-15
16.10 Coating
........................................................
4-15
17.0
INTERCONNECT COMPONENTS
.......................
4-15
17.1 Part Type Description
.................................
4-15
17.2 Through-Hole Mounting
.............................
4-20
17.3 Surface Mounting
.......................................
4-24
17.4 Mixed Technology
......................................
4-25
17.5 Manual Assembly
.......................................
4-25
17.6 Automated Assembly
..................................
4-25
17.7 Handling and Storage
.................................
4-25
17.8 Soldering
.....................................................
4-25
17.9 Cleaning
......................................................
4-25
17.10 Conformal Coating
.....................................
4-25
18.0
MECHANICAL COMPONENTS
...........................
4-26
18.1 Part Type Description
.................................
4-26
18.2 Through-Hole Mounting
.............................
4-28
18.3 Surface Mounting
.......................................
4-28
18.4 Mixed Technology
......................................
4-28
18.5 Manual Assembly
.......................................
4-28
18.6 Automated Assembly
..................................
4-28
18.7 Handling and Storage
.................................
4-29
18.8 Soldering
.....................................................
4-29
18.10 Conformal Coating
.....................................
4-29
18.9 Cleaning
......................................................
4-29
PACKAGING AND INTERCONNECTING
STRUCTURES
......................................................
4-29
Printed Boards
............................................
4-29
Surface Mounting
.......................................
4-30
Supporting-Plane Printed Board
Structures
....................................................
4-30
Constraining Core Printed Board
Structures
....................................................
4-32
Figure 15-1
Figure 15-2
Figure 15-3
Figure 15-4
Figure 15-5
Figure 15-6
Figure 15-7
Figure 15-8
Figure 15-9
Figure 15-10
Figure 15-11
Figure 15-12
Figure 15-13
Figure 16-1
Figure 16-2
Figures
Typical Polarization
...................................................
4-2
Connector with Keying and Polarization
..................
4-2
Card Edge Connector to Ribbon Cable
....................
4-2
Card Edge Connector for Discrete Wiring
...............
4-2
Card Guide Connector
...............................................
4-3
Two-piece Connector System
....................................
4-3
Header Connectors
.....................................................
4-3
Female Receptacles
...................................................
4-4
Connector with Press Fit Contacts
............................
4-4
Surface Mount Connector
.........................................
4-5
D-subminiature Surface Mount Connector
...............
4-6
Surface Mount Receptacle
.........................................
4-7
Box-contact Surface Mount Receptacle
....................
4-7
Low Profile Pluggable Devices
.................................
4-8
Low Profile Devices
..................................................
4-8
Figure 16-3 Closed Bottom Socket
...............................................
4-8
Figure 16-4 Low Profile Grip Type Device
..................................
4-8
Figure 16-5
Use of Low Profile Grip Devices
.............................
4-8
Figure 16-6 Styles of Low-Profile Grip Devives
..........................
4-9
Figure 16-7
Contact Configurations
..............................................
4-9
Figure 16-9 Surface Mount Chip Carrier Socket
........................
4-10
Figure 16-10 Pin Grid Array Sockets
............................................
4-11
Figure 16-11 Leadless Grid Array Socket
....................................
4-12
Figure 16-12 Section Through Socket Solder Contact
.................
4-12
Figure 16-13 Screw Down Cover
.................................................
4-13
Figure 16-15 Section Through Pressure Mounted Socket
............
4-14
Figure 16-8 DIP Socket
...............................................................
4-10
Figure 16-14 High Speed Circuit Socket
......................................
4-13
Figure 16-16 Example of 68
I/O
Land Pattern on Printed
Board Structure
........................................................
4-14
Figure 17-1 Typical Turret Terminals
.........................................
4-16
Figure 17-3
Typical Pin Terminals
..............................................
4-17
Figure 17-4 Typical Solder Cup Terminal
..................................
4-17
Figure 17-5 Typical Crimp Terminal
...........................................
4-17
Figure 17-2 Typical Bifurcated Terminals
..................................
4-16
Figure 17-6
Expendable Carrier Strip
.........................................
4-18
Figure 17-7
Stamped Pins
...........................................................
4-18
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COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
January
1996
IPC-CM-770
Figure 17-8
Figure 17-9
Figure 17-10
Figure 17-11
Figure 17-12
Figure 17-13
Figure 17-14
Figure 17-15
Figure 17-16
Figure 17-17
Figure 17-18
Figure 17-19
Figure 17-20
Figure 17-21
Figure 17-22
Figure 17-23
Figure 17-24
Figure 17-25
Figure 18-1
Figure 18-2
Figure 18-3
Figure 18-4
Figure 18-5
Figure 19-1
Figure 19-2
Figure 19-3
Figure 19-4
Figure 19-5
Figure 19-6
Figure 19-7
Figure 19-8
Table 16-1
Table 17-1
Table 17-2
Table 17-3
Table 17-4
Table 17-5
Table 19-1
Compliant Press-fit Pins
..........................................
4-18
Solder Carrying Pins
...............................................
4-18
Vertically Mounted Bus Bars
..................................
4-19
Horizontally Mounted Bus Bars
.............................
4-20
Under-DIP Mounted Bus Bars
................................
4-20
One-terminal Printed Board Test Point
...................
4-21
Two-terminal Printed Board Test Point
..................
4-21
Terminal Installation. Single-Sided Board.
Soldered on Shoulder Side
......................................
4-21
Terminal Installation. Single-Sided Board.
Soldered on Flared Flange Side
..............................
4-22
Installation of Terminal in Plated-through Hole
.....
4-22
Elliptical Swaging
....................................................
4-22
Placement of Terminal-Mounted Components
.......
4-22
Double-ended Terminal
...........................................
4-23
Terminal Wrap Prior to Soldering
...........................
4-23
Methods of Mounting Jumpers
...............................
4-23
“Wrapping Terminology”
.......................................
4-24
Conventional Solderless Wrapped Connection
.......
4-24
Modified Solderless Wrapped Connection
..............
4-24
Common Component Heat Sinks
............................
4-26
Solderable Heat Sink
...............................................
4-26
Typical Spacers
........................................................
4-27
Can Mounting Spreader
...........................................
4-27
Thermally Conductive Insulator
..............................
4-27
Printed Board Bonded to Supporting Plane
...........
4-30
Sequentially-processed Structure with
Supporting Plane
......................................................
4-32
Discrete-wire Structure with Low-expansion
Metal Support Plane
................................................
4-32
Flexible Printed Board with Metal Support
Plane
.........................................................................
4-33
Printed Board with Supporting Plane (Not
Electrically-functional Constraining Core)
.............
4-33
Multilayer Printed Board Structure with
Copper-clad Invar Power and Ground Planes
(Electricallyfunctional Constraining Cores)
............
4-34
Balanced Structure with Constraining Core
not at Neutral Axis
..................................................
4-34
Balanced Structure with Constraining Core
on Neutral Axis
........................................................
4-34
Tables
Socket Types
...............................................................
4-10
Current Carrying Capacity of Small Wires
...............
4-19
Breaking Strength of Small Wires
.............................
4-19
Turns Requirement
.....................................................
4-24
Wire Size (in inches)
..................................................
4-24
Nicked or Broken Strand Limits
................................
4-25
Packaging and Interconnecting Structure
Comparison
.................................................................
4-31
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COPYRIGHT Association Connecting Electronics Industries
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COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services