IPC-CM-770D-1996.pdf - 第13页

January 1996 IPC-CM-770 Table 20-2 Epoxy device . Attachment Materials ......................... 5-6 Table 21-1 Lead Clinch ................................................................. 5-11 Table 23-1 Bonding Wire f…

IPC-CM-770

Januaty

1996

20.0

20.1

20.2

20.3

20.4

21.1

21.2

21.3

21.4

21.5

21.6

22.0

22.1

22.2

22.3

22.4

23.0

23.1

23.2

23.3

23.4

24.0

24.1

24.2

24.3

24.4

24.5

24.6

24.7

24.8

25.0

25.1

25.2

25.3

25.4

Table

Contents

Section

Figure 21-5 Lead Terminations

.....................................................

5-9

....................................

5-1

Figure 21-6 Clinch Patterns

.........................................................

5-11

General

Considerations""""""""""""""""'

5-1

Figure 21-7 Clinched Leads

........................................................

5-12

Figure 21-8 Offset Clinched Lead

...............................................

5-12

Figure 21-9 Straight Through Leads (Semi-clinched Leads)

.....

5-12

Figure 22-1 Depleted Solder

.......................................................

5-13

Assembly Processes

......................................

Process Flow

.................................................

5-1

Materials

.......................................................

5-2

THROUGH-HOLE

MOUNTING

TECHNIQUES .....

5-7

Figure 22-2 Lead Forming for Surface Mounting

......................

5-13

General Considerations

.................................

5-7

Figure 22-3

Preferred Mounting Orientations

.............................

5-14

Component Preparation

................................

5-7

Figure 23-1

Chip Termination Techniques

..................................

5-16

LeadHole Relationships

...............................

5-7

Figure 23-2 Thermocompression Ball Wire Bonding

Component Retention 5-7

Lead Configuration After Assembly

5-9

................................................................

Parameters 5-17

...................................

Figure 23-3 Mechanics of Thermocompression Ball Wire

............

Bondine

....................................................................

5-18

Assembly

.....................................................

5-12

Figure 23-4 Thermocompression Stitch Wire Bonding

..............

5-19

......................................................................

Automated Assembly 5-14

Quality Assurance

.......................................

5-14

System 5-20

Figure 23-8 COB Chip Handling System Block Diagram

.........

5-21

Figure 23-9 Fully-integrated COB Assembly System

................

5-21

..................................

CHIP-oN-BoARD

..........

5-14

Figure 24-1 Typical TAB Process Flow (bumbed wafer)

..........

5-22

General Considerations

...............................

5-14

~i~~~~ 24-2 Interconnection

G~~~~~~

B d ~i~

TAB

....

5.23

Die Attachment

...........................................

5-14

~i~~~~ 24-3 Interconnection

G~~~~~~

Bumped

Interconnection Techniques

........................

5-15

TAB (BTAB) 5-23

Assembly

.....................................................

5-19

Figure 24-4

l., 2., and 3 layer TAB Contructions

.....................

5-24

............................................................

TAPE AUTOMATED BONDING (TAB)

................

5-20

Figure 24-5 Excising of the leaded die from the tape

carrier

.......................................................................

5-24

Advantages

..................................................

5-20

Figure 24-6 TAB Mounting Options

...........................................

5-25

Disadvantages

.............................................

5-22

Figure 24-7 Registered Features for TAB Tape Outer-lead

...................

Types of TAB 5-22

Types of Tape

.............................................

5-23

Figure

25-1

Modifications

for

Through-ho1e

Bonding from JEDEC outline UO-O17 5-26

.............................................

Applications

.............................................................

5-27

TAB Applications

.......................................

5-24

Applications

.............................................................

5-27

Pattern Standardization (TAB Tape)

..........

5-25

Figure 25-3 Placement Machine Considerations

........................

5-28

Encapsulation

..............................................

5-25

Figure 25-4 Through-the Board Component Types

....................

5-29

Outer-Lead Bonding (OLB)

.......................

5-23

Figure 25-2 Component Modifications for Surface Mounting

INTERMIXED

TECHNOLOGY .............................

5-26

General Considerations

...............................

5-27

Manual Assembly

.......................................

5-3

Automated Assembly

..................................

5-3

Quality Assurance

.......................................

5-32

Figures

Figure 25-5 Surface Mount Component Types

...........................

5-29

Figure 25-6 Single-sided Board Assemblies

...............................

5-30

Figure 25-7 Double-sided/multilayer Board Assembly

..............

5-30

Figure 25-8 Mixed Technology Assemblies

................................

5-30

Figure 25-9 Sample Process Sequence

.......................................

5-30

Figure 25-10 Class

C-2

Process Sequence

....................................

5-32

Figure 25-11 Panel Assembly Tooling Holes

...............................

5-33

Figure 25-12 Positive Symbol Machine Correction

.....................

5-33

Figure

20-1

Clip-mounted

.........................................

5-4

Figure 25-13 Chip Placement

........................................................

5-33

Figure 20-2 Strap Securing

............................................................

5-4

Figure 21-1 Component Mounting Sequence

...............................

5-8

Tables

Figure 21-2 Component Retention-Deep Solder

........................

5-8

Table

20-1

Through

Hole

and

Mount

Assembly

Figure 21-3 Conforming Web-like Material

.................................

5-9 Process Flow Comparison

............................................

5-3

Figure 21-4 Thermal Shunt

...........................................................

5-9 Table 20-4 Various Bonding Adhesive Types 5-5

................................

...

v111

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January

1996

IPC-CM-770

Table 20-2 Epoxy device

Attachment Materials

.........................

5-6

Table 21-1 Lead Clinch

.................................................................

5-11

Table 23-1 Bonding Wire for COB Applications

.........................

5-16

Table 23-2 Aluminum and Gold Wire Sizes and Ratings

...........

5-16

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IPC-CM-770

Januaty

1996

26.0

26.1

26.2

26.3

26.4

27.0

27.1

27.2

27.3

27.4

27.5

28.0

28.1

28.2

28.3

28.4

29.0

29.1

29.2

29.3

29.4

29.5

30.0

30.1

30.2

30.3

30.4

30.5

30.6

Table

Contents

Section

Figures

HANDLING AND STORAGE

.................................

6-1

General Considerations

.................................

6-1

Figure 26-1 Warning Symbols

.......................................................

6-2

Electrostatic Discharge @SD) Protection

....

6-1

Figure 26-3 Schematic of a Typical Grounded Work Station

......

6-4

Handling

........................................................

Figure 26-4 Features of a Grounded Work Station

......................

6-4

Storage

..........................................................

6-3

Figure 26-5 Installation Guidelines for Grounded Work

Automation and Equipment

.........................

6-4

Benches and Floor Mats

............................................

6-5

......................................

SOLDER-RELATED CONSIDERATIONS

6-7

Figure 26-6 Proper Handling Procedures 6-6

Figure 30-2 R&R System Having a Very High Degree of

..............

General Considerations 6-7

.................................

Airkas Flow Control

...............................................

6-28

Solderability

..................................................

6-8

Materials

.......................................................

6-9

Component R&R System

........................................

6-29

Figure 30-3 Commercially Available Surface Mount

Component Retention

.................................

6-12

Figure 30-4 Single-sided Hot Air Component Remover

............

6-29

Machine Soldering Processes

.....................

6-12

Figure 30-5 Double-sided Hot Component Remover

.................

6-29

............

CLEANING-RELATED CONSIDERATIONS

6-18

Figure 30-6 Commercial Hot Air Component Remover 6-29

........

Figure 30-7 Small Hot Air Jet Lap Solder Joint Component

General Considerations

...............................

6-18

Removal

...................................................................

6-30

Pre-Cleaning

...............................................

6-18

Post-Soldering Cleaning

.............................

6-18

Component Removal

...............................................

6-30

Figure 30-8 Lap Reflow Soldering Tool Used for

Quality Assurance

.......................................

6-18

Figure 30-9 Hot Gripper

Hand Force Component

Remover

...................................................................

6-30

CONFORMAL COATING-RELATED

CONSIDERATIONS

..............................................

6-19

Figure 30-10 Thermal Tweezer -Finger Tip Controlled

Comoonent Remover

...............................................

6-30

General Considerations

...............................

6-19

Materials

.....................................................

6-19

Caution Notes 6-20

Tables

............................................

coating Techniques

....................................

6-21

Table 26-1 Susceptibility Ranges of Various Devices Exposed to

Quality Assurance 6-21

Electrostatic Discharge from a Person or Electronic

Equivalent

.....................................................................

6-1

.......................................

QUALITY ASSURANCE TESTING

......................

6-22

Table 26-2 Maximum Allowable Resistances and Discharge

.................................

Preassembly Assurance 6-23

Times for Static Safe Operations 6-3

Solderability 6-23

Table 27-1 Solder Alloys 6-10

Quality Assurance Provisions 6-23

Table 27-2 Solder Bath Contamination Limits 6-11

General

...

6-24

Table 29-1 Coating Thickness

......................................................

6-20

Printed Board Structure Modification/

Repair

.........................................................

6-25

Printed Board Assembly Modification/

Appendix A

Repair Methods

...........................................

6-25

Metric Conversion Tables

............................................................

6-32

...............................

..............................................................

................................................

............................

.....................

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