IPC-CM-770D-1996.pdf - 第4页
January 1996 IPC-CM-770 Acknowledgment Any Standard involving a complex IPC-CM-770 Task Group of the assisted in the evolution of this technology draws material from a Assembly & Joining Processes standard. To each o…
GPC
THE
INSTITUTE
FOR
INTERWNNECTING
AND
PACKAGING
ELECTRONIC
ORCUITS
IPC-CM-770D
Guidelines for Printed
Board Component
Mounting
Developed
by
the Institute for Interconnecting and Packaging
Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
I
PC
2215 Sanders Road
Northbrook, Illinois
Tel 847 509.9700
Fax 847 509.9798
60062-61
35
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
January
1996
IPC-CM-770
Acknowledgment
Any Standard involving a complex IPC-CM-770 Task Group of the assisted in the evolution of this
technology draws material from a Assembly
&
Joining Processes standard. To each of them, the
vast number of sources. While the Committee are shown below, it is not members of the IPC extend their
principle members of the possible to include all of those who
gratitude.
Assembly
&
Joining
Processes Committee
Chairman
Jim Reed
T.I.
IPC-CM-770
Task Group
Chairman
Sue Jones
Wilcox
Technical Liaison
of
the
IPC Board
of
Directors
Carl McCormick
Group Technologies
IPC-CM-770 Task Group
Arnold, Daniel, EMD Associates Inc.
Bellardo, Aldo, Alcatel Italia S.P.A.
Brill, Charles, Amp Inc.
Davy, J. Gordon, Westinghouse
Felty, Joe, Texas Instruments Inc.
Ferrari, Gary, Tech Circuits Inc.
Igo, Greg, Amkor Electronics Inc.
Jarboe, Mike, Alliedsignal Aerospace
Jawitz, Martin, Eimer Company
Electric Corp.
Jones, Sue, Wilcox Electric Inc.
Kenyon, William, Global Centre for
Knowles, Larry, Librascope Corp.
Lambert, Leo, Digital Equipment
Lovati, Guido, Alcatel Italia S.P.A.
Mackzum, Stan, Ericsson GE
Officer, R. Bruce, Lockheed
Process Change
Corp.
Sanders Inc.
Rudy, Donald, AT&T Bell
Rumps, Don, AT&T Technology
Schneider, Alvin, Alpha Metals Inc.
Schoenthaler, David, AT&T Bell
Swenson, Don, Alliedsignal Inc.
Taylor, Ralph, Lockheed Martin
Laboratories
Systems
Laboratories
Corporation
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
January
1996
IPC-CM-770
Table
of
Contents
.
Section
1
3.28 Mixed Component-Mounting Technology
...
1-6
3.29 Module
..........................................................
1-6
3.30 Mounting Hole
..............................................
1-6
3.3
1
Packaging and Interconnecting
1.3.1 Performance Classifications
.........................
1-1
3.32
Packaging and Interconnecting
1.4 Assembly Types
............................................
1-2
Structure @&IS) 1-6
1.5
Presentation
...................................................
1-2 3.33
Plated-Through Hole (PTH) 1-6
3.35 Printed Board 1-6
1.0
INTRODUCTION
.......................................................
1-1
1.1
Scope
.............................................................
1-1
1.2 Purpose
..........................................................
1-1
1.3 Producibility Levels
......................................
1
.
1
Assembly (P&IA) 1-6
.........................................
...........................................
.........................
3.34 Primary Side
.................................................
1-6
2.0
REFERENCE DOCUMENTS
....................................
1-2
2.1 Institute for Interconnecting and Packaging
3.36 Printed Board Assembly
...............................
1-6
2.2 Joint Industry Standards
...............................
1-3
3.37 Printed Wiring 1-6
2.3 Department
of
Defense
.................................
1-4
3.39 Register Marker 1-6
2.5 American National Standards Institute
........
1-4
2.6 Underwriters Laboratories
............................
1-4
................................................
Electronic Circuits (IPC) 1-2
..............................
...............................................
.........................................
3.38 Production Master 1-6
............................................
2.4 Electronic Industries Association
.................
1-4
...................................................
3.40 Registration 1-6
3.41 Secondary Side 1-6
3.42 Single In-Line Package (SIP) 1-6
.............................................
.......................
2.7 American Society for Testing and
Materials 1-4 3.43
.................................
.......................................................
Single-Sided Assembly 1-6
2.8
3
.O
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3
.
8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
3.26
Other Documents
..........................................
1-4 3.44
3.45
3.46
3.47
3.48
3.49
3.50
3.5
1
3.52
3.53
TERMS AND DEFINITIONS
.....................................
1-4
Assembly
.......................................................
1-5
Base Material
................................................
1-5
Castellations
..................................................
1-5
Chip Carrier
..................................................
1-5
Clinched Leads
.............................................
1-5
Coefficient of Thermal Expansion (CTE)
1-5
Coefficient of Thermal Expansion
Mismatch (CTE)
1-5
....
...........................................
Static Electricity
...........................................
Static Electricity Control
..............................
Supporting Plane
...........................................
Supported Hole
.............................................
Surface Mounting
.........................................
Thermal Expansion Mismatch
.....................
Through Connection
.....................................
Tooling Feature
.............................................
Unsupported Hole
.........................................
Via Hole
........................................................
1-6
1-6
1-7
1-7
1-7
1-7
1-7
1-7
1-7
1-7
Component
....................................................
1-5
4.0
COMPONENT
TYPE
................................................
1-7
Component Lead Hole
.................................
1-5
4.1 Discrete Axial-Leaded Components
.............
1-8
Component Mounting Site
...........................
1-5
4.2 Discrete Radial-Leaded Components
...........
1-8
Conductive Pattern
.......................................
1-5
4.3 Chip Components
.........................................
1-8
Conductor
......................................................
1-5
4.4
Multileaded-Radial Components
..................
1-8
Constraining Core
.........................................
1-5
4.5 Small Outline Components
..........................
1-8
Double-Sided Assembly
...............................
1-5
4.6 In-Line-Lead Components
............................
1-8
Dual Inline Package (DIP)
...........................
1-5
4.7 Multiple-Ribbon-Lead Components
.............
1-8
Flat Pack
.......................................................
1-6 4.9
Pin Grid Arrays 1-8
Edge Board Connector
.................................
1-5
4.8 Chip Carriers
.................................................
1-8
.............................................
Footprint
........................................................
1-6 4.10 Unpackaged Semiconductors
.......................
1-8
Grid
...............................................................
1-6 4.11
Connectors
....................................................
1-8
Integrated Circuit (IC)
..................................
1-6 4.12
Sockets
..........................................................
1-8
Jumper Wire
..................................................
1-6 4.13 Electromechanical and Interconnect
Land
..............................................................
1-6
Components 1-8
..................................................
Land Pattern 1-6
4.14 Packaging and Interconnecting
..................................................
Printed Board) Structures
............................
1-9
Lead Projection
1-6
Leadless Chip Carrier 1-6
Leaded Chip Carrier
.....................................
1-6
4.15
.............................................
...............................................................
TAB 1-9
...................................
4.16 Pad Grid Arrays
............................................
1-9
3.27 Master Drawing
............................................
1-6
i
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services