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IPC-CM-770 Januaty 1996 Table of Contents . Section 3 12.4 Mixed Technology ...................................... 3-22 Manual Assembly ....................................... 3-22 12.6 Automated Assembly ...............…

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Januaw
1996
IPC-CM-770
Table
of
Contents
.
Section
2
Figure 5- 1
O
5.0
AXIAL-LEADED DISCRETE COMPONENTS
.........
2-1
FiPure 5-11
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
u
Part Type Description
...................................
2-1
Figure
5-12
Through-Hole Mounting
...............................
2-1
Figure
5-13
Mixed Technology
........................................
2-4
Figure
5-15
Manual Assembly
.........................................
2-5
Figure
6-1
Automated Assembly
....................................
2-5
Figure
6-2
Handling and Storage
...................................
2-5
Figure
6-3
Soldering
.......................................................
2-5
Figure 6-4
Cleaning
........................................................
2-5
Figure 6-5
Conformal Coating
.......................................
2-5
Figure
6-6
Quality Assurance
.........................................
2-5
Figure 6-7
Surface Mounting
.........................................
2-4
Figure
5-14
6.0
RADIAL-LEADED DISCRETE COMPONENTS
......
2-5
6.1 Part Type Description
...................................
2-5
Figure 6-8
6.2 Through-Hole Mounting
...............................
2-5
Figure
6-9
6.3 Surface Mounting
.........................................
2-8
6.4 Mixed Technology
........................................
2-8
Figure 6-10
6.5 Manual Assembly
.........................................
2-8
6.6 Automated Assembly
....................................
2-8
6.7 Handling and Storage
...................................
2-8
6.8 Soldering
.......................................................
2-8
6.9
Figure 7-3
Cleaning
........................................................
2-8
Figure 7-4
6.10 Conformal Coating
.......................................
2-8
Figure
7-5
Figure 7-1
Figure 7-2
Combination Preformed Leads
..................................
2-3
Components Mounted Over Conductors
...................
2-4
Alignmenthoundaries
................................................
2-4
Horizontally Mounted Components
..........................
2-4
Clearance
....................................................................
2-5
Vertical Mounted Axial Lead Components
...............
2-6
Rectangular Radial Lead Capacitors
.........................
2-6
Round Radial Lead Capacitor
...................................
2-6
Cast Radial Lead Capacitor
.......................................
2-6
Radial-leaded
“TO-3”
Transistor Can
......................
2-6
Stress Relief Leads
....................................................
2-7
Vertical Mounted Radial-lead Components
..............
2-7
Vertical Mounted Components Coating
Extension
....................................................................
2-7
Radial Components Mounting
(Unsupported Holes)
..................................................
2-7
Horizontal Mounting of Radial Leaded
Component
.................................................................
2-8
Metal Power-package Transistor Mounted on
Resilient Standoffs
.....................................................
2-8
Typical Rectangular Chip Resistor
............................
2-9
Common Configurations of Rectangular
Capacitors
...................................................................
2-9
Cylindrical/rectangular Terminations
........................
2-9
A Chip Inductor
.......................................................
2-10
Typical Surface Mount Inductor
.............................
2-10
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 5-6
Figure 5-7
Figure 5-8
Figure 5-9
Through-Hole Mounting
.............................
2-
10
Surface Mounting
.......................................
2-
10
Mixed Technology
......................................
2-1
1
Manual Assembly
.......................................
2-1
1
Automated Assembly
..................................
2-1
1
Handling and Storage
.................................
2-12
Soldering
.....................................................
2-12
Cleaning
......................................................
2-12
Conformal Coating
.....................................
2-12
Figures
Axial-leaded Component
...........................................
2-1
Taped Axial-leaded Components
...............................
2-1
Polarized Axial Lead Component
.............................
2-1
....................................................................................
2-1
Lead Diameter Versus Bend Radius
.........................
2-2
Lead Stress Relief Examples
.....................................
2-2
Simple-offset Preformed Leads
.................................
2-2
Dimple Preformed Leads
...........................................
2-2
Compound Preformed Leads
.....................................
2-3
...
111
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COPYRIGHT Association Connecting Electronics Industries
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IPC-CM-770
Januaty
1996
Table
of
Contents
.
Section
3
12.4 Mixed Technology
......................................
3-22
Manual Assembly
.......................................
3-22
12.6 Automated Assembly
..................................
3-22
12.7 Handling and Storage
.................................
3-22
12.8 Soldering
.....................................................
3-22
12.9 Cleaning
......................................................
3-23
8.0
MULTIPLE-RADIAL-LEAD COMPONENTS
............
3-1 12.5
8.1 Part Type Description
...................................
3-1
8.3 Surface Mounting
.........................................
3-4
8.4 Mixed Technology
........................................
3-4
8.5 Manual Assembly
.........................................
3-4
8.6 Automated Assembly
....................................
3-4
8.7 Handling and Storage
...................................
3-5
12.10 Conformal Coating
.....................................
3-23
8.8 Soldering
.......................................................
3-5
l3mo
AREA
ARRAY
............................
3-23
8.10 Conformal coating
.......................................
3-5 13.2
.......................
8.9 Cleaning
........................................................
3-5
13.1 Pin Grid Array Components 3-23
Surface Mount Area Arrays 3-24
.......................
9.0
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10
SMALL OUTLINE COMPONENTS
..........................
3-5
Part Type Description
...................................
3-5
Through-Hole Mounting
...............................
3-6
Surface Mounting
.........................................
3-6
Mixed Technology
........................................
3-6
Manual Assembly
.........................................
3-6
Automated Assembly
....................................
3-6
Handling and Storage
...................................
3-6
Soldering
.......................................................
3-6
Cleaning
........................................................
3-6
Conformal Coating
.......................................
3-6
10.0
INLINE-LEAD COMPONENTS
..............................
3-6
10.2 Through-Hole Mounting
...............................
3-7
10.3 Surface Mounting
.........................................
3-9
10.4 Mixed Technology
......................................
3-10
10.5
Manual Assembly
.......................................
3-10
10.6 Automated Assembly
..................................
3-10
10.7 Soldering
.....................................................
3-11
10.8 Cleaning
......................................................
3-11
10.9 Conformal Coating
.....................................
3-11
11.0
RIBBON-LEAD COMPONENTS
..........................
3-11
11.1
Part Type Descriptions
................................
3-11
11.2 Through-Hole Mounting
.............................
3-12
11.3 Surface Mounting
.......................................
3-14
11.4 Mixed Technology
......................................
3-16
11.5
Manual Assembly
.......................................
3-16
11.6 Automated Assembly
..................................
3-16
11.7 Handling and Storage
.................................
3-16
11.8 Soldering
.....................................................
3
-
1
6
11.10
Conformal Coating
.....................................
3-16
11.9 Cleaning
......................................................
3-16
14.0
14.1
14.4
14.5
14.6
14.7
14.8
14.9
14.10
UNPACKAGED SEMICONDUCTOR
COMPONENTS
...................................................
3-26
Part Type Description
.................................
3-26
Mixed Technology
......................................
3-30
Manual Assembly
.......................................
3-30
Automated Assembly
..................................
3-30
Handling and Storage
.................................
3-30
Soldering
.....................................................
3-30
Cleaning
......................................................
3-30
Coatings
......................................................
3-31
Figures
Figure 8-1 Multiple-lead Variable Resistor
.................................
3-1
Figure 8-2 “TO” Can Lead Forming
..........................................
3-1
Figure 8-3 Dimple Preformed Leads
...........................................
3-1
Figure 8-4
Typical
TO-100
Can Layout (Inches Only)
..............
3-2
Figure 8-5 Typical Mounting Pattern for 10-lead Cans With
Clinched Leads
..........................................................
3-2
Figure 8-6 Typical Mounting Pattern for 12-lead Cans with
Clinched Leads Mounting
.........................................
3-2
Figure 8-7 Straight-through Lead. Unclinched Can
...................
3-3
Figure 8-8
Figure 8-9
Figure 8-10
Figure 8-11
Figure 8-12
Figure 8-13
Figure 8-14
Figure 8-15
Figure 8-16
Figure 9-1
Figure 9-2
Offset Lead Can Mounting
........................................
3-3
Transistor Mounting (Unsupported Holes)
...............
3-3
Transistor Mounting (with Spacer)
...........................
3-3
Can Mounting Spreader
.............................................
3-3
Horizontal “TO” Mounting
......................................
3-4
Transistor Can Horizontal Mounting
........................
3-4
Mechanically Secured Transistor
..............................
3-4
Transistor Assembly Tools
........................................
3-5
Taping Specifications (Only Inches Shown)
.............
3-5
SO-16 Package Drawings Typical
Dimension
..................................................................
3-6
Typical SOT Packages
...............................................
3-7
12.0
CHIP CARRIERS
..................................................
3-16
Figure 10-1
16-Lead DIP
...............................................................
3-8
12.1 Part Type Descriptions
...............................
3-17
Figure 10-2
Single In-line Component
.........................................
3-8
12.2 Through-Hole Mounting
.............................
3-20
Figure 10-3
A Typical Dual In-line Layout
..................................
3-8
12.3 Surface Mounting
.......................................
3-20
Figure 10-4
Lead Configuration (After Assembly)
.......................
3-8
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January
1996
IPC-CM-770
Figure 10-5
Figure 10-6
Figure 10-7
Figure 10-8
Figure 10-9
Figure 10-10
Figure 10-11
Figure 11-1
Figure 11-2
Figure 11-3
Figure 11-4
Figure 11-5
Figure 11-6
Figure 11-7
Figure 11-8
Figure 11-9
Figure 11-10
Figure 11-1 1
Figure 11-12
Figure 11-13
Figure 11-14
Figure 11-15
Figure 12-1
Figure 12-2
Figure 12-3
Figure 12-4
Figure 12-5
Figure 12-6
Figure 13-1
Figure 13-2
Figure 13-3
Figure 13-4
Figure 14-1
Figure 14-2
Figure 14-3
Figure 14-4
Resilient Spacer to Heat Sink Frame
........................
3-9
Modifying DIP for Surface Mounting
......................
3-9
Gull-Wing Lead for SIP-type Component
................
3-9
Dual-in-line Package Gripping Tools
......................
3-10
DIP Clearances
.........................................................
3-10
DIP Layout in Rows and Columns
.........................
3-11
DIP Slide Magazines
...............................................
3-11
Flatpack Outline Drawing
.......................................
3-12
Quad Pack Configuration
........................................
3-12
Typical Ribbon Leaded Discrete Device
Outline Drawing
......................................................
3-13
Staggered Hole Pattern Mounting
.
“MO” Flatpack
Outline Drawing (Only Inches Shown)
..................
3-13
Through-hole Mounting
.
“MO” Flatpack
Outline Drawing
......................................................
3-13
Through-the-board board Mounting with
Unclinched Leads
....................................................
3-13
Through-the-board Mounting with Clinched
Leads and Circumscribing Land
.............................
3-14
Through-the-board Mounting with Offset Land
.....
3-14
Lead Bending Requirements for Surface
Mounting
..................................................................
3-14
Surface-mounted Flatpacks
.....................................
3-15
Typical Surface Land Flatpack Mounting
..............
3-15
Minimum Planar Lead Contact
...............................
3-15
Axial Alignment
.......................................................
3-15
Lead Extension
........................................................
3-16
Welded Configurations
............................................
3-16
The 50-mil Center JEDEC Packages
......................
3-18
Features Common to the 50-mil Center
Packages
...................................................................
3-18
Type A (Leaded Type B)
.........................................
3-19
Criteria for Lead Attachment to Leadless
Double Row Plastic Chip Carrier
...........................
3-21
Criteria for Lead Attachment to Leadless
Type A (Leaded Type B)
.........................................
3-21
Land Pattern for Type A Leaded Chip Carrier
Mounting
..................................................................
3-22
149 Pin Array Package
............................................
3-23
I/O
Density Versus Lead Count (All Dimensions
in Inches)
.................................................................
3-24
Zero Insertion Force Socket
....................................
3-24
Ball Grid Array Package Outline
............................
3-27
Packaging and Assembling Integrated Circuits
......
3-28
Face-down Bonding Concepts
.................................
3-28
Beam-lead Transistor
...............................................
3-29
Wire Bonding Layout Features
..............................
3-30
Tables
Table 12-1 Chip Carrier Application Considerations
...................
3-17
Table 12-2 JEDEC Ceramic Sizes and Fine Pitch
Terminal Counts
.........................................................
3-19
Table 12-3 JEDEC Designations
..................................................
3-20
Table 13-1 Variations in BGA Package Sizes
..............................
3-25
Table 13-2 BGA Solder Sphere Dimensions and Package
Coplanarity
..................................................................
3-26
Table 14-1 Various Chip Bonding Adhesive Types
.....................
3-29
Table 14-2 Wire Bonding Feature Limits (see Figure 14-4)
.......
3-29
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