IPC-CM-770D-1996.pdf - 第6页
IPC-CM-770 Januaty 1996 Figures Figure 1-1 Electronic Assembly Types ....................................... 1-3 11 COPYRIGHT Association Connecting Electronics Industries Licensed by Information Handling Services COPYRI…
January
1996
IPC-CM-770
Table
of
Contents
.
Section
1
3.28 Mixed Component-Mounting Technology
...
1-6
3.29 Module
..........................................................
1-6
3.30 Mounting Hole
..............................................
1-6
3.3
1
Packaging and Interconnecting
1.3.1 Performance Classifications
.........................
1-1
3.32
Packaging and Interconnecting
1.4 Assembly Types
............................................
1-2
Structure @&IS) 1-6
1.5
Presentation
...................................................
1-2 3.33
Plated-Through Hole (PTH) 1-6
3.35 Printed Board 1-6
1.0
INTRODUCTION
.......................................................
1-1
1.1
Scope
.............................................................
1-1
1.2 Purpose
..........................................................
1-1
1.3 Producibility Levels
......................................
1
.
1
Assembly (P&IA) 1-6
.........................................
...........................................
.........................
3.34 Primary Side
.................................................
1-6
2.0
REFERENCE DOCUMENTS
....................................
1-2
2.1 Institute for Interconnecting and Packaging
3.36 Printed Board Assembly
...............................
1-6
2.2 Joint Industry Standards
...............................
1-3
3.37 Printed Wiring 1-6
2.3 Department
of
Defense
.................................
1-4
3.39 Register Marker 1-6
2.5 American National Standards Institute
........
1-4
2.6 Underwriters Laboratories
............................
1-4
................................................
Electronic Circuits (IPC) 1-2
..............................
...............................................
.........................................
3.38 Production Master 1-6
............................................
2.4 Electronic Industries Association
.................
1-4
...................................................
3.40 Registration 1-6
3.41 Secondary Side 1-6
3.42 Single In-Line Package (SIP) 1-6
.............................................
.......................
2.7 American Society for Testing and
Materials 1-4 3.43
.................................
.......................................................
Single-Sided Assembly 1-6
2.8
3
.O
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3
.
8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
3.26
Other Documents
..........................................
1-4 3.44
3.45
3.46
3.47
3.48
3.49
3.50
3.5
1
3.52
3.53
TERMS AND DEFINITIONS
.....................................
1-4
Assembly
.......................................................
1-5
Base Material
................................................
1-5
Castellations
..................................................
1-5
Chip Carrier
..................................................
1-5
Clinched Leads
.............................................
1-5
Coefficient of Thermal Expansion (CTE)
1-5
Coefficient of Thermal Expansion
Mismatch (CTE)
1-5
....
...........................................
Static Electricity
...........................................
Static Electricity Control
..............................
Supporting Plane
...........................................
Supported Hole
.............................................
Surface Mounting
.........................................
Thermal Expansion Mismatch
.....................
Through Connection
.....................................
Tooling Feature
.............................................
Unsupported Hole
.........................................
Via Hole
........................................................
1-6
1-6
1-7
1-7
1-7
1-7
1-7
1-7
1-7
1-7
Component
....................................................
1-5
4.0
COMPONENT
TYPE
................................................
1-7
Component Lead Hole
.................................
1-5
4.1 Discrete Axial-Leaded Components
.............
1-8
Component Mounting Site
...........................
1-5
4.2 Discrete Radial-Leaded Components
...........
1-8
Conductive Pattern
.......................................
1-5
4.3 Chip Components
.........................................
1-8
Conductor
......................................................
1-5
4.4
Multileaded-Radial Components
..................
1-8
Constraining Core
.........................................
1-5
4.5 Small Outline Components
..........................
1-8
Double-Sided Assembly
...............................
1-5
4.6 In-Line-Lead Components
............................
1-8
Dual Inline Package (DIP)
...........................
1-5
4.7 Multiple-Ribbon-Lead Components
.............
1-8
Flat Pack
.......................................................
1-6 4.9
Pin Grid Arrays 1-8
Edge Board Connector
.................................
1-5
4.8 Chip Carriers
.................................................
1-8
.............................................
Footprint
........................................................
1-6 4.10 Unpackaged Semiconductors
.......................
1-8
Grid
...............................................................
1-6 4.11
Connectors
....................................................
1-8
Integrated Circuit (IC)
..................................
1-6 4.12
Sockets
..........................................................
1-8
Jumper Wire
..................................................
1-6 4.13 Electromechanical and Interconnect
Land
..............................................................
1-6
Components 1-8
..................................................
Land Pattern 1-6
4.14 Packaging and Interconnecting
..................................................
Printed Board) Structures
............................
1-9
Lead Projection
1-6
Leadless Chip Carrier 1-6
Leaded Chip Carrier
.....................................
1-6
4.15
.............................................
...............................................................
TAB 1-9
...................................
4.16 Pad Grid Arrays
............................................
1-9
3.27 Master Drawing
............................................
1-6
i
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
IPC-CM-770
Januaty
1996
Figures
Figure
1-1
Electronic Assembly Types
.......................................
1-3
11
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
Januaw
1996
IPC-CM-770
Table
of
Contents
.
Section
2
Figure 5- 1
O
5.0
AXIAL-LEADED DISCRETE COMPONENTS
.........
2-1
FiPure 5-11
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
u
Part Type Description
...................................
2-1
Figure
5-12
Through-Hole Mounting
...............................
2-1
Figure
5-13
Mixed Technology
........................................
2-4
Figure
5-15
Manual Assembly
.........................................
2-5
Figure
6-1
Automated Assembly
....................................
2-5
Figure
6-2
Handling and Storage
...................................
2-5
Figure
6-3
Soldering
.......................................................
2-5
Figure 6-4
Cleaning
........................................................
2-5
Figure 6-5
Conformal Coating
.......................................
2-5
Figure
6-6
Quality Assurance
.........................................
2-5
Figure 6-7
Surface Mounting
.........................................
2-4
Figure
5-14
6.0
RADIAL-LEADED DISCRETE COMPONENTS
......
2-5
6.1 Part Type Description
...................................
2-5
Figure 6-8
6.2 Through-Hole Mounting
...............................
2-5
Figure
6-9
6.3 Surface Mounting
.........................................
2-8
6.4 Mixed Technology
........................................
2-8
Figure 6-10
6.5 Manual Assembly
.........................................
2-8
6.6 Automated Assembly
....................................
2-8
6.7 Handling and Storage
...................................
2-8
6.8 Soldering
.......................................................
2-8
6.9
Figure 7-3
Cleaning
........................................................
2-8
Figure 7-4
6.10 Conformal Coating
.......................................
2-8
Figure
7-5
Figure 7-1
Figure 7-2
Combination Preformed Leads
..................................
2-3
Components Mounted Over Conductors
...................
2-4
Alignmenthoundaries
................................................
2-4
Horizontally Mounted Components
..........................
2-4
Clearance
....................................................................
2-5
Vertical Mounted Axial Lead Components
...............
2-6
Rectangular Radial Lead Capacitors
.........................
2-6
Round Radial Lead Capacitor
...................................
2-6
Cast Radial Lead Capacitor
.......................................
2-6
Radial-leaded
“TO-3”
Transistor Can
......................
2-6
Stress Relief Leads
....................................................
2-7
Vertical Mounted Radial-lead Components
..............
2-7
Vertical Mounted Components Coating
Extension
....................................................................
2-7
Radial Components Mounting
(Unsupported Holes)
..................................................
2-7
Horizontal Mounting of Radial Leaded
Component
.................................................................
2-8
Metal Power-package Transistor Mounted on
Resilient Standoffs
.....................................................
2-8
Typical Rectangular Chip Resistor
............................
2-9
Common Configurations of Rectangular
Capacitors
...................................................................
2-9
Cylindrical/rectangular Terminations
........................
2-9
A Chip Inductor
.......................................................
2-10
Typical Surface Mount Inductor
.............................
2-10
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 5-6
Figure 5-7
Figure 5-8
Figure 5-9
Through-Hole Mounting
.............................
2-
10
Surface Mounting
.......................................
2-
10
Mixed Technology
......................................
2-1
1
Manual Assembly
.......................................
2-1
1
Automated Assembly
..................................
2-1
1
Handling and Storage
.................................
2-12
Soldering
.....................................................
2-12
Cleaning
......................................................
2-12
Conformal Coating
.....................................
2-12
Figures
Axial-leaded Component
...........................................
2-1
Taped Axial-leaded Components
...............................
2-1
Polarized Axial Lead Component
.............................
2-1
....................................................................................
2-1
Lead Diameter Versus Bend Radius
.........................
2-2
Lead Stress Relief Examples
.....................................
2-2
Simple-offset Preformed Leads
.................................
2-2
Dimple Preformed Leads
...........................................
2-2
Compound Preformed Leads
.....................................
2-3
...
111
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services
COPYRIGHT Association Connecting Electronics Industries
Licensed by Information Handling Services