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5 Placement Heads 5.1 CPP Head Technical Training SIPLACE TX-Series 10/2016 63 Automatic head offset correction (TX micron only) ● The PCB camera centers the fiducial after clamping to determine the exact position of the…

5 Placement Heads

5.1 CPP Head

62 Technical Training SIPLACE TX-Series 10/2016

Pick Up Workflow detailed

Holding circuit of each segment is switched on via the valve board, just before pickup is performed.

Since the travel paths for each axis can be calculated, the next action (e.g. starting the Z Axis) is

started via position flags.

For example: The Z Axis to start moving down 10ms earlier before end signals from Star Axis.

5 Placement Heads

5.1 CPP Head

Technical Training SIPLACE TX-Series 10/2016 63

Automatic head offset correction (TX micron only)

●

The PCB camera centers the fiducial after

clamping to determine the exact position of

the board.

●

Max. 12 components will be picked up.

Components are then centered under the

component camera.

●

Automatic head offset correction:

– 25µm @ 3σ:

Every 60 min. 3 fiducial marks on the

Xfiducial bar are checked.

– 20µm @ 3σ:

Every 60 min. all fiducial marks on the

Xfiducial bar are checked.

– 15µm @ 3σ: Every 40 min. :

- The head offset is checked using the

calibration tool on the Xfiducial bar.

- All fiducial marks on the Xfiducial bar

are checked.

- All fiducial marks on the Yfiducial bar

on the vacuum tooling are checked.

– 25/20/15µm @ 3σ:

Every 5 min. the head offsets are

calculated using the components of the

current job.

●

Place components on PCB according to

the program.

NOTICE

Calibration nozzles

For TX micron machines in every nozzle changer at least 1 calibration nozzle (2057) has to

be setup.

In both calibration pockets a calibration tool must be available.

This is necessary to ensure that the automatic head offset correction can take place.

5 Placement Heads

5.1 CPP Head

64 Technical Training SIPLACE TX-Series 10/2016

5.1.3.3 Standard Placement Workflow

Standard Placement

In this mode (light barrier down) the placement force at the CPP Head is around 2.6N.

During the production, a nozzle scanning run is performed after 350 head cycles (can be set by

SIPLACE service if required) and after the completion of the board currently processed.

The nozzle quality check can be configured in four different levels via the station interface: State

overview, Vakuum values, Hight values, Scan values.

Pick Up Procedure

With early vacuum move to pick up position the vacuum generator switches the vacuum on before

the Z Axis moves down.

"Contactless": The first component is picked up with standard mode to determine the Z Axis down

position, the picked component is rejected. The next components are picked up with the absolute

position of Z Axis down.