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User’ s Manual SIPLACE Line Computer UNIX Software V ersion 401.xx Edition 10/95 17 - II
16 MaDaMaS User’s Manual Line Computer UNIX
16.2 MaDaMaS Evaluation User Interface Software Version 402.xx Edition 06/96
16 - 34
User’s Manual SIPLACE Line Computer UNIX
Software Version 401.xx Edition 10/95
17 - II
User’s Manual SIPLACE Line Computer UNIX
Software Version 402.xx Edition 6/96
17 - I
Practical Tips on Using the LC UNIX
Table of Contents
Page
17.1 Introduction................................................................................................................................. 17 - 1
17.1.1 From the Placement Program to the Assembly - Overview........................................... 17 - 2
17.2 Description of Components and PCBs..................................................................................... 17 - 3
17.2.1 PCB 1: single circuit ...................................................................................................... 17 - 3
17.2.1.1 Package Form Description............................................................................................ 17 - 5
17.2.1.2 Component Description................................................................................................. 17 - 5
17.2.1.3 Adhesive Pattern (DM) Description............................................................................... 17 - 5
17.2.1.4 PCB Description............................................................................................................ 17 - 5
17.2.2 PCB 2: Focus on Package Form Description.............................................................. 17 - 10
17.2.2.1 Package Form Description.......................................................................................... 17 - 13
17.2.2.2 Component Description............................................................................................... 17 - 23
17.2.2.3 Adhesive Pattern Description...................................................................................... 17 - 25
17.2.2.4 PCB Description.......................................................................................................... 17 - 25
17.2.3 PCB 3: Focus on Cluster Technique........................................................................... 17 - 31
17.2.3.1 Package form description............................................................................................ 17 - 33
17.2.3.2 Component description................................................................................................ 17 - 33
17.2.3.3 Adhesive pattern description....................................................................................... 17 - 33
17.2.3.4 PCB description........................................................................................................... 17 - 33
17.3 Set-Up Optimization ................................................................................................................. 17 - 42
17.3.1 Lot Handling ................................................................................................................ 17 - 42
17.3.2 Automatic Set-Up Generation...................................................................................... 17 - 44
17.3.3 Manual Set-Up Adjustment.......................................................................................... 17 - 46
17.4 Line Control............................................................................................................................... 17 - 52